公开(公告)号：US3798138A

公开(公告)日：1974-03-19

申请号：US3798138D

申请日：1971-07-21

Applicant: LEA RONAL INC

Inventor： OSTROW B ,  NOBEL F

IPC: C25D3/38 ,  C23B5/20 ,  C23B5/46

CPC classification number: C25D3/38

Abstract: COOPER IS ELECTRODEPOSITED FROM AN AQUEOUS ACID PLATING BATH OR SOLUTION CONTAINING AT LEASTT ONE COPPER SALT, A HETEROCYCLIC SULPHUR-NITROGEN ORGANIC COMPOUND, SUCH AS WATER SOLUBLE DERIVATIVES OF 2-THIAZOLIDINETHIONES, 2-IMIDAZOLIDINETIONES OR THEIR REACTION PRODUCTS WITH ALKYL ALDEHYDES OR DIALDEHYDES, AND A WATER SOLUBLE BRIGHTENER CONTAINING A CARBON-SULPHUR GROUP IN WHICH THE CARBON ATOM IS ATTACHED TO AT LEAST ONE OTHER HETERO-ATOM, SUCH AS SULPHUR OR NITROGEN.

公开(公告)号：US3833486A

公开(公告)日：1974-09-03

申请号：US34504173

申请日：1973-03-26

Applicant: LEA RONAL INC

Inventor： NOBEL F ,  YOEN L

IPC: C25D3/02 ,  C25D3/38 ,  C23B5/02 ,  C23B5/18 ,  C23B5/46

CPC classification number: C25D3/02 ,  C25D3/38

Abstract: Improved cyanide-free aqueous electroplating baths for plating metals, the baths containing water soluble phosphonate chelating agents combined with at least one chelatable metal ion and containing as an additive at least one strong oxidizing agent, and electroplating processes employing said baths. Additional materials may also be added for further improvements.

Abstract translation: 用于电镀金属的改进的无氰化合物电镀浴，包含与至少一种螯合金属离子结合并含有至少一种强氧化剂的添加剂的水溶性膦酸盐螯合剂的浴和使用所述浴的电镀方法。 还可以添加另外的材料以进一步改进。

公开(公告)号：US3725220A

公开(公告)日：1973-04-03

申请号：US3725220D

申请日：1972-04-27

Applicant: LEA RONAL INC

Inventor： KESSLER R ,  NOBEL F

IPC: C25D3/38 ,  C23B5/20 ,  C23B5/46

CPC classification number: C25D3/38

Abstract: An acid copper plating bath which contains a copper metal salt and a minor amount of a sulfoniumalkanesulfonate or sulfoniumalkanecarboxylate as a brightening agent. Illustrative sulfonium compounds are N-cyclohexyl-2-benzothiazol sulfonium-1propanesulfonate, bis (dimethylthiocarbamyl) sulfonium-1propanesulfonate, and bis (dimethylthiocarbamyl) sulfonium-1propanecarboxylate. Preferred amounts of the sulfonium compounds range from about 0.001 to 1.0 grams per liter. The use of such acid copper plating baths in the electrodeposition of copper metal is also disclosed.

Abstract translation: 一种含有铜金属盐和少量的磺基链烷磺酸锍或硫代锍羧酸盐作为增亮剂的酸性镀铜浴。 示例性的锍化合物是N-环己基-2-苯并噻唑锍-1-丙磺酸盐，双（二甲基硫代氨基甲酰基）锍-1-丙磺酸盐和双（二甲基硫代氨基甲酰基）锍-1-丙烷羧酸盐。 锍化合物的优选量为约0.001至1.0克/升。 还公开了在铜金属的电沉积中使用这种酸性电镀浴。