公开(公告)号：US20150148452A1

公开(公告)日：2015-05-28

申请号：US14404942

申请日：2013-02-15

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Su-Jin Park ,  Sook-Yeon Park ,  Yun-Ju Kim ,  Sang-Yong Tak ,  Sung-Hwan Park ,  Kyung-Nam Kang

IPC: C08K5/549 ,  C08K3/22 ,  C07D301/00 ,  C07F7/18 ,  C07C41/06 ,  C07C37/48 ,  C08K3/28 ,  C08K3/36

CPC classification number: C08K5/549 ,  C07C37/48 ,  C07C41/06 ,  C07D301/00 ,  C07D303/12 ,  C07D303/30 ,  C07D407/12 ,  C07F7/1804 ,  C07F7/1876 ,  C08K3/22 ,  C08K3/28 ,  C08K3/36 ,  C08K2003/2241 ,  C08K2003/2244

Abstract: There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.

Abstract translation: 提供了包含烷氧基甲硅烷基化环氧化合物的组合物，其具有良好的耐热性，低CTE和高玻璃化转变温度或Tg-Tg并且不需要单独的偶联剂的组合物，以及无机颗粒，由 组合物和使用固化产物。 提供了包含烷氧基甲硅烷基化环氧化合物和无机颗粒的环氧组合物，包含环氧化合物，无机颗粒和固化剂的环氧组合物，组合物的固化产物和组合物的用途。 由于可以在烷氧基甲硅烷基和无机颗粒之间以及烷氧基甲硅烷基之间形成化学键，所以包含烷氧基硅烷基化环氧化合物和无机颗粒的组合物的组合物表现出改进的耐热性，降低的CTE和增加的玻璃化转变温度或Tg 减。

公开(公告)号：US09725590B2

公开(公告)日：2017-08-08

申请号：US14427990

申请日：2013-09-17

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Yun-Ju Kim ,  Su-Jin Park ,  Sang-Yong Tak ,  Sung-Hwan Park ,  Kyung-Nam Kang ,  Sook-Yeon Park

IPC: C07F7/08 ,  C07F7/10 ,  C07F7/18 ,  C08L63/00 ,  C09J163/00 ,  C08G59/20 ,  C08G59/30 ,  C08K5/50 ,  C08K7/14 ,  C08G59/32 ,  H01L33/52 ,  H05K1/03

CPC classification number: C08L63/00 ,  C07F7/1804 ,  C08G59/306 ,  C08G59/3281 ,  C08K5/50 ,  C08K7/14

Abstract: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.

公开(公告)号：US20150247033A1

公开(公告)日：2015-09-03

申请号：US14427990

申请日：2013-09-17

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee Chun ,  Yun-Ju Kim ,  Su-Jin Park ,  Sang-Yong Tak ,  Sung-Hwan Park ,  Kyung-Nam Kang ,  Sook-Yeon Park

IPC: C08L63/00 ,  C08K7/14 ,  C07F7/18 ,  C08K5/50

CPC classification number: C08L63/00 ,  C07F7/1804 ,  C08G59/306 ,  C08G59/3281 ,  C08K5/50 ,  C08K7/14

Abstract: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.

Abstract translation: 提供一种烷氧基甲硅烷基化环氧化合物，其复合材料具有良好的耐热性能，特别是低CTE和玻璃化转变温度升高，其固化产物具有良好的阻燃性，其组成不需要额外的硅烷偶联剂， 制备其组合物和包含其的固化产物。 包含至少一种烷氧基甲硅烷基和至少两个环氧基的烷氧基甲硅烷基化环氧化合物，其起始材料的环氧化物开环反应和烷氧基硅烷化的制备方法，包含环氧化合物的环氧组合物和固化产物和使用 的组合物。 由于可以在烷氧基甲硅烷基和填料之间以及在烷氧基甲硅烷基之间形成化学键，所以可以提高复合材料的化学键合效率。 因此，复合材料具有良好的耐热性能，固化物具有良好的阻燃性。