公开(公告)号：US06864574B1

公开(公告)日：2005-03-08

申请号：US09722737

申请日：2000-11-28

申请人： Kazuhiro Nobori ,  Yosinori Sakai ,  Kazuo Arisue

发明人： Kazuhiro Nobori ,  Yosinori Sakai ,  Kazuo Arisue

IPC分类号： H01L23/31 ,  H01L23/433 ,  H01L23/485 ,  H01L25/065 ,  H01L23/34 ,  H01L23/10

CPC分类号： H01L24/10 ,  H01L23/3107 ,  H01L23/4334 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Electrodes of one face of a semiconductor, which has electrodes formed on both faces, and a heat radiating plate are directly joined to quickly absorb and diffuse heat of the semiconductor, thereby improving a heat radiation effect. At the same time, electrodes on an opposite face of the semiconductor are connected to pillared electrodes that are thicker than a wire for wire bonding and larger in current capacity. These pillared electrodes can accordingly be utilized as connecting terminals to a circuit board. Ceramic is used for the heat radiating plate, so that semiconductors of different functions can be mounted simultaneously.

摘要翻译： 将形成在两面上的电极和散热板的半导体的一个面的电极直接接合，以快速吸收和扩散半导体的热量，从而提高散热效果。 同时，半导体的相对面上的电极连接到比用于引线接合的导线更厚的柱状电极，并且电流容量更大。 因此，这些支柱电极可以用作电路板的连接端子。 陶瓷用于散热板，可以同时安装不同功能的半导体。