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1.发明授权公开(公告)号：US09134254B2
公开(公告)日：2015-09-15
申请号：US13830539
申请日：2013-03-14
Applicant: KLA-Tencor Corporation
Inventor： Vijayakumar Ramachandran
CPC classification number: G01N21/9501
Abstract: Systems and methods for determining a position of output of an inspection system in design data space are provided. One method includes merging more than one feature in design data for a wafer into a single feature that has a periphery that encompasses all of the features that are merged. The method also includes storing information for the single feature without the design data for the features that are merged. The information includes a position of the single feature in design data space. The method further includes aligning output of an inspection system for the wafer to the information for the single feature such that positions of the output in the design data space can be determined based on the position of the single feature in the design data space.
Abstract translation: 提供了用于确定设计数据空间中的检查系统的输出位置的系统和方法。 一种方法包括将用于晶片的设计数据中的多于一个特征合并成具有包含所合并的所有特征的周边的单个特征。 该方法还包括存储单个特征的信息，而不需要合并的特征的设计数据。 该信息包括设计数据空间中单个功能的位置。 该方法还包括将用于晶片的检查系统的输出与用于单个特征的信息对齐，使得可以基于设计数据空间中的单个特征的位置来确定设计数据空间中的输出的位置。
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公开(公告)号：US10018571B2
公开(公告)日：2018-07-10
申请号：US15166591
申请日：2016-05-27
Applicant: KLA-Tencor Corporation
Inventor： Vijayakumar Ramachandran , Ravikumar Sanapala , Vidyasagar Anantha , Philip Measor , Rajesh Manepalli , Jing Fang
IPC: G01N23/225 , G01N21/956 , G01N21/95 , H01L21/66 , G01N21/88
CPC classification number: G01N21/9501 , G01N21/95607 , G01N2021/8854 , G01N2021/95615 , G01N2223/6116 , G01N2223/646 , H01L22/12 , H01L22/20
Abstract: A defect inspection system includes an inspection sub-system and a controller communicatively coupled to the detector. The inspection sub-system includes an illumination source configured to generate a beam of illumination, a set of illumination optics to direct the beam of illumination to a sample, and a detector configured to collect illumination emanating from the sample. The controller includes a memory device and one or more processors configured to execute program instructions. The controller is configured to determine one or more target patterns corresponding to one or more features on the sample, define one or more care areas on the sample based on the one or more target patterns and design data of the sample stored within the memory device of the controller, and identify one or more defects within the one or more care areas of the sample based on the illumination collected by the detector.
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公开(公告)号：US10402461B2
公开(公告)日：2019-09-03
申请号：US14946777
申请日：2015-11-20
Applicant: KLA-Tencor Corporation
Inventor： Laurent Karsenti , Kris Bhaskar , Mark Wagner , Brian Duffy , Vijayakumar Ramachandran
IPC: G06T1/00 , G06T7/00 , H04N7/18 , H04L29/08 , G06F16/9535
Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a storage medium configured for storing images for a physical version of a specimen generated by an inspection system. At least two dies are formed on the specimen with different values of one or more parameters of a fabrication process performed on the specimen. The system also includes computer subsystem(s) configured for comparing portions of the stored images generated at locations on the specimen at which patterns having the same as-designed characteristics are formed with at least two of the different values. The portions of the stored images that are compared are not constrained by locations of the dies on the specimen, locations of the patterns within the dies, or locations of the patterns on the specimen. The computer subsystem(s) are also configured for detecting defects at the locations based on results of the comparing.
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公开(公告)号：US10535131B2
公开(公告)日：2020-01-14
申请号：US15350632
申请日：2016-11-14
Applicant: KLA-Tencor Corporation
Inventor： Christopher Maher , Bjorn Brauer , Vijayakumar Ramachandran , Laurent Karsenti , Eliezer Rosengaus , John R. Jordan, III , Roni Miller
Abstract: A defect detection method includes acquiring a reference image; selecting a target region of the reference image; identifying, based on a matching metric, one or more comparative regions of the reference image corresponding to the target region; acquiring a test image; masking the test image with the target region of the reference image and the one or more comparative regions of the reference image; defining a defect threshold for the target region in the test image based on the one or more comparative regions in the test image; and determining whether the target region of the test image contains a defect based on the defect threshold.
