SCANNER AND ELECTRONIC DEVICE HAVING SAME

    公开(公告)号:US20220373787A1

    公开(公告)日:2022-11-24

    申请号:US17755062

    申请日:2019-10-25

    Abstract: The present disclosure relates to a scanner and an electronic apparatus including the scanner. The scanner according to the present disclosure comprises a mirror, a substrate separated from the outside of the mirror, a first and a second mirror support member, a first and a second mirror spring, and a plurality of combs formed on the substrate and to supply a rotational force based on electrostatic force to the mirror, wherein the substrate includes a first edge and a second edge closer to the mirror than the first edge and placed at a lower position than the first edge, and the optical interference angle at the second edge is greater than the optical interference angle at the first edge. Accordingly, it is possible to output light in both directions of a mirror and thereby to perform wide-angle scanning.

    DISPLAY DEVICE
    4.
    发明申请

    公开(公告)号:US20250081696A1

    公开(公告)日:2025-03-06

    申请号:US18727264

    申请日:2022-01-14

    Abstract: The display device can include a substrate, a first assembling wiring on the substrate, a second assembling wiring on the first assembling wiring, an insulating layer between the first assembling wiring and the second assembling wiring, a partition wall disposed on the second assembling wiring and having an assembly hole, and a semiconductor light-emitting device in the assembly hole. A part of the second assembling wiring can be disposed at a center of the assembly hole, and a width of a part of the second assembling wiring can be smaller than a diameter of the assembly hole.

    SUBSTRATE ASSEMBLY OF DISPLAY DEVICE USING LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:US20240297156A1

    公开(公告)日:2024-09-05

    申请号:US18270786

    申请日:2021-01-04

    CPC classification number: H01L25/0753 H01L25/167

    Abstract: The present invention is applicable to a display device-related technical field and relates to, for example, a substrate assembly of a display device using a micro light-emitting diode (LED) and to a method for manufacturing same. The present invention relates to a method for assembling individual light-emitting diodes on a plurality of individual device regions of a first substrate assembly in which the plurality of individual device regions are partitioned on a first substrate and first electrodes are positioned in the individual device regions, wherein the method may comprise the steps of: positioning a second substrate assembly including an insulation layer positioned on the first substrate assembly, second electrodes positioned on the insulation layer, and a second substrate positioned on the second electrodes; injecting a fluid in which a plurality of light-emitting diodes are dispersed between the first substrate assembly and the second substrate assembly; and flowing the plurality of light-emitting diodes; and assembling at least one of the plurality of light-emitting diodes on the first electrodes positioned in the individual device regions.

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