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公开(公告)号：US20220127495A1
公开(公告)日：2022-04-28
申请号：US17511582
申请日：2021-10-27
Applicant: KCTECH CO., LTD.
Inventor： Jin Sook HWANG , Hyun Goo KONG , Eun Jin LEE
Abstract: A polishing slurry composition is provided. The polishing slurry composition includes abrasive particles, an oxidizer, an iron-containing catalyst, and a stabilizer, and a retention rate of the oxidizer according to Equation 1 is 70% or greater. Retention rate (%) of oxidizer=(concentration (%) of oxidizer after 7 days at room temperature×100)/(initial concentration (%) of oxidizer in polishing slurry composition) [Equation 1]
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