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公开(公告)号：US09275450B2
公开(公告)日：2016-03-01
申请号：US14191202
申请日：2014-02-26
Applicant: KLA-Tencor Corporation
Inventor： Vijayakumar Ramachandran
CPC classification number: G06T7/0004 , G06T2207/10061 , G06T2207/30148
Abstract: Systems and methods for classifying defects on a wafer are provided. One method includes dilating an extended bounding box (EBB) surrounding a defect position on a wafer in two dimensions in proportion to a width and height of a pattern of interest (POI) for a hot spot closest to the defect position. The method also includes determining if polygons in the POI match polygons in the dilated bounding box. If the polygons in the POI do not match the polygons in the dilated bounding box, the defect is classified as a non-hot spot defect. If the polygons in the POI match the polygons in the dilated bounding box, the defect is classified as a hot spot defect if the area of the EBB intersects the area of interest associated with the hot spot and a non-hot spot defect if the EBB area does not intersect the area of interest.
Abstract translation: 提供了用于对晶片上的缺陷进行分类的系统和方法。 一种方法包括在与最接近缺陷位置的热点的感兴趣图案（POI）的宽度和高度成比例的二维上扩大围绕晶片上的缺陷位置的延伸边界框（EBB）。 该方法还包括确定POI中的多边形是否与扩展的边界框中的多边形匹配。 如果POI中的多边形与扩展边界框中的多边形不匹配，则将缺陷归类为非热点缺陷。 如果POI中的多边形与扩展边界框中的多边形匹配，则如果EBB的面积与热点相关的感兴趣区域相交，则该缺陷被分类为热点缺陷，如果EBB 区域不与感兴趣区域相交。
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Patent Agency Ranking
公开(公告)号：US20140301629A1
公开(公告)日：2014-10-09
申请号：US14191202
申请日：2014-02-26
Applicant: KLA-Tencor Corporation
Inventor： Vijayakumar Ramachandran
IPC: G06T7/00
CPC classification number: G06T7/0004 , G06T2207/10061 , G06T2207/30148
Abstract: Systems and methods for classifying defects on a wafer are provided. One method includes dilating an extended bounding box (EBB) surrounding a defect position on a wafer in two dimensions in proportion to a width and height of a pattern of interest (POI) for a hot spot closest to the defect position. The method also includes determining if polygons in the POI match polygons in the dilated bounding box. If the polygons in the POI do not match the polygons in the dilated bounding box, the defect is classified as a non-hot spot defect. If the polygons in the POI match the polygons in the dilated bounding box, the defect is classified as a hot spot defect if the area of the EBB intersects the area of interest associated with the hot spot and a non-hot spot defect if the EBB area does not intersect the area of interest.
Abstract translation: 提供了用于对晶片上的缺陷进行分类的系统和方法。 一种方法包括在与最接近缺陷位置的热点的感兴趣图案（POI）的宽度和高度成比例的二维上扩大围绕晶片上的缺陷位置的延伸边界框（EBB）。 该方法还包括确定POI中的多边形是否与扩展的边界框中的多边形匹配。 如果POI中的多边形与扩展边界框中的多边形不匹配，则将缺陷归类为非热点缺陷。 如果POI中的多边形与扩展边界框中的多边形匹配，则如果EBB的面积与热点相关的感兴趣区域相交，则该缺陷被分类为热点缺陷，如果EBB 区域不与感兴趣区域相交。
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公开(公告)号：US20170140516A1
公开(公告)日：2017-05-18
申请号：US15350632
申请日：2016-11-14
Applicant: KLA-Tencor Corporation
Inventor： Christopher Maher , Bjorn Brauer , Vijayakumar Ramachandran , Laurent Karsenti , Eliezer Rosengaus , John R. Jordan, III , Roni Miller
CPC classification number: G06T7/001 , G06K9/6202 , G06K9/6212 , G06K9/74 , G06T7/11 , G06T2207/20182 , G06T2207/30148
Abstract: A defect detection method includes acquiring a reference image; selecting a target region of the reference image; identifying, based on a matching metric, one or more comparative regions of the reference image corresponding to the target region; acquiring a test image; masking the test image with the target region of the reference image and the one or more comparative regions of the reference image; defining a defect threshold for the target region in the test image based on the one or more comparative regions in the test image; and determining whether the target region of the test image contains a defect based on the defect threshold.
