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    Method for producing a pressure sensor
    1.
    发明授权
    Method for producing a pressure sensor 有权
    压力传感器的制造方法

    公开(公告)号：US06804883B1

    公开(公告)日：2004-10-19

    申请号：US09603060

    申请日：2000-06-26

    申请人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    发明人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    IPC分类号： H01R4300

    CPC分类号： B81C1/00333 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/0084 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49174 ,  Y10T29/49176 ,  H01L2924/00014

    摘要： A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

    摘要翻译： 一种制造压力传感器的方法，其中半导体压力传感器安装在引线格栅的安装部分，特别是引线框架上。 半导体压力传感器电连接到引线栅格的接触部分。 引线格栅与半导体压力传感器一起插入注塑模具中。 模具部件在半导体压力拾取器的背离安装部分或背离半导体压力传感器的安装部分的一侧被接触。 注射模具中的半导体压力拾取器随后由由模具化合物制成的壳体封闭。 为了防止安装部分的脱落，提出在制造壳体时将引线格栅的安装部分夹紧在注塑模具中。

    Method for manufacturing a pressure sensor
    2.
    发明授权
    Method for manufacturing a pressure sensor 有权
    制造压力传感器的方法

    公开(公告)号：US06300169B1

    公开(公告)日：2001-10-09

    申请号：US09603082

    申请日：2000-06-26

    申请人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    发明人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    IPC分类号： H01L2144

    CPC分类号： G01L19/143 ,  G01L19/141 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/10253 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is electrically connected to contact segments of the lead grid. The lead grid having the semiconductor pressure sensing element is inserted into an injection molding die, and then the semiconductor pressure sensing element, in the injection molding die, is surrounded by a housing made of injection molding compound. A structure is present in the injection molding die through which a pressure feed for the semiconductor pressure sensing element is left free from the jacket of injection molding compound. A stamp is arranged in the injection molding die so as to be separated by a gap from the side of the assembly segment that is facing away from the semiconductor pressure sensing element or from the side of the semiconductor pressure sensing element that is facing away from the assembly segment. As a result of a change in the temperature of the stamp relative to the temperature of the liquefied injection molding compound, a reduction in the flow capacity of the injection molding compound in the area of the stamp is brought about and, as a result, at least a complete penetration of the injection molding compound into the gap is avoided.

    摘要翻译： 在用于制造压力传感器的方法中，其中半导体压力感测元件被施加到引线栅的组装段，半导体压力感测元件电连接到引线栅的接触段。 具有半导体压力感测元件的引线格栅被插入到注射成型模具中，然后在注射成型模具中的半导体压力感测元件被由注射成型化合物制成的壳体包围。 在注模模具中存在一种结构，通过该结构，半导体压力传感元件的压力进料不被注射模塑料的夹套留下。 在注射成型模具中布置有印模，以便与组件段的背离半导体压力感测元件的侧面或从半导体压力感测元件的背离背面的间隙分开 装配段 由于印模温度相对于液化注射模塑料的温度变化的结果，注塑模具在印模区域的流动能力降低，结果是在 避免了将注射成型化合物完全渗透到间隙中。

    Electronic device
    3.
    发明授权
    Electronic device 失效
    电子设备

    公开(公告)号：US06778400B2

    公开(公告)日：2004-08-17

    申请号：US10030994

    申请日：2002-05-13

    申请人： Juergen Kurle ,  Kurt Weiblen ,  Stefan Pinter ,  Frieder Haag

    发明人： Juergen Kurle ,  Kurt Weiblen ,  Stefan Pinter ,  Frieder Haag

    IPC分类号： H05K500

    CPC分类号： H01R12/585 ,  H05K7/1417 ,  H05K7/142

    摘要： An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board. To protect impact-sensitive and vibration-sensitive components, it is proposed to provide the contact elements, on a part of their length not inserted into the contact openings, with elastically deformable segments and to flexibly support the printed circuit board in the housing part by the contact element configured in this way, and, additionally, to connect it via damping elements at least indirectly to the housing part.

    摘要翻译： 一种电子设备，包括具有至少一个可闭合开口和一个插入部分的壳体部分，所述壳体部分容纳布置在其上的至少一个电气和/或电子部件的印刷电路板和电接触元件，其中 电连接到插入部分，并且其在壳体内部中的彼此平行延伸并且沿至少一个开口的方向突出的端部，端部穿过印刷电路板的接触开口，并且是 与印刷电路板导电连接。 为了保护冲击敏感和振动敏感的部件，建议在其长度的一部分长度上未插入接触开口中的可弹性变形的部分提供接触元件，并且通过以下方式灵活地支撑外壳部件中的印刷电路板： 以这种方式构造的接触元件，并且另外通过阻尼元件至少间接地连接到壳体部分。

    Sealed housing for an electronic device and the respective seal
    4.
    发明授权
    Sealed housing for an electronic device and the respective seal 失效
    用于电子设备的密封外壳和相应的密封件

    公开(公告)号：US06711033B2

    公开(公告)日：2004-03-23

    申请号：US10041352

    申请日：2002-01-08

    申请人： Kurt Weiblen ,  Frieder Haag

    发明人： Kurt Weiblen ,  Frieder Haag

    IPC分类号： H05K900

    CPC分类号： H05K5/061

    摘要： A sealed housing for an electronic device has a housing bottom part which has a first contact surface; a housing top part which has a second contact surface; the housing bottom part being connectable to the housing top part; and a seal which is insertable between the housing bottom part and the housing top part so that it contacts the first contact surface and the second contact surface to form a seal when the housing bottom part and the housing top part are joined. The seal is in the form of a continuous disk.

    摘要翻译： 一种用于电子设备的密封壳体具有壳体底部，其具有第一接触表面; 具有第二接触表面的壳体顶部; 所述壳体底部可连接到所述壳体顶部; 以及密封件，其可插入在壳体底部部分和壳体顶部部分之间，使得当壳体底部部分和壳体顶部部分接合时，该密封件接触第一接触表面和第二接触表面以形成密封。 密封是连续盘的形式。