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公开(公告)号：US20080006303A1
公开(公告)日：2008-01-10
申请号：US11825508
申请日：2007-07-06
IPC分类号： B08B3/00
CPC分类号： B08B3/02 , B05B7/0853 , H01L21/02052 , H01L21/67051
摘要： Particles are removed from a surface of a substrate by a method comprising causing liquid aerosol droplets comprising water and a tensioactive compound to contact the surface with sufficient force to remove particles from the surface.
摘要翻译： 通过包括使包含水和张力活性化合物的液体气雾剂液滴以足够的力与表面接触以从表面除去颗粒的方法从基材表面除去颗粒。
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公开(公告)号：US20110180114A1
公开(公告)日：2011-07-28
申请号：US13082676
申请日：2011-04-08
CPC分类号： B08B3/02 , B05B7/0853 , H01L21/02052 , H01L21/67051
摘要： Particles are removed from a surface of a substrate by a method comprising causing liquid aerosol droplets comprising water and a tensioactive compound to contact the surface with sufficient force to remove particles from the surface.
摘要翻译： 通过包括使包含水和张力活性化合物的液体气雾剂液滴以足够的力与表面接触以从表面除去颗粒的方法从基材表面除去颗粒。
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3.发明授权Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation 有权使用易于在打开和关闭操作模式之间转换的处理室设计来处理微电子工件的工具和方法公开(公告)号：US08684015B2
公开(公告)日：2014-04-01
申请号：US13548489
申请日：2012-07-13
CPC分类号： H01L21/67017 , Y10S134/902 , Y10T137/0363 , Y10T137/2599
摘要： Strategies for tool designs and their uses wherein the tools can operate in either closed or open modes of operation. The tools easily transition between open and closed modes on demand. According to one general strategy, environmentally controlled pathway(s) couple the ambient to one or more process chambers. Air amplification capabilities upstream from the process chamber(s) allow substantial flows of air to be introduced into the process chamber(s) on demand. Alternatively, the fluid pathways are easily closed, such as by simple valve actuation, to block egress to the ambient through these pathways. Alternative flows of nonambient fluids can then be introduced into the process chamber(s) via pathways that are at least partially in common with the pathways used for ambient air introduction. In other strategies, gap(s) between moveable components are sealed at least with flowing gas curtains rather than by relying only upon direct physical contact for sealing.
摘要翻译： 工具设计及其用途的策略，其中工具可以以闭合或开放的操作模式运行。 这些工具可以根据需要轻松地在开放和关闭模式之间转换。 根据一个总体策略，环境控制的路径将环境耦合到一个或多个处理室。 来自处理室上游的空气放大能力允许根据需要将大量的空气流引入处理室。 或者，流体路径容易关闭，例如通过简单的阀门致动，以阻止通过这些路径流出到环境中。 然后通过至少部分地与用于环境空气引入的路径共同的路径将非流体的替代流引入加工室。 在其他策略中，可移动部件之间的间隙至少与流动的气帘密封，而不是仅依靠直接的物理接触进行密封。
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4.发明申请Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation 有权使用易于在打开和关闭操作模式之间转换的处理室设计来处理微电子工件的工具和方法公开(公告)号：US20090280235A1
公开(公告)日：2009-11-12
申请号：US12387607
申请日：2009-05-05
CPC分类号： H01L21/67017 , Y10S134/902 , Y10T137/0363 , Y10T137/2599
摘要： Strategies for tool designs and their uses wherein the tools can operate in either closed or open modes of operation. The tools easily transition between open and closed modes on demand. According to one general strategy, environmentally controlled pathway(s) couple the ambient to one or more process chambers. Air amplification capabilities upstream from the process chamber(s) allow substantial flows of air to be introduced into the process chamber(s) on demand. Alternatively, the fluid pathways are easily closed, such as by simple valve actuation, to block egress to the ambient through these pathways. Alternative flows of nonambient fluids can then be introduced into the process chamber(s) via pathways that are at least partially in common with the pathways used for ambient air introduction. In other strategies, gap(s) between moveable components are sealed at least with flowing gas curtains rather than by relying only upon direct physical contact for sealing.
摘要翻译： 工具设计及其用途的策略，其中工具可以以闭合或开放的操作模式运行。 这些工具可以根据需要轻松地在开放和关闭模式之间转换。 根据一个总体策略，环境控制的路径将环境耦合到一个或多个处理室。 来自处理室上游的空气放大能力允许根据需要将大量的空气流引入处理室。 或者，流体路径容易关闭，例如通过简单的阀门致动，以阻止通过这些路径流出到环境中。 然后通过至少部分地与用于环境空气引入的路径共同的路径将非流体的替代流引入加工室。 在其他策略中，可移动部件之间的间隙至少与流动的气帘密封，而不是仅依靠直接的物理接触进行密封。
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公开(公告)号：US08387635B2
公开(公告)日：2013-03-05
申请号：US11820709
申请日：2007-06-20
申请人： Jimmy D. Collins , David DeKraker , Tracy A. Gast , Alan D. Rose
发明人： Jimmy D. Collins , David DeKraker , Tracy A. Gast , Alan D. Rose
IPC分类号： B08B3/02
CPC分类号： H01L21/67051
摘要： The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.
