公开(公告)号：US20170006738A1

公开(公告)日：2017-01-05

申请号：US14882168

申请日：2015-10-13

Applicant: LG ELECTRONICS INC.

Inventor： Joseph LEE ,  Byungsoo KIM

IPC: H05K7/20 ,  H05K1/14 ,  H05K5/00

CPC classification number: H05K7/20963 ,  G02F1/13452 ,  G06F1/203 ,  H04B1/3888 ,  H05K1/148 ,  H05K5/0017 ,  H05K2201/041 ,  H05K2201/05 ,  H05K2201/10128

Abstract: There is disclosed a mobile terminal including a display unit comprising a drive IC provided in a predetermined portion, a frame provided in a rear surface of the display unit, a flexible printed circuit board having one portion connected to the drive IC of the display unit and the other portion bent toward the rear surface of the display unit, a main board coupled to the frame and configured to control the drive IC via the flexible printed circuit board, and a heat transfer sheet configured to cover a front surface of the display unit and a predetermined portion of the first surface of the flexible printed circuit board, wherein at least predetermined portion of the heat transfer sheet is in contact with the frame, so that the heat generated in the drive IC and the light source of the display unit may be transferred to the frame and that the performance deterioration of the mobile terminal caused by the local overheat may be reduced and the difficulty in the user's holding the mobile terminal may be also reduced.

Abstract translation: 公开了一种移动终端，包括：显示单元，包括设置在预定部分中的驱动IC，设置在显示单元的后表面中的框架;柔性印刷电路板，其一部分连接到显示单元的驱动IC; 所述另一部分朝向所述显示单元的后表面弯曲;主板，其联接到所述框架并且被配置为经由所述柔性印刷电路板控制所述驱动IC;以及传热片，其被配置为覆盖所述显示单元的前表面，以及 柔性印刷电路板的第一表面的预定部分，其中传热片的至少预定部分与框架接触，使得在驱动IC和显示单元的光源中产生的热量可以是 转移到帧，并且可能减少由局部过热引起的移动终端的性能恶化，并且用户持有移动设备的难度 终端也可以减少。

公开(公告)号：US20200100389A1

公开(公告)日：2020-03-26

申请号：US16467393

申请日：2016-12-07

Applicant: LG ELECTRONICS INC.

Inventor： Kyungui PARK ,  Jaewoong LEE ,  Sanghoon KIM ,  Joseph LEE ,  Chansin PARK

IPC: H05K7/20 ,  H04M1/02 ,  H05K5/00

Abstract: A mobile terminal including a metal frame; a circuit board including at least one processor chip; a shield member mounted on the circuit board and shielding the at least one processor chip; and a heat pipe including a heat plate part contacting the shield member and a heat transfer unit transferring heat generated by the least one processor. Further, the heat plate part and the heat transfer unit are integrally engaged via a soldering part positioned in an overlapped area between the heat plate part and the heat transfer unit.

公开(公告)号：US20150342089A1

公开(公告)日：2015-11-26

申请号：US14559616

申请日：2014-12-03

Applicant: LG ELECTRONICS INC.

Inventor： Byungsoo KIM ,  Joseph LEE ,  Kyungui PARK ,  Wonkee AHN ,  Donghyun KIM

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H04M1/026

Abstract: A mobile terminal having a structure increasing heat dissipation efficiency, including a printed circuit board (PCB) disposed within a terminal body and having a heating element which generates heat mounted thereon, a frame having a space formed on one surface thereof and allowing the PCB to be installed therein, and a heat pipe supported by the frame, disposed on one surface of the frame, and connected to the PCB to dissipate heat generated by the heating element outwardly from the terminal body, wherein the frame includes a hold portion extending from an end portion thereof to cover at least a portion of the heat pipe in order to prevent the heat pipe from being released from the frame by external force applied to the terminal body.

