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公开(公告)号：US20230126933A1
公开(公告)日：2023-04-27
申请号：US17971448
申请日：2022-10-21
发明人： Jaeyong AN , Minwoo LEE , Yangwoo BYUN , Kisu KIM
IPC分类号： H01L33/38 , H01L33/62 , H01L25/075
摘要： A display device can include a first assembly electrode disposed on a substrate, a second assembly electrode disposed above the first assembly electrode, and the first assembly electrode, an insulating layer disposed between the second assembly electrodes, an assembling partition including an assembly hole and disposed on the second assembly electrode, and a semiconductor light emitting device disposed in the assembly hole and electrically connected to the second assembly electrode.
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2.发明公开公开(公告)号：US20230299064A1
公开(公告)日：2023-09-21
申请号：US18123738
申请日：2023-03-20
发明人： Yangwoo BYUN , Jaeyong AN
CPC分类号： H01L25/167 , H01L33/62
摘要： Discussed is a display device including a semiconductor light emitting device. The display device according to the embodiment can include a substrate, a first assembly electrode disposed on the substrate, a second assembly electrode disposed on the first assembly electrode, an insulating layer disposed between the first assembly electrode and the second assembly electrode, a metal layer disposed on the insulating layer and disposed to vertically overlap the first assembly electrode, and an assembly wall having an assembly hole and disposed on the metal layer and the second assembly electrode.
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公开(公告)号：US20230187580A1
公开(公告)日：2023-06-15
申请号：US18077992
申请日：2022-12-08
发明人： Yangwoo BYUN , Jaeyong AN
摘要： The embodiment relates to a display device including a semiconductor light emitting device. A display device including the semiconductor light emitting device according to an embodiment can include a substrate, a first assembly electrode disposed on the substrate, a second assembly electrode branched and disposed above the first assembly electrode, an insulating layer disposed between the first assembly electrode and the second assembly electrode, an assembly barrier wall including a predetermined assembly hole and disposed on the second assembly electrode, and a semiconductor light emitting diode disposed in the assembly hole and electrically connected to the second assembly electrode.
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公开(公告)号：US20220373787A1
公开(公告)日：2022-11-24
申请号：US17755062
申请日：2019-10-25
申请人： LG ELECTRONICS INC.
发明人： Byounggoo LEE , Joodo PARK , Jaeyong AN , Sangcheon KIM
摘要： The present disclosure relates to a scanner and an electronic apparatus including the scanner. The scanner according to the present disclosure comprises a mirror, a substrate separated from the outside of the mirror, a first and a second mirror support member, a first and a second mirror spring, and a plurality of combs formed on the substrate and to supply a rotational force based on electrostatic force to the mirror, wherein the substrate includes a first edge and a second edge closer to the mirror than the first edge and placed at a lower position than the first edge, and the optical interference angle at the second edge is greater than the optical interference angle at the first edge. Accordingly, it is possible to output light in both directions of a mirror and thereby to perform wide-angle scanning.
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5.发明公开公开(公告)号：US20240297156A1
公开(公告)日：2024-09-05
申请号：US18270786
申请日：2021-01-04
申请人： LG ELECTRONICS INC.
发明人： Jaeyong AN , Joodo PARK
IPC分类号： H01L25/075 , H01L25/16
CPC分类号： H01L25/0753 , H01L25/167
摘要： The present invention is applicable to a display device-related technical field and relates to, for example, a substrate assembly of a display device using a micro light-emitting diode (LED) and to a method for manufacturing same. The present invention relates to a method for assembling individual light-emitting diodes on a plurality of individual device regions of a first substrate assembly in which the plurality of individual device regions are partitioned on a first substrate and first electrodes are positioned in the individual device regions, wherein the method may comprise the steps of: positioning a second substrate assembly including an insulation layer positioned on the first substrate assembly, second electrodes positioned on the insulation layer, and a second substrate positioned on the second electrodes; injecting a fluid in which a plurality of light-emitting diodes are dispersed between the first substrate assembly and the second substrate assembly; and flowing the plurality of light-emitting diodes; and assembling at least one of the plurality of light-emitting diodes on the first electrodes positioned in the individual device regions.
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