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6.发明授权Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas enviroment including a drying enhancement substance 有权在包括干燥增强物质的气体环境中利用冷冲洗流体漂洗微电子基底的方法公开(公告)号：US08070884B2
公开(公告)日：2011-12-06
申请号：US11096935
申请日：2005-04-01
申请人： Tracy A. Gast
发明人： Tracy A. Gast
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , H01L21/02063 , H01L21/67034
摘要： Rinsing and drying a surface of a microelectronic device and the enhanced removal of rinse fluid from the surface of the microelectronic device while the microelectronic device is rotated is provided as part of a spray processing operation. Rinse fluid is generally directed to the surface of the microelectronic device by a dispensing device while one or more such microelectronic devices are supported on a turntable in a generally horizontal fashion. Drying gas is supplied after the rinsing step. During at least a portion of both rinsing and drying steps, a drying enhancement substance, such as IPA, is delivered to enhance the rinsing and drying. Particle counts and evaporation thicknesses are reduced by delivering a tensioactive compound like IPA, during at least portions of the rinsing and drying steps while a microelectronic device is controllably rotated. The tensioactive compound is preferably delivered into the processing chamber during rinsing and drying and rinse fluid, preferably DI water, is preferably dispensed to the microelectronic device surface at a temperature below the dew point of the tensioactive compound. Moreover, the rotational speeds of the microelectronic device during drying and the tensioactive compound delivery concentration, timing and duration are preferably optimized to achieve further reduced particle counts and evaporation thicknesses.
摘要翻译： 作为喷雾处理操作的一部分，提供微电子装置的表面的冲洗和干燥以及微电子器件旋转时从微电子器件的表面增强的清洗流体的去除。 冲洗流体通常通过分配装置引导到微电子器件的表面，而一个或多个这样的微电子器件以大致水平的方式支撑在转台上。 在漂洗步骤之后提供干燥气体。 在漂洗和干燥步骤的至少一部分期间，输送干燥增强物质如IPA，以增强漂洗和干燥。 在微电子器件可控地旋转的过程中，在冲洗和干燥步骤的至少部分期间，通过递送诸如IPA的张力活性化合物来减少颗粒计数和蒸发厚度。 在漂洗和干燥期间，优选将张力活性化合物输送到处理室中，并且优选将去离子水（优选去离子水）在低于该张力活性化合物的露点的温度下分配到微电子器件表面。 此外，微电子器件在干燥过程中的旋转速度和张力化合物输送浓度，时间和持续时间优选地被优化以实现进一步减少的颗粒计数和蒸发厚度。
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7.发明申请TOOLS AND METHODS FOR PROCESSING MICROELECTRONIC WORKPIECES USING PROCESS CHAMBER DESIGNS THAT EASILY TRANSITION BETWEEN OPEN AND CLOSED MODES OF OPERATION 有权使用过程设计的微电子工作处理工具和方法，在开放和关闭操作模式之间轻松过渡公开(公告)号：US20120272893A1
公开(公告)日：2012-11-01
申请号：US13548489
申请日：2012-07-13
IPC分类号： C23C14/02
CPC分类号： H01L21/67017 , Y10S134/902 , Y10T137/0363 , Y10T137/2599
摘要： Strategies for tool designs and their uses wherein the tools can operate in either closed or open modes of operation. The tools easily transition between open and closed modes on demand. According to one general strategy, environmentally controlled pathway(s) couple the ambient to one or more process chambers. Air amplification capabilities upstream from the process chamber(s) allow substantial flows of air to be introduced into the process chamber(s) on demand. Alternatively, the fluid pathways are easily closed, such as by simple valve actuation, to block egress to the ambient through these pathways. Alternative flows of nonambient fluids can then be introduced into the process chamber(s) via pathways that are at least partially in common with the pathways used for ambient air introduction. In other strategies, gap(s) between moveable components are sealed at least with flowing gas curtains rather than by relying only upon direct physical contact for sealing.
摘要翻译： 工具设计及其用途的策略，其中工具可以以闭合或开放的操作模式运行。 这些工具可以根据需要轻松地在开放和关闭模式之间转换。 根据一个总体策略，环境控制的路径将环境耦合到一个或多个处理室。 来自处理室上游的空气放大能力允许根据需要将大量的空气流引入处理室。 或者，流体路径容易关闭，例如通过简单的阀门致动，以阻止通过这些路径流出到环境中。 然后通过至少部分地与用于环境空气引入的路径共同的路径将非流体的替代流引入加工室。 在其他策略中，可移动部件之间的间隙至少与流动的气帘密封，而不是仅依靠直接的物理接触进行密封。
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公开(公告)号：US07244315B2
公开(公告)日：2007-07-17
申请号：US10608894
申请日：2003-06-27
IPC分类号： B08B3/00
CPC分类号： B08B3/102 , B08B3/048 , H01L21/67028 , H01L21/67057 , Y10S134/902
摘要： Improved methods of rinsing and drying microelectronic devices by way of an immersion processing apparatus are provided for effectively cleaning microelectronic devices. Methods and arrangements control the separation of one or more microelectronic devices from a liquid environment as part of a replacement of the liquid environment with a gas environment. Cleaning enhancement substance, such as IPA, is introduced into the gas environment according to a controlled profile while the separation step is conducted. The controlled profile being directed to the timing of introduction of cleaning enhancement substance, the concentration of cleaning enhancement substance and/or flow rates thereof into the vessel. Controlled timing of gas and cleaning enhancement substance delivery can also improve effectiveness of separation. Methods and arrangements are also provided for controlling a drying step to be conducted on the one or more microelectronic devices after they have been separated from a liquid environment by replacing the liquid environment with a gas environment. Preferably, an arrangement of gas distribution devices create one or more drying gas curtains, which gas curtains may be controllably directed with respect to a set of microelectronic devices to provide optimal drying of the microelectronic devices after being separating from a liquid.