Abstract translation: 一种具有提高散热效率的结构的移动终端，包括设置在终端主体内的印刷电路板（PCB），并且具有产生安装在其上的热量的加热元件，具有形成在其一个表面上的空间的框架， 安装在其中，以及由所述框架支撑的热管，设置在所述框架的一个表面上，并且连接到所述PCB，以从所述终端主体向外散出由所述加热元件产生的热量，其中，所述框架包括保持部分， 其端部以覆盖热管的至少一部分，以便防止热管通过施加到终端主体的外力而从框架释放。

公开(公告)号：US20190121407A1

公开(公告)日：2019-04-25

申请号：US15946871

申请日：2018-04-06

Applicant: LG ELECTRONICS INC.

Inventor： Joseph LEE ,  Sanghoon KIM ,  Kyungui PARK ,  Chansin PARK ,  Jaewoong LEE ,  Sukwon JANG

IPC: G06F1/20 ,  H01L23/473 ,  G06F1/18

Abstract: A mobile terminal includes: a terminal body; a circuit board installed in the terminal body; an electronic device mounted to at least one surface of the circuit board; a shield can installed on the circuit board so as to cover the electronic device, and configured to shield electromagnetic waves generated from the electronic device; and a cooling fluid filled in an inner space defined by the circuit board and the shield can, and configured to cool the electronic device.

公开(公告)号：US20150350392A1

公开(公告)日：2015-12-03

申请号：US14643784

申请日：2015-03-10

Applicant: LG ELECTRONICS INC.

Inventor： Kyungui PARK ,  Donghyun KIM ,  Joseph LEE ,  Wonkee AHN ,  Donghyun KIM ,  Changwoo SONG

IPC: H04M1/02 ,  H05K7/20

CPC classification number: H04M1/0202 ,  G04G21/00 ,  H05K7/20336 ,  H05K7/2039

Abstract: A watch type mobile terminal includes a main body configured to include an electric apparatus unit in which an electronic part is mounted, a band configured to be worn on a wrist of a user in a manner of being combined with the main body, a heat pipe configured to include a first pipe positioned at the main body and a second pipe positioned at the band wherein the first pipe and the second pipe forms a loop in a manner of being connected with each other, a first working fluid injected into the heat pipe and a second working fluid different from the first working fluid in density. The watch type mobile terminal can emit heat of the main body at the band using the heat pipe.

Abstract translation: 手表式移动终端包括主体，其被构造成包括其中安装有电子部件的电气设备单元，被配置为以与主体组合的方式佩戴在用户的手腕上的带;热管 被配置为包括位于主体处的第一管和位于所述带处的第二管，其中所述第一管和所述第二管以彼此连接的方式形成环，将第一工作流体注入到所述热管中， 与第一工作流体密度不同的第二工作流体。 表型移动终端可以使用热管在带上发射主体的热量。

公开(公告)号：US20180007181A1

公开(公告)日：2018-01-04

申请号：US15545599

申请日：2015-03-23

Applicant: LG ELECTRONICS INC.

Inventor： Joseph LEE ,  Donghyun KIM ,  Kyungui PARK

IPC: H04M1/02 ,  H05K7/20

CPC classification number: H04M1/0202 ,  H05K5/04 ,  H05K7/20 ,  H05K7/20454 ,  H05K7/20472 ,  H05K7/20481 ,  H05K9/0024

Abstract: There is disclosed a mobile terminal including a case comprising an electric control unit in which electronic components are loaded; a display unit coupled to a front surface of the case; a frame coupled to the case and supporting a rear surface of the display unit, the frame comprising a metallic material; a mainboard loaded in the case; a drive chip loaded in the mainboard; a shield can covering components loaded in the mainboard, the shied comprising a hole formed, corresponding to the drive chip; a thermal conductivity sheet comprising one surface in contact with a top surface of the drive chip and the other surface in contact with an inner surface of the frame; and a flexible material insertedly filling in a space formed between the thermal conductivity sheet and the frame, so that the heat generated in the drive chip of the mobile terminal may be effectively emitted and that only the portion of the mobile terminal, where the drive chip is loaded, may be prevented from being heated when the user is using the mobile terminal and the other components may be prevented from being damaged by the heat.

