SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME 有权
    太阳能电池模块及其制造方法

    公开(公告)号:US20170069778A1

    公开(公告)日:2017-03-09

    申请号:US15261365

    申请日:2016-09-09

    Abstract: A solar cell module and a method for manufacturing the same are disclosed. The solar cell module includes solar cells each including a semiconductor substrate, and first electrodes and second electrodes extending in a first direction on a surface of the semiconductor substrate, conductive lines extended in a second direction crossing the first direction on the surface of the semiconductor substrate and connected to the first electrodes or the second electrodes through a conductive adhesive, and an insulating adhesive portion extending in the first direction on at least a portion of the surface of the semiconductor substrate, on which the conductive lines are disposed, and fixing the conductive lines to the semiconductor substrate and the first and second electrodes. The insulating adhesive portion is attached up to an upper part and a side of at least a portion of each conductive line.

    Abstract translation: 公开了太阳能电池模块及其制造方法。 太阳能电池模块包括每个包括半导体衬底的太阳能电池,以及在半导体衬底的表面上沿第一方向延伸的第一电极和第二电极,在与半导体衬底的表面上的第一方向交叉的第二方向上延伸的导电线 并且通过导电粘合剂连接到第一电极或第二电极,以及绝缘粘合剂部分,其在其上布置导电线的半导体衬底的表面的至少一部分上沿第一方向延伸,并且固定导电 线到半导体衬底和第一和第二电极。 绝缘粘合剂部分连接到每个导电线的至少一部分的上部和一侧。

    METHOD FOR MANUFACTURING SOLAR CELL MODULE
    3.
    发明申请

    公开(公告)号:US20180342639A1

    公开(公告)日:2018-11-29

    申请号:US15986356

    申请日:2018-05-22

    Abstract: A solar cell module includes solar cells each including a semiconductor substrate and first and second electrodes that extend in a first direction on a surface of the semiconductor substrate and have different polarities; conductive lines extended in a second direction crossing the first direction on the surface of the semiconductor substrate included in each solar cell and connected to the first electrodes or the second electrodes through a conductive adhesive; and an insulating adhesive portion extending in the first direction on at least a portion of the surface of the semiconductor substrate, on which the conductive lines are disposed, and temporarily fixing the conductive lines to the semiconductor substrate and the first and second electrodes, the insulating adhesive portion being attached on a back surface of least a portion of each conductive line as well as a side surface of at least a portion of each conductive line.

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