公开(公告)号：US11186776B2

公开(公告)日：2021-11-30

申请号：US16538831

申请日：2019-08-13

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Hong Jin Lim ,  Nam Ho You ,  Seokhoon Ahn ,  Munju Goh ,  Se Gyu Jang ,  Myung Jong Kim

IPC: C09K19/38 ,  C08K3/013 ,  C08K3/14 ,  C08K3/22 ,  C08K3/28 ,  C08L63/00

Abstract: The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.