公开(公告)号：US20110279407A1

公开(公告)日：2011-11-17

申请号：US13105301

申请日：2011-05-11

申请人： Ji-Hun KIM ,  Young-Bok Kim ,  Joon-Ho Na ,  Yeong-Shin Jang ,  Sang-Gug Lee

发明人： Ji-Hun KIM ,  Young-Bok Kim ,  Joon-Ho Na ,  Yeong-Shin Jang ,  Sang-Gug Lee

IPC分类号： G06F3/044

CPC分类号： G06F3/044 ,  G01R27/2605

摘要： A circuit for processing a touch line signal of a touch screen includes a plurality of sensing read circuits and a switch unit. The plurality of sensing read circuits include sensing read-out units and integrators, respectively. The sensing read-out units are configured to precharge a first sensor capacitor and a second sensor capacitor formed on a touch screen panel with a ground voltage and a supply voltage, allow charges charged in the first sensor capacitor and the second sensor capacitor to be shared, and read-out a charge sharing result obtained by allowing the charges of the first sensor capacitor and the second sensor capacitor to be shared. The integrators are configured to integrate output voltages of the sensing read-out units. The switch unit is configured to sequentially connect output terminals of the plurality of sensing read circuits to an input terminal of an analog-to-digital converter.

摘要翻译： 用于处理触摸屏的触摸线信号的电路包括多个感测读取电路和开关单元。 多个感测读取电路分别包括感测读出单元和积分器。 感测读出单元被配置为对接地电压和电源电压在触摸屏面板上形成的第一传感器电容器和第二传感器电容器进行预充电，允许在第一传感器电容器和第二传感器电容器中充电的电荷被共享 并且读出通过允许共享第一传感器电容器和第二传感器电容器的电荷而获得的电荷共享结果。 集成器被配置为集成感测读出单元的输出电压。 开关单元被配置为将多个感测读取电路的输出端子顺序地连接到模数转换器的输入端子。

公开(公告)号：US20110128273A1

公开(公告)日：2011-06-02

申请号：US12951745

申请日：2010-11-22

申请人： Hyun-Min SONG ,  Ji-Hun Kim ,  Young-Bok Kim ,  Joon-Ho Na

发明人： Hyun-Min SONG ,  Ji-Hun Kim ,  Young-Bok Kim ,  Joon-Ho Na

IPC分类号： G09G5/00

CPC分类号： G09G3/3685 ,  G09G3/3614 ,  G09G2310/0248 ,  G09G2310/0291 ,  G09G2310/0297 ,  G09G2330/023

摘要： A display panel driving circuit includes: N number of buffers (N is an integer no less than 1) configured to buffer data voltages and enable or disable supply of buffered signals in response to a charge sharing control signal; and N number of output multiplexers each configured to receive outputs of two adjacent buffers among outputs of the N number of buffers and transfer the output of one buffer or the outputs of the two buffers to a corresponding one of data lines in response to the charge sharing control signal.

摘要翻译： 显示面板驱动电路包括：N个缓冲器（N是不小于1的整数），其被配置为缓冲数据电压，并响应于电荷共享控制信号启用或禁止提供缓冲信号; N个输出多路复用器，每个被配置为在N个缓冲器的输出中接收两个相邻缓冲器的输出，并且响应于电荷共享将一个缓冲器的输出或两个缓冲器的输出传送到相应的数据线 控制信号。

公开(公告)号：US20110102410A1

公开(公告)日：2011-05-05

申请号：US12912223

申请日：2010-10-26

申请人： Hyun-Ho CHO ,  Yong-Icc Jung ,  Young-Bok Kim ,  Joon-Ho Na ,  Dae-Seong Kim ,  Dae-Keun Han

发明人： Hyun-Ho CHO ,  Yong-Icc Jung ,  Young-Bok Kim ,  Joon-Ho Na ,  Dae-Seong Kim ,  Dae-Keun Han

IPC分类号： G09G5/00

CPC分类号： G09G3/3291 ,  G09G2300/0819 ,  G09G2320/0285 ,  G09G2320/0295 ,  G09G2320/045

摘要： A circuit for driving an organic light emitting diode display includes a display panel that displays an image by using organic light emitting diodes disposed at intersection areas of a plurality of gate lines and a plurality of data lines; a threshold voltage detection control unit that supplies a precharge voltage by sequentially turning on transistors for threshold voltage detection, which are connected among the data lines and the organic light emitting diodes on the display panel, in units of horizontal lines, and enables threshold voltages to be detected; and a source driver that detects threshold voltages of all organic light emitting diodes arranged on a corresponding horizontal line, and repeats an operation, as necessary, for sampling/holding the detected threshold voltages through M sample/hold circuits, converting the sampled/held threshold voltages into digital signals, and storing the digital signals in a memory.