摘要翻译： 提供了通过浸没处理设备漂洗和干燥微电子器件的改进方法，用于有效地清洁微电子器件。 方法和装置控制一个或多个微电子器件与液体环境的分离，作为用气体环境替代液体环境的一部分。 清洁增强物质，如IPA，在进行分离步骤的同时，根据受控的轮廓引入气体环境。 控制的轮廓涉及引入清洁增强物质的时间，清洁增强物质的浓度和/或其流量进入容器。 气体和清洁增强物质输送的控制时间也可以提高分离的有效性。 还提供了用于控制在一个或多个微电子器件通过用气体环境替换液体环境而与液体环境分离之后进行干燥步骤的方法和装置。 优选地，气体分配装置的布置产生一个或多个干燥气体窗帘，该气帘可以相对于一组微电子装置可控制地引导，以在与液体分离之后提供微电子装置的最佳干燥。
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9.发明授权Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation 有权使用易于在打开和关闭操作模式之间转换的处理室设计来处理微电子工件的工具和方法公开(公告)号：US08235062B2
公开(公告)日：2012-08-07
申请号：US12387607
申请日：2009-05-05
IPC分类号： B05B13/00
CPC分类号： H01L21/67017 , Y10S134/902 , Y10T137/0363 , Y10T137/2599
摘要： Strategies for tool designs and their uses wherein the tools can operate in either closed or open modes of operation. The tools easily transition between open and closed modes on demand. According to one general strategy, environmentally controlled pathway(s) couple the ambient to one or more process chambers. Air amplification capabilities upstream from the process chamber(s) allow substantial flows of air to be introduced into the process chamber(s) on demand. Alternatively, the fluid pathways are easily closed, such as by simple valve actuation, to block egress to the ambient through these pathways. Alternative flows of nonambient fluids can then be introduced into the process chamber(s) via pathways that are at least partially in common with the pathways used for ambient air introduction. In other strategies, gap(s) between moveable components are sealed at least with flowing gas curtains rather than by relying only upon direct physical contact for sealing.
摘要翻译： 工具设计及其用途的策略，其中工具可以以闭合或开放的操作模式运行。 这些工具可以根据需要轻松地在开放和关闭模式之间转换。 根据一个总体策略，环境控制的路径将环境耦合到一个或多个处理室。 来自处理室上游的空气放大能力允许根据需要将大量的空气流引入处理室。 或者，流体路径容易关闭，例如通过简单的阀门致动，以阻止通过这些路径流出到环境中。 然后通过至少部分地与用于环境空气引入的路径共同的路径将非流体的替代流引入加工室。 在其他策略中，可移动部件之间的间隙至少与流动的气帘密封，而不是仅依靠直接的物理接触进行密封。
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10.发明授权Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses 有权用于使用一种或多种处理流体处理微电子工件的工具中的阻挡板和文丘里管容纳系统的冲洗方法以及相关装置公开(公告)号：US07913706B2
公开(公告)日：2011-03-29
申请号：US12220887
申请日：2008-07-29
IPC分类号： B08B3/04
CPC分类号： H01L21/67051
摘要： Tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like. The invention provides an approach for rapid, efficient rinsing of wetted surface(s), and is particularly advantageous when used to rinse the lower surface of moveable barrier structures such as a barrier plate that overlies a workpiece being treated in such a manner to define a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, the liquid is flowingly dispensed, preferably under laminar flow conditions, onto a surface that is in fluid communication with the surface to be rinsed. A smooth, uniform wetting and sheeting action results to accomplish rinsing with a significantly reduced risk of generating particle contamination.
摘要翻译： 用一种或多种处理材料处理微电子工件的工具，包括液体，气体，流化固体，分散体，它们的组合等。 本发明提供了一种用于快速，有效地冲洗湿润表面的方法，并且当用于冲洗可移动阻挡结构的下表面（例如覆盖待处理的工件的阻挡板）的下表面是特别有利的，以限定 工件上的流通通道变细。 不会以产生不适当的飞溅，液滴或雾气的方式将冲洗液体喷淋到表面上，液体优选地在层流条件下流动地分配到与要漂洗的表面流体连通的表面上。 平滑，均匀的润湿和压片动作导致完成冲洗，并显着降低产生颗粒污染的风险。
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