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公开(公告)号：US10059593B2
公开(公告)日：2018-08-28
申请号：US15380460
申请日：2016-12-15
Applicant: Korea Institute of Science and Technology
Inventor： Munju Goh , Nam Ho You , Hyeonuk Yeo , Bon-Cheol Ku , Sang Jun Youn , Jin Won Yu , Jin Jung
IPC: C07C29/10 , B01J23/34 , B01J23/26 , B01J23/36 , B01J23/46 , B01J27/13 , B01J23/22 , C01B31/04 , C01F7/02 , C08J11/16 , C01B32/17 , C01B32/23 , C01B32/196 , C01B32/956
Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.
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2.发明授权公开(公告)号：US09950340B2
公开(公告)日：2018-04-24
申请号：US14519325
申请日：2014-10-21
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor： Munju Goh , Nam Ho You , Hyeonuk Yeo , Young Bum Hong
CPC classification number: B05D1/40 , B32B17/066 , B32B2307/304 , B32B2307/412 , C03C17/007 , C03C2217/445 , C03C2217/47 , C08J5/18 , C08J7/047 , C08J2367/02 , C08J2433/00 , C08J2433/12 , E04B2001/742
Abstract: Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.
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公开(公告)号：US10280534B2
公开(公告)日：2019-05-07
申请号：US16126580
申请日：2018-09-10
Applicant: Korea Institute of Science and Technology
Inventor： Munju Goh , Bon-Cheol Ku , Nam Ho You , Sang Jun Youn , Hyeonuk Yeo
IPC: C01F7/02 , C03C13/00 , D01F9/24 , C01B32/16 , C01B32/956 , C01B32/184 , C01B32/23 , C08J11/16
Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1≤m≤8 and n is a number satisfying 1≤n≤6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.
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Patent Agency Ranking
公开(公告)号：US10106421B2
公开(公告)日：2018-10-23
申请号：US15380460
申请日：2016-12-15
Applicant: Korea Institute of Science and Technology
Inventor： Munju Goh , Nam Ho You , Hyeonuk Yeo , Bon-Cheol Ku , Sang Jun Youn , Jin Won Yu , Jin Jung
IPC: C07C29/10 , B01J23/34 , B01J23/26 , B01J23/36 , B01J23/46 , B01J27/13 , B01J23/22 , C01B31/04 , C01F7/02 , C08J11/16 , C01B32/17 , C01B32/23 , C01B32/196 , C01B32/956
Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.
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公开(公告)号：US11186776B2
公开(公告)日：2021-11-30
申请号：US16538831
申请日：2019-08-13
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor： Hong Jin Lim , Nam Ho You , Seokhoon Ahn , Munju Goh , Se Gyu Jang , Myung Jong Kim
Abstract: The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.
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公开(公告)号：US10975307B2
公开(公告)日：2021-04-13
申请号：US15865259
申请日：2018-01-09
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor： Munju Goh , Hyeonuk Yeo , Nam Ho You , Se Gyu Jang , Seokhoon Ahn , Young Soo Kim
IPC: G02F1/1333 , C09K19/38 , C09K19/12 , C09K19/30 , C09K19/32 , C09K19/22 , C09K19/16 , C09K19/24 , C09K19/34 , C09K19/20 , C09K19/04
Abstract: Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.
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7.发明授权公开(公告)号：US09040015B2
公开(公告)日：2015-05-26
申请号：US13796214
申请日：2013-03-12
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor： Munju Goh , Ok-kyung Park , Yong Mun Choi , Bon-Cheol Ku , Joong Hee Lee , Nam Ho You , Han Sol You
CPC classification number: C01B31/0484 , C01B32/168 , C01B32/194 , H01B1/04
Abstract: Provided are a method for post-treatment of a carbonaceous material using dehydrocyclization, a carbonaceous material post-treated by the method, and a polymer composite material including the carbonaceous material. More particularly, provided are a method for post-treatment of a carbonaceous material using dehydrocyclization, including subjecting the carbonaceous material to dehydrocyclization at room temperature to heal structural defects in the carbonaceous material, while increasing the effective conjugated length of the carbonaceous material to improve the electrical conductivity thereof, as well as a carbonaceous material post-treated by the method and a polymer composite material including the carbonaceous material.
Abstract translation: 提供了一种使用脱氢环化处理碳质材料的方法，通过该方法后处理的碳质材料和包含碳质材料的聚合物复合材料。 更具体地，提供了一种使用脱氢环化作用对碳质材料进行后处理的方法，包括在室温下使含碳材料脱氢环化，以治愈碳质材料中的结构缺陷，同时增加碳质材料的有效共轭长度以改善 其导电性以及通过该方法后处理的碳质材料和包含碳质材料的聚合物复合材料。
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公开(公告)号：US09017805B2
公开(公告)日：2015-04-28
申请号：US13850416
申请日：2013-03-26
Applicant: Korea Institute of Science and Technology
Inventor： Nam Ho You , Ok-kyung Park , Bon-Cheol Ku , Joong Hee Lee , Munju Goh
IPC: C08L33/20 , C08L77/00 , C08L79/00 , C08L87/00 , C08G73/10 , C08L79/08 , C08G83/00 , C08K3/34 , C08K7/24 , C08G73/18 , C08G73/22 , C08L79/04
CPC classification number: C08G73/105 , C08G73/1071 , C08G73/18 , C08G73/22 , C08G83/001 , C08K3/346 , C08K7/24 , C08L77/00 , C08L79/04 , C08L79/08 , Y10T428/249921 , Y10T428/24994 , Y10T428/249941 , Y10T428/249942 , Y10T428/249944 , Y10T428/249945 , Y10T428/249948 , Y10T428/249951 , Y10T428/2998 , Y10T428/31504 , Y10T428/31721 , Y10T428/31725 , Y10T428/31765 , Y10T428/31938 , C08L87/00
Abstract: The present disclosure relates to a polyimide-graphene composite material and a method for preparing same. More particularly, it relates to a polyimide-graphene composite material prepared by adding modified graphene and a basic catalyst during polymerization of a polyimide precursor so as to improve mechanical strength and electrical conductivity and enable imidization at low temperature and a method for preparing same.
Abstract translation: 本公开涉及聚酰亚胺 - 石墨烯复合材料及其制备方法。 更具体地说，本发明涉及通过在聚酰亚胺前体的聚合过程中加入改性石墨烯和碱性催化剂以提高机械强度和导电性并能够在低温下进行酰亚胺化而制备的聚酰亚胺 - 石墨烯复合材料及其制备方法。
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