公开(公告)号：US20140048316A1

公开(公告)日：2014-02-20

申请号：US13968812

申请日：2013-08-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Jin YUN ,  Hyuk Soo LEE ,  In Hee CHO ,  Jae Man PARK ,  Myeong Jeong KIM ,  Jong Heum YOON ,  Jeung Ook PARK ,  Jong Sik LEE ,  Gun Young GIL ,  Thanh Kieu GIANG ,  Jin Hwan KIM

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K1/0373 ,  C08G59/28 ,  C08G59/30 ,  C08K3/013 ,  C08L63/00 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0209 ,  C08K3/0033

Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

Abstract translation: 提供了包含环氧树脂的环氧树脂化合物，该环氧树脂包括结晶环氧树脂，固化剂和无机填料。 另外，提供了一种辐射热电路板，其包括金属板，形成在金属板上的绝缘层; 以及形成在绝缘层上的电路图案，其中通过固化包括结晶环氧树脂，固化剂和无机填料的环氧树脂的环氧树脂化合物来形成绝缘层。