公开(公告)号：US06804883B1

公开(公告)日：2004-10-19

申请号：US09603060

申请日：2000-06-26

申请人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

发明人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

IPC分类号： H01R4300

CPC分类号： B81C1/00333 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/0084 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49174 ,  Y10T29/49176 ,  H01L2924/00014

摘要： A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

摘要翻译： 一种制造压力传感器的方法，其中半导体压力传感器安装在引线格栅的安装部分，特别是引线框架上。 半导体压力传感器电连接到引线栅格的接触部分。 引线格栅与半导体压力传感器一起插入注塑模具中。 模具部件在半导体压力拾取器的背离安装部分或背离半导体压力传感器的安装部分的一侧被接触。 注射模具中的半导体压力拾取器随后由由模具化合物制成的壳体封闭。 为了防止安装部分的脱落，提出在制造壳体时将引线格栅的安装部分夹紧在注塑模具中。

公开(公告)号：US06300169B1

公开(公告)日：2001-10-09

申请号：US09603082

申请日：2000-06-26

申请人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

发明人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

IPC分类号： H01L2144

CPC分类号： G01L19/143 ,  G01L19/141 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/10253 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is electrically connected to contact segments of the lead grid. The lead grid having the semiconductor pressure sensing element is inserted into an injection molding die, and then the semiconductor pressure sensing element, in the injection molding die, is surrounded by a housing made of injection molding compound. A structure is present in the injection molding die through which a pressure feed for the semiconductor pressure sensing element is left free from the jacket of injection molding compound. A stamp is arranged in the injection molding die so as to be separated by a gap from the side of the assembly segment that is facing away from the semiconductor pressure sensing element or from the side of the semiconductor pressure sensing element that is facing away from the assembly segment. As a result of a change in the temperature of the stamp relative to the temperature of the liquefied injection molding compound, a reduction in the flow capacity of the injection molding compound in the area of the stamp is brought about and, as a result, at least a complete penetration of the injection molding compound into the gap is avoided.

摘要翻译： 在用于制造压力传感器的方法中，其中半导体压力感测元件被施加到引线栅的组装段，半导体压力感测元件电连接到引线栅的接触段。 具有半导体压力感测元件的引线格栅被插入到注射成型模具中，然后在注射成型模具中的半导体压力感测元件被由注射成型化合物制成的壳体包围。 在注模模具中存在一种结构，通过该结构，半导体压力传感元件的压力进料不被注射模塑料的夹套留下。 在注射成型模具中布置有印模，以便与组件段的背离半导体压力感测元件的侧面或从半导体压力感测元件的背离背面的间隙分开 装配段 由于印模温度相对于液化注射模塑料的温度变化的结果，注塑模具在印模区域的流动能力降低，结果是在 避免了将注射成型化合物完全渗透到间隙中。