摘要翻译： 用于驱动有机发光二极管显示器的电路包括：显示面板，其通过使用设置在多条栅极线和多条数据线的交叉区域上的有机发光二极管来显示图像; 阈值电压检测控制单元，其以水平线为单位顺序地接通连接在显示面板上的数据线和有机发光二极管之间的用于阈值电压检测的晶体管，从而提供预充电电压， 被检测到 以及源驱动器，其检测布置在相应的水平线上的所有有机发光二极管的阈值电压，并根据需要重复进行通过M个采样/保持电路采样/保持检测到的阈值电压的操作，转换采样/保持阈值 电压转换为数字信号，并将数字信号存储在存储器中。

公开(公告)号：US08304288B2

公开(公告)日：2012-11-06

申请号：US13155647

申请日：2011-06-08

申请人： Hyuek-Jae Lee ,  Ji-Sun Hong ,  Tae-Je Cho ,  Jong-Yun Myung ,  Young-Bok Kim ,  Hyung-Sun Jang ,  Eun-Mi Kim

发明人： Hyuek-Jae Lee ,  Ji-Sun Hong ,  Tae-Je Cho ,  Jong-Yun Myung ,  Young-Bok Kim ,  Hyung-Sun Jang ,  Eun-Mi Kim

IPC分类号： H01L21/00

CPC分类号： H01L21/76898 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

摘要： A method of packaging a semiconductor device may include providing a semiconductor substrate including first and second spaced apart semiconductor chip areas, and adhering a cover on the first and second spaced apart semiconductor chip areas of the semiconductor substrate. A scribe line may be formed through the semiconductor substrate between the first and second semiconductor chip areas with a semiconductor bridge pattern remaining connected between the first and second spaced apart semiconductor chip areas after forming the scribe line. The cover and the semiconductor bridge pattern may then be cut after forming the scribe line.

摘要翻译： 封装半导体器件的方法可以包括提供包括第一和第二间隔开的半导体芯片区域的半导体衬底，以及将覆盖物粘附在半导体衬底的第一和第二间隔的半导体芯片区域上。 可以在第一和第二半导体芯片区域之间通过半导体衬底形成划线，在形成划线之后，半导体电桥图案保持连接在第一和第二间隔开的半导体芯片区域之间。 然后可以在形成划线之后切割盖和半导体桥模式。

公开(公告)号：US20110306167A1

公开(公告)日：2011-12-15

申请号：US13155647

申请日：2011-06-08

申请人： Hyuek-Jae Lee ,  Ji-Sun Hong ,  Tae-je Cho ,  Jong-Yun Myung ,  Young-Bok Kim ,  Hyung-Sun Jang ,  Eun-Mi Kim

发明人： Hyuek-Jae Lee ,  Ji-Sun Hong ,  Tae-je Cho ,  Jong-Yun Myung ,  Young-Bok Kim ,  Hyung-Sun Jang ,  Eun-Mi Kim

IPC分类号： H01L21/782

CPC分类号： H01L21/76898 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

摘要： A method of packaging a semiconductor device may include providing a semiconductor substrate including first and second spaced apart semiconductor chip areas, and adhering a cover on the first and second spaced apart semiconductor chip areas of the semiconductor substrate. A scribe line may be formed through the semiconductor substrate between the first and second semiconductor chip areas with a semiconductor bridge pattern remaining connected between the first and second spaced apart semiconductor chip areas after forming the scribe line. The cover and the semiconductor bridge pattern may then be cut after forming the scribe line.

摘要翻译： 封装半导体器件的方法可以包括提供包括第一和第二间隔开的半导体芯片区域的半导体衬底，以及将覆盖物粘附在半导体衬底的第一和第二间隔的半导体芯片区域上。 可以在第一和第二半导体芯片区域之间通过半导体衬底形成划线，在形成划线之后，半导体电桥图案保持连接在第一和第二间隔开的半导体芯片区域之间。 然后可以在形成划线之后切割盖和半导体桥模式。