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8.发明申请公开(公告)号：US20160377561A1
公开(公告)日：2016-12-29
申请号：US15166591
申请日：2016-05-27
Applicant: KLA-Tencor Corporation
Inventor： Vijayakumar Ramachandran , Ravikumar Sanapala , Vidyasagar Anantha , Philip Measor , Rajesh Manepalli , Jing Fang
IPC: G01N23/225 , G01N21/956 , G01N21/95
CPC classification number: G01N21/9501 , G01N21/95607 , G01N2021/8854 , G01N2021/95615 , G01N2223/6116 , G01N2223/646 , H01L22/12 , H01L22/20
Abstract: A defect inspection system includes an inspection sub-system and a controller communicatively coupled to the detector. The inspection sub-system includes an illumination source configured to generate a beam of illumination, a set of illumination optics to direct the beam of illumination to a sample, and a detector configured to collect illumination emanating from the sample. The controller includes a memory device and one or more processors configured to execute program instructions. The controller is configured to determine one or more target patterns corresponding to one or more features on the sample, define one or more care areas on the sample based on the one or more target patterns and design data of the sample stored within the memory device of the controller, and identify one or more defects within the one or more care areas of the sample based on the illumination collected by the detector.
Abstract translation: 缺陷检查系统包括检测子系统和通信地耦合到检测器的控制器。 检查子系统包括被配置为产生照射束的照明源，一组用于将照射束引导到样本的照明光学器件，以及被配置为收集从样品发出的照明的检测器。 控制器包括存储器设备和被配置为执行程序指令的一个或多个处理器。 控制器被配置为确定与样本上的一个或多个特征相对应的一个或多个目标模式，基于存储在存储器装置内的样本的一个或多个目标模式和样本的设计数据来定义样本上的一个或多个保养区域 控制器，并且基于由检测器收集的照明来识别样品的一个或多个护理区域内的一个或多个缺陷。
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公开(公告)号：US20160150191A1
公开(公告)日：2016-05-26
申请号：US14946777
申请日：2015-11-20
Applicant: KLA-Tencor Corporation
Inventor： Laurent Karsenti , Kris Bhaskar , Mark Wagner , Brian Duffy , Vijayakumar Ramachandran
CPC classification number: G06F16/9535 , G06T1/0007 , G06T7/0006 , G06T2207/10144 , G06T2207/30148 , H04L67/306 , H04N7/181
Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a storage medium configured for storing images for a physical version of a specimen generated by an inspection system. At least two dies are formed on the specimen with different values of one or more parameters of a fabrication process performed on the specimen. The system also includes computer subsystem(s) configured for comparing portions of the stored images generated at locations on the specimen at which patterns having the same as-designed characteristics are formed with at least two of the different values. The portions of the stored images that are compared are not constrained by locations of the dies on the specimen, locations of the patterns within the dies, or locations of the patterns on the specimen. The computer subsystem(s) are also configured for detecting defects at the locations based on results of the comparing.
Abstract translation: 提供了检测试样缺陷的方法和系统。 一个系统包括被配置为存储由检查系统生成的样本的物理版本的图像的存储介质。 在样品上形成至少两个模具，其具有在样品上进行的制造工艺的一个或多个参数的不同值。 该系统还包括计算机子系统，其被配置用于比较在样本上产生的存储图像的部分，其中形成具有相同设计特征的图案具有不同值中的至少两个。 被比较的存储的图像的部分不受标本上的模具的位置，模具内的图案的位置或样本上的图案的位置的约束。 计算机子系统还被配置为基于比较的结果来检测位置处的缺陷。
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10.发明申请公开(公告)号：US20140195992A1
公开(公告)日：2014-07-10
申请号：US13830539
申请日：2013-03-14
Applicant: KLA-Tencor Corporation
Inventor： Vijayakumar Ramachandran
IPC: G06F17/50
CPC classification number: G01N21/9501
Abstract: Systems and methods for determining a position of output of an inspection system in design data space are provided. One method includes merging more than one feature in design data for a wafer into a single feature that has a periphery that encompasses all of the features that are merged. The method also includes storing information for the single feature without the design data for the features that are merged. The information includes a position of the single feature in design data space. The method further includes aligning output of an inspection system for the wafer to the information for the single feature such that positions of the output in the design data space can be determined based on the design data space position of the single feature.
Abstract translation: 提供了用于确定设计数据空间中的检查系统的输出位置的系统和方法。 一种方法包括将用于晶片的设计数据中的多于一个特征合并成具有包含所合并的所有特征的周边的单个特征。 该方法还包括存储单个特征的信息，而不需要合并的特征的设计数据。 该信息包括设计数据空间中单个功能的位置。 该方法还包括将用于晶片的检查系统的输出与单个特征的信息对齐，使得可以基于单个特征的设计数据空间位置来确定设计数据空间中的输出的位置。
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