公开(公告)号：US20180327595A1

公开(公告)日：2018-11-15

申请号：US15776501

申请日：2016-11-17

Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.

Inventor： Noriaki FUKUDA ,  Ryota HARISAKI ,  Katsumasa YAMAMOTO ,  Nobukatsu NEMOTO

IPC: C08L83/12 ,  C08L63/00 ,  C08K3/22 ,  C08K3/26 ,  C08K3/36 ,  C08L37/00 ,  C08K3/38

CPC classification number: C08L83/12 ,  C08G59/30 ,  C08K3/00 ,  C08K3/22 ,  C08K3/26 ,  C08K3/36 ,  C08K3/38 ,  C08K2003/2227 ,  C08K2003/265 ,  C08K2003/382 ,  C08L37/00 ,  C08L63/00 ,  C08L2203/20 ,  H01L23/29 ,  H01L23/31

Abstract: Provided are an epoxy resin composition that can achieve a sufficiently low viscosity without using a diluent (an organic solvent), and a method for producing the same. Also provided are an epoxy resin composition that can preferably achieve, when cured, good electrical characteristics (particularly low dielectric constant and low dielectric loss tangent), high adhesion strength to metal, and good water absorption characteristics; and a method for producing the same.

公开(公告)号：US09777107B2

公开(公告)日：2017-10-03

申请号：US15023263

申请日：2014-09-19

Applicant: Shin-Etsu Chemical Co., Ltd. ,  Nippon Kayaku Kabushiki Kaisha

Inventor： Toshio Shiobara ,  Junichi Sawada ,  Miyuki Wakao ,  Tsutomu Kashiwagi ,  Naofusa Miyagawa ,  Yoshihiro Kawada ,  Chie Sasaki ,  Masataka Nakanishi ,  Kenichi Kuboki

IPC: C08G59/30

CPC classification number: C08G59/306 ,  C08G59/30

Abstract: An epoxy resin represented by the following formula (1) wherein R1 represents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; R2 represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R3 represents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R1, R2, R3, k, or m present in the formula may be the same or different from each other.

公开(公告)号：US20150332806A1

公开(公告)日：2015-11-19

申请号：US14651913

申请日：2013-12-10

Applicant: ZEON CORPORATION

Inventor： Shuhei Hayakawa ,  Yuki Hayashi

IPC: H01B3/40 ,  C08K3/36 ,  B32B27/20 ,  B32B27/38 ,  B32B27/32 ,  B32B27/12 ,  C08J5/18 ,  B32B27/08

CPC classification number: H01B3/40 ,  B32B27/08 ,  B32B27/12 ,  B32B27/20 ,  B32B27/325 ,  B32B27/38 ,  B32B2250/24 ,  B32B2307/206 ,  C08G59/30 ,  C08J5/18 ,  C08J5/24 ,  C08J2323/26 ,  C08J2463/00 ,  C08K3/013 ,  C08K3/36 ,  C08K5/49 ,  C08L63/00 ,  H05K1/0353 ,  Y10T428/265 ,  Y10T428/31511 ,  C08L47/00

Abstract: Disclosed is a curable resin composition including: a phosphorus-containing epoxy compound (A2) having a structure represented by formula (1) or (2) below; and a filler (A3), where in the formula (1), R1 and R2 each independently represent a hydrocarbon group having 1 to 6 carbon atoms, and m and n each independently represent an integer of 0 to 4, R1s may be the same or different when m is 2 or more, and R2s may be the same or different when n is 2 or more, and where in the formula (2), R3 and R4 each independently represent a hydrocarbon group having 1 to 6 carbon atoms, and o and p each independently represent an integer of 0 to 5, R3s may be the same or different when o is 2 or more, and R4s may be the same or different when p is 2 or more.

Abstract translation: 公开了一种可固化树脂组合物，其包含：具有由下式（1）或（2）表示的结构的含磷环氧化合物（A2） 和填料（A3），其中在式（1）中，R 1和R 2各自独立地表示具有1至6个碳原子的烃基，m和n各自独立地表示0至4的整数，R 1可以相同 或者当m为2以上时为不同，且当n为2以上时，R 2可以相同或不同，在式（2）中，R 3和R 4各自独立地表示碳原子数1〜6的烃基， o和p各自独立地表示0〜5的整数，当o为2以上时，R 3可以相同或不同，并且当p为2以上时，R 4可以相同或不同。

公开(公告)号：US08895652B2

公开(公告)日：2014-11-25

申请号：US12607281

申请日：2009-10-28

Applicant: Anoop Agrawal ,  John P Cronin

Inventor： Anoop Agrawal ,  John P Cronin

IPC: C08K3/20 ,  G02B19/00 ,  C08G59/30 ,  G02B27/09 ,  H01L33/56 ,  C08K3/22 ,  H01L33/50

CPC classification number: G02B27/0955 ,  C08G59/30 ,  C08K3/22 ,  G02B19/0014 ,  G02B19/0061 ,  G02B19/0095 ,  H01L33/501 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: This invention discloses composite materials utilizing high refractive index materials and their use with phosphors, LED packaging and as fillers in polymers and in polymer blends.