公开(公告)号：US08696959B2

公开(公告)日：2014-04-15

申请号：US12514492

申请日：2007-10-02

申请人： Young-Bok Kim ,  Myung-Ja Kim

发明人： Young-Bok Kim ,  Myung-Ja Kim

IPC分类号： B29C43/02

CPC分类号： C04B28/001 ,  C04B26/02 ,  C04B2111/00456 ,  C04B2111/34 ,  Y02W30/97 ,  C04B18/248 ,  C04B18/26 ,  C04B24/30 ,  C04B40/0028 ,  C04B40/0263 ,  C04B2103/54 ,  C04B14/28 ,  C04B14/30 ,  C04B14/305 ,  C04B14/308 ,  C04B24/281 ,  C04B14/06 ,  C04B14/10 ,  C04B14/106 ,  C04B14/361 ,  C04B18/265 ,  C04B20/0076 ,  C04B40/0071 ,  C04B40/0082

摘要： A method of producing a building material using environment-friendly loess, comprising: preparing an environment-friendly composition by mixing 70˜90 percent by weight of at least one selected from among loess, kaolin, and clay, 3˜23 percent by weight of a resin coating agent, 0.1˜5 percent by weight of an inorganic pigment, and 1˜5 percent by weight of water; and molding the environment-friendly composition at 10 second˜20 minute intervals by introducing it into a molding machine having a temperature of 80˜140° C. and an internal pressure of 1˜20 kg/cm2.

摘要翻译： 一种使用环保黄土生产建筑材料的方法，包括：通过混合70〜90重量％的选自黄土，高岭土和粘土中的至少一种，3〜23重量％ 树脂包衣剂，0.1〜5重量％的无机颜料和1〜5重量％的水; 并通过将其引入温度为80〜140℃，内压为1〜20kg / cm 2的成型机中，以10秒〜20分钟的间隔将环保组合物成型。

公开(公告)号：US20100133712A1

公开(公告)日：2010-06-03

申请号：US12514492

申请日：2007-10-02

申请人： Young-Bok Kim ,  Myung-Ja Kim

发明人： Young-Bok Kim ,  Myung-Ja Kim

IPC分类号： B29B17/00 ,  C08K3/34 ,  C08K3/22 ,  C08K3/26

CPC分类号： C04B28/001 ,  C04B26/02 ,  C04B2111/00456 ,  C04B2111/34 ,  Y02W30/97 ,  C04B18/248 ,  C04B18/26 ,  C04B24/30 ,  C04B40/0028 ,  C04B40/0263 ,  C04B2103/54 ,  C04B14/28 ,  C04B14/30 ,  C04B14/305 ,  C04B14/308 ,  C04B24/281 ,  C04B14/06 ,  C04B14/10 ,  C04B14/106 ,  C04B14/361 ,  C04B18/265 ,  C04B20/0076 ,  C04B40/0071 ,  C04B40/0082

摘要： A method of producing a building material using environment-friendly loess includes preparing an environment-friendly composition by mixing 10˜90 parts by weight of at least one selected from among loess, kaolin, clay and grayish blue powdered soil, 3˜50 parts by weight of a resin coating agent, 0.1˜25 parts by weight of an inorganic pigment, and 1˜60 parts by weight of water; and molding the environment-friendly composition at 10 second˜20 minute intervals by introducing it into a molding machine having a temperature of 50˜550° C. and an internal pressure of 1˜20 kg/cm2. A method of producing a container using environment-friendly loess includes preparing an environment-friendly composition by mixing 10˜90 parts by weight of at least one selected from among loess, kaolin, clay and grayish blue powdered soil, 3˜50 parts by weight of a resin coating agent, 0.1˜25 parts by weight of an inorganic pigment, and 1˜60 parts by weight of water; and molding the environment-friendly composition at 10 second˜20 minute intervals by introducing it into a molding machine having a temperature of 50˜450° C. and an internal pressure of 1˜10 kg/cm2.

摘要翻译： 使用环保黄土制造建筑材料的方法包括通过将10〜90重量份的选自黄土，高岭土，粘土和灰蓝色粉末状土壤中的至少一种混合10〜90重量份，制备环保组合物，3〜50份 树脂涂布剂的重量，0.1〜25重量份的无机颜料和1〜60重量份的水; 并通过将其引入温度为50〜550℃，内压为1〜20kg / cm 2的成型机中，以10秒〜20分钟的间隔将环境友好的组合物成型。 使用环保黄土的容器的制造方法包括：将10〜90重量份的选自黄土，高岭土，粘土和灰蓝色粉末状土壤中的至少一种混合10〜90重量份，制备环保组合物， 的树脂涂布剂，0.1〜25重量份的无机颜料和1〜60重量份的水; 并通过将其引入温度为50〜450℃，内压为1〜10kg / cm 2的成型机中，以10秒〜20分钟的间隔将环保组合物成型。