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1.发明公开公开(公告)号：US20240332821A1
公开(公告)日：2024-10-03
申请号：US18709450
申请日：2021-11-10
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO , Yusuhk SUH , Dongik LEE
CPC classification number: H01Q21/065 , H01Q1/24 , H01Q1/36 , H01Q1/48
Abstract: The antenna module implemented using a multi-layer substrate comprises: a radiator which is arranged in the inner region or the upper region of the multi-layer substrate, and which has at least one conductive layer to radiate a wireless signal; a feeding structure connected to the radiator through a signal via arranged in the lower region of the radiator; a lower ground layer which is arranged in the lower region of the conductive layer constituting the radiator and which operates as a ground for the radiator; and a multi-layer ground structure which is connected to the lower ground layer, and which has end portion positions that differ for each layer of the multi-layer substrate so as to be spaced different distances apart from the radiator for each layer of the multi-layer substrate.
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公开(公告)号：US20230216189A1
公开(公告)日：2023-07-06
申请号：US17996552
申请日：2020-05-22
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO , Dongik LEE
Abstract: Provided is an electronic device having an antenna according to an embodiment. The electronic device may comprise a first and a second ground plane arranged on different layers of a multi-layer substrate and configured to be connected to each other through vias spaced a predetermined distance apart from each other. The electronic device may comprise a signal line arranged on the same plane as the first ground plane which is disposed at the upper side among the first and the second ground plane. The electronic device may comprise a radiator configured to be electrically connected to the signal line and emit a signal. The first ground plane may be disposed at only one region of one side region and the other side region of the signal line in a predetermined section.
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3.发明申请METHOD FOR TRANSMITTING UPLINK SIGNAL TO MINIMIZE SPURIOUS EMISSION AND USER EQUIPMENT THEREOF 审中-公开用于发送上行信号以最小化发射功率的方法及其用户设备公开(公告)号：US20160134410A1
公开(公告)日：2016-05-12
申请号：US14991524
申请日：2016-01-08
Applicant: LG ELECTRONICS INC.
Inventor： Suhwan Lim , Sangwook LEE , Jinyup HWANG , Dongik LEE , Manyoung JUNG , Yoonoh YANG , Seungpyo NOH
CPC classification number: H04L5/0066 , H04J11/003 , H04L5/0007 , H04L5/001 , H04L5/0053 , H04L5/14 , H04L27/26 , H04W52/146 , H04W52/24 , H04W52/367 , H04W72/0413 , H04W72/0446 , H04W74/004
Abstract: A method for limiting a spurious emission, and a user equipment (UE) thereof are discussed. The method according to one embodiment includes configuring a radio frequency (RF) unit of the UE to use a band 1; if the RF unit is configured to use the band 1, controlling the RF unit of the UK to limit a maximum level of spurious emission to −50 dBm for protecting another UE using a band 5; and transmitting an uplink signal through the configured RF unit. The band 1 includes an uplink operating band of 1920-1980 MHz and a downlink operating band of 2110-2170 MHz. The band 5 includes an uplink operating band of 824-849 MHz and a downlink operating band of 869-894 MHz.
Abstract translation: 讨论了限制杂散发射的方法及其用户设备（UE）。 根据一个实施例的方法包括配置UE的射频（RF）单元以使用频带1; 如果RF单元被配置为使用频带1，则控制英国的RF单元将最大杂散发射电平限制为-50dBm，以保护另一UE使用频带5; 以及通过所配置的RF单元发送上行链路信号。 带1包括1920-1980MHz的上行链路工作频带和2110-2170MHz的下行链路工作频带。 带5包括824-849MHz的上行链路工作频带和869-894MHz的下行链路工作频带。
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公开(公告)号：US20250070449A1
公开(公告)日：2025-02-27
申请号：US18752272
申请日：2024-06-24
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An antenna module includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion having a plurality of antenna elements disposed on the PCB; and a plurality of signal connection lines configured to electrically connect a radio frequency integrated circuit (RFIC) chip to the array antenna portion. A second patch antenna of two patch antennas of the array antenna portion is disposed to be spaced apart from a first patch antenna and is disposed on one of the plurality of layers inside the PCB. The first patch antennas disposed on an outermost surface of the PCB are disposed in a first horizontal axis direction on the outermost surface. The second patch antennas are disposed in the first horizontal axis direction on an inner layer of the PCB.
