公开(公告)号：US20170341177A1

公开(公告)日：2017-11-30

申请号：US15494650

申请日：2017-04-24

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Kohei URAGUCHI ,  Takeshi MAEHARA ,  Osamu YAMAGUCHI ,  Masaki YODA ,  ltaru CHIDA

IPC分类号： B23K26/00 ,  B23K26/356 ,  B23K26/03 ,  B23K26/04

CPC分类号： B23K26/356 ,  B23K26/03 ,  B23K26/032 ,  B23K26/04 ,  B23K26/146 ,  B23K2101/12 ,  C21D10/005 ,  G21C13/036 ,  G21C17/017 ,  G21C19/207 ,  Y02E30/40

摘要： In one embodiment, a laser peening apparatus includes an output unit (41) configured to output laser light (6); a light-guide unit (31) configured to guide the outputted laser light (6); a condenser lens (42) configured to condense the guided laser light (6); an irradiation nozzle (32) configured to radiate the condensed laser light (6); a focus-change unit (50) configured to change a focal position of the laser light (6) based on distance from an irradiation target (4, 5) of the laser light (6) to the irradiation nozzle (32); and a control unit (66) configured to apply laser peening by radiating the laser light (6) toward the irradiation target (4, 5) which is in contact with water.

公开(公告)号：US20160138127A1

公开(公告)日：2016-05-19

申请号：US14940474

申请日：2015-11-13

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Kota NOMURA ,  ltaru CHIDA ,  Katsunori SHIIHARA ,  Hiroya ICHIKAWA

IPC分类号： C21D10/00 ,  B23K26/18 ,  C21D7/04 ,  B23K26/0622

CPC分类号： C21D10/005 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/106 ,  B23K26/146 ,  B23K26/18 ,  C21D7/04

摘要： One embodiment of the laser processing apparatus is for surface treatment by supplying liquid to a surface of the target member and irradiating pulsed laser light to the surface of the target member via the liquid. The apparatus includes a laser oscillator and a liquid supply. The laser oscillator irradiates the laser light to the surface through the liquid via an optical window. The liquid supply is configured to supply the liquid to the surface of the target member via a flow path passing on an outer surface of the optical window. When the liquid is in contact with a laser light emission surface of the optical window, the laser light emission surface transmits the laser light. When the liquid is not in contact with the laser light emission surface, the laser light emission surface reflects the laser light.

摘要翻译： 激光加工装置的一个实施例是通过向目标构件的表面供应液体并经由液体将脉冲激光照射到目标构件的表面来进行表面处理。 该装置包括激光振荡器和液体供应。 激光振荡器通过光学窗口通过液体将激光照射到表面。 液体供应构造成经由在光学窗口的外表面上通过的流路将液体供应到目标构件的表面。 当液体与光学窗口的激光发射表面接触时，激光发射表面透射激光。 当液体不与激光发射表面接触时，激光发射表面反射激光。

公开(公告)号：US20170087667A1

公开(公告)日：2017-03-30

申请号：US15272005

申请日：2016-09-21

申请人： Kabushiki Kaisha Toshiba

发明人： Setsu YAMAMOTO ,  Akira ITO ,  Kota NOMURA ,  Jun SEMBOSHI ,  ltaru CHIDA ,  Katsunori SHIIHARA ,  Hiroya ICHIKAWA ,  Keiichi HIROTA ,  Masahiro YOSHIDA

IPC分类号： B23K26/34 ,  G01B11/14 ,  B23K26/356 ,  G01B17/00 ,  B23K26/03 ,  B23K26/146

CPC分类号： B23K26/34 ,  B23K26/03 ,  B23K26/048 ,  B23K26/1224 ,  B23K26/146 ,  B23K26/356 ,  C21D10/005 ,  G01B11/14 ,  G01B17/00

摘要： According to an embodiment, a laser processing apparatus has: a laser light source; a light collector; a water nozzle; a sound sensor; a timer; and a distance calculator. The light collector collects the laser light on a workpiece. The water nozzle supplies a water stream to a surface to be treated of the workpiece. The sound sensor is provided at a predetermined position relative to at least one of the water nozzle and the light collector, and receives a sound coming from the surface to be treated. The timer detects a detected time width from a reference time point to a time point when the sound sensor receives the sound. The distance calculator calculates a distance from one of the water nozzle and the light collector to the surface to be processed.