公开(公告)号：US20160377561A1

公开(公告)日：2016-12-29

申请号：US15166591

申请日：2016-05-27

Applicant: KLA-Tencor Corporation

Inventor： Vijayakumar Ramachandran ,  Ravikumar Sanapala ,  Vidyasagar Anantha ,  Philip Measor ,  Rajesh Manepalli ,  Jing Fang

IPC: G01N23/225 ,  G01N21/956 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/95607 ,  G01N2021/8854 ,  G01N2021/95615 ,  G01N2223/6116 ,  G01N2223/646 ,  H01L22/12 ,  H01L22/20

Abstract: A defect inspection system includes an inspection sub-system and a controller communicatively coupled to the detector. The inspection sub-system includes an illumination source configured to generate a beam of illumination, a set of illumination optics to direct the beam of illumination to a sample, and a detector configured to collect illumination emanating from the sample. The controller includes a memory device and one or more processors configured to execute program instructions. The controller is configured to determine one or more target patterns corresponding to one or more features on the sample, define one or more care areas on the sample based on the one or more target patterns and design data of the sample stored within the memory device of the controller, and identify one or more defects within the one or more care areas of the sample based on the illumination collected by the detector.

Abstract translation: 缺陷检查系统包括检测子系统和通信地耦合到检测器的控制器。 检查子系统包括被配置为产生照射束的照明源，一组用于将照射束引导到样本的照明光学器件，以及被配置为收集从样品发出的照明的检测器。 控制器包括存储器设备和被配置为执行程序指令的一个或多个处理器。 控制器被配置为确定与样本上的一个或多个特征相对应的一个或多个目标模式，基于存储在存储器装置内的样本的一个或多个目标模式和样本的设计数据来定义样本上的一个或多个保养区域 控制器，并且基于由检测器收集的照明来识别样品的一个或多个护理区域内的一个或多个缺陷。

公开(公告)号：US10706522B2

公开(公告)日：2020-07-07

申请号：US15394545

申请日：2016-12-29

Applicant: KLA-Tencor Corporation

Inventor： Prasanti Uppaluri ,  Rajesh Manepalli ,  Ashok V. Kulkarni ,  Saibal Banerjee ,  John Kirkland

IPC: G06T7/00 ,  H01L21/66

Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.

公开(公告)号：US20180130195A1

公开(公告)日：2018-05-10

申请号：US15394545

申请日：2016-12-29

Applicant: KLA-Tencor Corporation

Inventor： Prasanti Uppaluri ,  Rajesh Manepalli ,  Ashok V. Kulkarni ,  Saibal Banerjee ,  John Kirkland

IPC: G06T7/00

Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.

公开(公告)号：US10018571B2

公开(公告)日：2018-07-10

申请号：US15166591

申请日：2016-05-27

Applicant: KLA-Tencor Corporation

Inventor： Vijayakumar Ramachandran ,  Ravikumar Sanapala ,  Vidyasagar Anantha ,  Philip Measor ,  Rajesh Manepalli ,  Jing Fang

IPC: G01N23/225 ,  G01N21/956 ,  G01N21/95 ,  H01L21/66 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/95607 ,  G01N2021/8854 ,  G01N2021/95615 ,  G01N2223/6116 ,  G01N2223/646 ,  H01L22/12 ,  H01L22/20

Abstract: A defect inspection system includes an inspection sub-system and a controller communicatively coupled to the detector. The inspection sub-system includes an illumination source configured to generate a beam of illumination, a set of illumination optics to direct the beam of illumination to a sample, and a detector configured to collect illumination emanating from the sample. The controller includes a memory device and one or more processors configured to execute program instructions. The controller is configured to determine one or more target patterns corresponding to one or more features on the sample, define one or more care areas on the sample based on the one or more target patterns and design data of the sample stored within the memory device of the controller, and identify one or more defects within the one or more care areas of the sample based on the illumination collected by the detector.