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公开(公告)号：US20240387996A1
公开(公告)日：2024-11-21
申请号：US18787565
申请日：2024-07-29
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO , Yusuhk SUH , Dongik LEE
Abstract: Provided is an antenna module produced into a multi-layer substrate. The antenna module comprises: a first radiator disposed on an inner area or an upper area of the multi-layer substrate and formed into a first conductive layer to radiate a radio signal; a second radiator disposed in a lower area of the first radiator to be offset from the center of the first radiator, and formed into a second conductive layer to radiate a radio signal; and a feed line connected to the second radiator by means of a signal via, wherein the first radiator and the second radiator overlap on one axis, and the length of the first radiator on one axis and the length of the second radiator on one axis may differ from each other.
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Patent Agency Ranking
公开(公告)号：US20240266738A1
公开(公告)日：2024-08-08
申请号：US18293173
申请日：2021-07-29
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO , Yusuhk SUH , Dongik LEE
CPC classification number: H01Q5/50 , H01Q9/0414 , H05K1/0243 , H05K1/115
Abstract: Provided is an antenna module produced into a multi-layer substrate. The antenna module comprises: a first radiator disposed on an inner area or an upper area of the multi-layer substrate and formed into a first conductive layer to radiate a radio signal; a second radiator disposed in a lower area of the first radiator to be offset from the center of the first radiator, and formed into a second conductive layer to radiate a radio signal; and a feed line connected to the second radiator by means of a signal via, wherein the first radiator and the second radiator overlap on one axis, and the length of the first radiator on one axis and the length of the second radiator on one axis may differ from each other.
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公开(公告)号：US20240429623A1
公开(公告)日：2024-12-26
申请号：US18734973
申请日：2024-06-05
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; and an array antenna portion having a plurality of antenna elements disposed on the PCB. Each of the plurality of antenna elements is configured in a two-patch antenna structure, and a plurality of first patch antennas disposed on a first surface of the PCB are disposed to be spaced apart by a third gap. An area between the plurality of second patch antennas disposed inside the PCB includes a first region in which a plurality of second patch antennas are disposed to be spaced apart by a first gap, and a second region in which the plurality of second patch antennas are disposed to be spaced apart by a second gap.
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公开(公告)号：US20240429621A1
公开(公告)日：2024-12-26
申请号：US18645299
申请日：2024-04-24
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion including a plurality of antenna elements disposed on the PCB; a radio frequency integrated circuit (RFIC) chip bonded to a second surface of the PCB, the second surface being another outermost surface of the PCB; and a plurality of signal connection lines connected from the RFIC chip to the array antenna portion. A length of each of the plurality of signal connection lines may be a length of a connection line connected between the RFIC chip and the array antenna portion, and the plurality of signal connection lines may have the same length.
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公开(公告)号：US20240421496A1
公开(公告)日：2024-12-19
申请号：US18633090
申请日：2024-04-11
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An electronic device may include a display; and first and second antenna structures disposed around the display. The first antenna structure may include a first PCB, first and second array antennas, and a first wireless communication circuit. The second antenna structure may include a second PCB, third and fourth array antennas, and a second wireless communication circuit. The second and fourth array antennas may form a beam pattern in a first direction, which is a bottom direction. The first and third array antennas may form a beam pattern in a third direction, which is a front direction.
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公开(公告)号：US20240429622A1
公开(公告)日：2024-12-26
申请号：US18660877
申请日：2024-05-10
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An antenna module includes a substrate having a first surface, a second surface, and a periphery between the first and second surfaces, a first array antenna disposed on the first surface of the substrate and forming a beam pattern toward a front area, a second array antenna disposed on a first part of the periphery of the substrate and forming a beam pattern toward a bottom area, and third and fourth array antennas disposed on second and third parts of the periphery of the substrate and forming beam patterns toward side areas.
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