Abstract translation: 本发明公开了使用高折射率材料的复合材料及其在磷光体，LED封装和聚合物和聚合物共混物中的填料的应用。

公开(公告)号：US08575238B2

公开(公告)日：2013-11-05

申请号：US13691075

申请日：2012-11-30

Applicant: Raytheon Company

Inventor： Thomas K. Dougherty ,  Christopher T. Snively ,  Steven E. Lau ,  William J. Wolfgong ,  Cindy W. Ma ,  Stephen L. Schrader

IPC: C08G59/06 ,  C08K3/08 ,  C08K3/10 ,  C08L63/02

CPC classification number: H01L23/552 ,  C08G59/063 ,  C08G59/226 ,  C08G59/30 ,  C08G59/3254 ,  C09D163/00 ,  H01L23/573 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodephenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at last one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to- a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.

Abstract translation: 本公开涉及含有包含共价结合到缩水甘油醚的碘化苯酚的环氧树脂的X射线不透明涂层。 共价键合到缩水甘油醚的碘化苯酚可以包括碘化双酚A，例如四碘双酚A，单碘苯酚的缩水甘油醚，双碘苯酚，三碘苯酚或其组合。 涂层可以包括X射线不透明的无机填料。 本公开还涉及包括衬底的电子部件，并且最后一个器件耦合到衬底，其中设置在衬底上的混淆层，用于使器件从X射线源模糊。 混淆层可以包括X射线不透明涂层。 本公开还涉及通过沉积可包括X射线不透明涂层的混淆层和形成X射线不透明涂层的方法来模糊电子部件的至少一部分的方法。

公开(公告)号：US08470938B2

公开(公告)日：2013-06-25

申请号：US10559556

申请日：2003-06-03

Applicant: Hidetsugu Motobe ,  Akinori Hibino ,  Katsuhiko Ito

Inventor： Hidetsugu Motobe ,  Akinori Hibino ,  Katsuhiko Ito

IPC: C08F283/00 ,  B32B27/04 ,  B32B27/38

CPC classification number: C08G59/621 ,  C08G59/063 ,  C08G59/226 ,  C08G59/30 ,  C08G59/38 ,  C08G59/686 ,  H05K1/0326 ,  Y10T428/31511 ,  Y10T442/2713

Abstract: An epoxy resin composition for use in producing a prepreg for printed wiring boards excellent in appearance, flame retardancy, etc., which comprises an epoxy resin, a phenolic novolak, and a curing accelerator. It is characterized in that the epoxy resin comprises an epoxy (a) and an epoxy (b), wherein the epoxy (a) is a brominated epoxy resin which is obtained by reacting/mixing a bisphenol A epoxy resin with tetrabromobisphenol A and has an epoxy equivalent of 350 to 470 g/eq and an n=0 component content of 20 to 35% in terms of areal percentage in a GPC chart, and the epoxy (b) is at least one bifunctional epoxy resin which is obtained by reacting any one selected from the group consisting of bisphenol A, bisphenol F, and tetrabromobisphenol A with epichlorohydrin and has an n=0 component content as determined from a GPC chart of 60% or higher.

Abstract translation: 一种环氧树脂组合物，其用于制造外观，阻燃性等优异的印刷线路板用预浸料，其包含环氧树脂，酚醛清漆和固化促进剂。 其特征在于环氧树脂包括环氧树脂（a）和环氧树脂（b），其中环氧（a）是通过使双酚A环氧树脂与四溴双酚A反应/混合获得的溴化环氧树脂，并且具有 环氧当量为350〜470g / eq，n = 0成分含量为GPC图中的面积百分比为20〜35％，环氧（b）为至少一种双官能环氧树脂，其通过使任何 一种选自双酚A，双酚F和四溴双酚A与表氯醇，并且由GPC图表确定为n = 0的成分含量为60％以上。

公开(公告)号：US20100311867A1

公开(公告)日：2010-12-09

申请号：US12856542

申请日：2010-08-13

Applicant: Young-Min Kim

Inventor： Young-Min Kim

IPC: C09D5/29 ,  C08L63/00

CPC classification number: C08L63/00 ,  C04B26/14 ,  C04B2111/545 ,  C08G59/30 ,  C04B14/28 ,  C04B24/42 ,  C04B2103/14 ,  C04B2103/50 ,  C04B2103/54

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract translation: 提供一种用于制造包括卤化环氧树脂粘合剂的大理石碎片的树脂组合物，并且显示出高耐热性，高耐化学性，高耐冲击性，高比重和高透明度的树脂组合物，使用该树脂组合物的大理石碎片制造方法和人造 由大理石碎片制成的大理石。

公开(公告)号：US07566758B2

公开(公告)日：2009-07-28

申请号：US11290539

申请日：2005-12-01

Applicant: Akihiko Shimomura ,  Hiromichi Noguchi ,  Isao Imamura

Inventor： Akihiko Shimomura ,  Hiromichi Noguchi ,  Isao Imamura

IPC: C08L63/00

CPC classification number: C08G59/68 ,  B41J2/1606 ,  C08G59/226 ,  C08G59/30 ,  C08G59/3254 ,  C08G59/38

Abstract: An embodiment of the invention relates to a novel epoxy resin composition. The epoxy resin composition comprises (i) a first epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, and having a number average molecular weight ranging from 8,000 to 22,000 and a polydispersity ranging from 3.5 to 5.0, (ii) a second epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, having a number average molecular weight ranging from 2,500 to 8,000 and a polydispersity ranging from 1.5 to 3.0, and (iii) a cationic polymerization catalyst.