公开(公告)号：US20160037681A1

公开(公告)日：2016-02-04

申请号：US14776795

申请日：2013-08-21

Applicant: LG ELECTRONICS INC. ,  KOREA UNIVERSITY RESEARCH & BUSINESS FOUNDATION

Inventor： Joseph LEE ,  Wonkee AHN ,  Dongsoo JANG ,  Eunji LEE ,  Yonghee JANG ,  Kyungui PARK ,  Yongchan KIM

IPC: H05K7/20 ,  H04M1/02

CPC classification number: H05K7/20272 ,  F28D15/0233 ,  F28D15/0266 ,  H04B1/036 ,  H04M1/0254

Abstract: There is disclosed a mobile terminal including a case comprising a control portion provided therein, a display coupled to the case, a main circuit board mounted in a predetermined portion of the control portion, a heat exchanger having a portion arranged adjacent to the main circuit board, with a plurality of micro-paths extended from the portion to the other portion, each of the micro-paths connected to a neighboring one to form a closed loop, and a working fluid configured to absorb heat in the portion and emit the heat in the other portion, to be liquefied, the working fluid configured to vibrate along the micro-paths, wherein a gaseous state working fluid and a liquid state working fluid are mixed intermittently.

Abstract translation: 公开了一种移动终端，包括壳体，其中设置有控制部分，耦合到壳体的显示器，安装在控制部分的预定部分中的主电路板;热交换器，具有邻近主电路板布置的部分 具有从所述部分延伸到另一部分的多个微通道，每个所述微通路连接到相邻的微通道以形成闭合回路，以及工作流体，其被配置为吸收所述部分中的热量并且将热量发射到 要液化的另一部分，被配置为沿着微通道振动的工作流体，其中气态工作流体和液态工作流体间歇地混合。

公开(公告)号：US20230188630A1

公开(公告)日：2023-06-15

申请号：US17920987

申请日：2020-04-24

Applicant: LG ELECTRONICS INC.

Inventor： Donghyun KIM ,  Shinhyun CHO ,  Joseph LEE ,  Jinwoo PARK

IPC: H04M1/02

CPC classification number: H04M1/0235 ,  H04M1/0268 ,  H04M2201/38

Abstract: A mobile terminal that can be switched to a first state or a second state comprises: a first frame; a second frame that can be switched to the second state by sliding from the first frame in a first direction, and that can be switched to the first state by sliding in a second direction opposite to the first direction; and a low-friction sheet positioned on at least one side of an overlapping surface of the first frame and the second frame, wherein friction can be minimized during sliding of the mobile terminal, and thereby driving energy can be saved and noise generated by friction can be prevented.

公开(公告)号：US20210041926A1

公开(公告)日：2021-02-11

申请号：US16967713

申请日：2018-03-14

Applicant: LG ELECTRONICS INC.

Inventor： Kyungui PARK ,  Byungsun KIM ,  Wook KIM ,  Joseph LEE

IPC: G06F1/20 ,  H05K1/02 ,  H05K9/00 ,  H05K7/20 ,  H04B1/3827

Abstract: The present invention relates to a mobile terminal comprising: a terminal body; a circuit board mounted inside the terminal body; an electronic device mounted on one surface of the circuit board; a shield can provided on the circuit board so as to surround the electronic device and shielding electromagnetic waves generated from the electronic device; a metal plate coupled to the shield can and made of a material having high thermal conductivity; and a heat pipe which is positioned to face the shield can with the metal plate interposed therebetween and has a flow path to accommodate a fluid at a center portion thereof, wherein the metal plate and the heat pipe are integrally formed, and heat generated in the electronic device can be transmitted to the heat pipe through the metal plate.