Abstract translation: 本发明的一个实施方案涉及新的环氧树脂组合物。 环氧树脂组合物包含（i）在其分子中具有至少一个拒斥赋予基团和两个或更多个环状脂族环氧基团的数均分子量为8,000至22,000的第一环氧树脂和多分散性 （ii）在分子中具有数均分子量为2,500-8,000的至少一种拒水赋予基团和两个或更多个环状脂肪族环氧基的第二环氧树脂，和多分散性 范围为1.5至3.0，和（iii）阳离子聚合催化剂。

公开(公告)号：US20090159313A1

公开(公告)日：2009-06-25

申请号：US12097647

申请日：2006-12-20

Applicant: Ludovic Valette ,  Tomoyuki Aoyama

Inventor： Ludovic Valette ,  Tomoyuki Aoyama

IPC: H05K1/00 ,  C08L63/00 ,  B32B27/38 ,  B05D3/02 ,  D03D25/00 ,  B32B15/092

CPC classification number: C08G59/621 ,  C08G59/30 ,  C08G59/4014 ,  C08G59/4223 ,  C08J5/24 ,  C08J2363/02 ,  C08K5/13 ,  H05K1/0326 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T442/30

Abstract: A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; (c) a catalytic amount of a nitrogen-containing catalyst; (d) a non-nitrogen containing catalyst adjuvant compound capable of reducing the concentration of the nitrogen-containing catalyst; wherein at least one of the above components (a)-(d) is halogenated or wherein the resin composition includes (e) a halogenated flame retardant compound. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 1700C; and the resultant cured product formed by curing the curable epoxy resin composition contains well-balanced properties. The composition may be used to obtain a prepreg or a metal-coated foil, or a laminate by laminating the above prepreg and/or the above metal-coated foil. The laminate shows a combination of superior glass transition temperature, decomposition temperature, time to delamination at 288° C., adhesion to copper foil, and excellent flame retardancy.

Abstract translation: 一种可固化含卤素的环氧树脂组合物，其包含：（a）至少一种环氧树脂; （b）至少一种硬化剂; 其中所述固化剂是含有酚羟基官能团的化合物或在加热时能够产生酚羟基官能团的化合物; （c）催化量的含氮催化剂; （d）能够降低含氮催化剂浓度的不含氮的催化剂助剂; 其中上述组分（a） - （d）中的至少一种是卤化的或其中树脂组合物包含（e）卤化阻燃化合物。 当在170℃下测量时，树脂组合物的冲程固化凝胶时间保持为90秒至600秒; 通过固化可固化环氧树脂组合物形成的所得固化产物具有良好平衡的性能。 该组合物可以用于通过层压上述预浸料和/或上述金属涂覆的箔来获得预浸料或金属涂覆的箔或层压体。 该层压板显示优异的玻璃化转变温度，分解温度，288℃下分层时间，对铜箔的粘附性和优异的阻燃性的组合。

公开(公告)号：US07521120B2

公开(公告)日：2009-04-21

申请号：US11284610

申请日：2005-11-22

Applicant: Mok Yong Jung ,  Eunhae Koo

Inventor： Mok Yong Jung ,  Eunhae Koo

IPC: B32B15/092 ,  B32B27/04 ,  B32B27/38 ,  C08L63/00

CPC classification number: C08G59/3254 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/12 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/31 ,  B32B2307/5825 ,  B32B2307/712 ,  B32B2457/08 ,  B32B2459/00 ,  C08G59/30 ,  C08G59/56 ,  C08G59/621 ,  H05K1/0326 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529

Abstract: Provided are a non-halogen flame retardant epoxy resin composition comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent of an amine curing agent and a phenolic curing agent and (D) a metal hydrate inorganic flame retardant, and a prepreg and copper-clad laminate using the same. The epoxy resin composition in accordance with the present invention exhibits excellent flame retardancy without use of a halogen flame retardant, and also advantageously provides well-balanced various physical properties which are to be required in copper-clad laminates, such as higher heat resistance and copper peel strength, and lead heat-resistant characteristics after moisture absorption.

Abstract translation: 提供一种无卤阻燃环氧树脂组合物，其包含（A）含硅磷改性环氧树脂，（B）多官能环氧树脂，（C）胺固化剂的混合固化剂和酚固化 试剂和（D）金属水合物无机阻燃剂，以及使用其的预浸料和覆铜层压板。 根据本发明的环氧树脂组合物在不使用卤素阻燃剂的情况下显示出优异的阻燃性，并且还有利地提供了良好平衡的各种物理性能，其在覆铜层压板中需要，例如较高的耐热性和铜 剥离强度和吸湿后的铅耐热特性。