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公开(公告)号：US20220078924A1
公开(公告)日：2022-03-10
申请号：US17305949
申请日：2021-07-19
摘要： An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.
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公开(公告)号：US20200341525A1
公开(公告)日：2020-10-29
申请号：US16855377
申请日：2020-04-22
摘要： An electronic apparatus is disclosed. The electronic apparatus includes a chassis member, a processor provided inside the chassis member, a prong portion provided on the chassis member, a heat spreader provided inside the chassis member to transport heat generated by the processor, and a hook provided to the heat spreader and to be engaged with the prong portion. The hook includes arms extending in an engagement direction in which the hook is engaged with the prong portion, and an engagement piece connected to the arms and extending in the lateral direction. The prong portion includes a projection projecting in the outward direction to be engaged with the engagement piece. The engagement piece is in line contact or point contact with the projection, as to the engagement direction. The arms are not in contact with the projection as to the lateral direction.
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公开(公告)号：US20210015007A1
公开(公告)日：2021-01-14
申请号：US16924093
申请日：2020-07-08
发明人： Ryota Watanabe , Hiroshi Yamazaki , Misa Shimada
摘要： A thermal module for suppressing surface temperature of a chassis is disclosed. The thermal module includes a flexible heat conductive sheet, a frame having openings covered by the heat conductive sheet, and a heat pipe that contacts the heat conductive sheet through various openings of the frame.
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公开(公告)号：US11751341B2
公开(公告)日：2023-09-05
申请号：US17305949
申请日：2021-07-19
CPC分类号： H05K5/0008 , F16B35/00 , F16B43/00 , G06F1/1628 , H05K7/205
摘要： An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.
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公开(公告)号：US20190037725A1
公开(公告)日：2019-01-31
申请号：US16040317
申请日：2018-07-19
发明人： Akinori Uchino , Kazuo Fujii , Takuroh Kamimura , Kenji Watamura , Hiroshi Yamazaki , Takanori Hoshino
摘要： An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.
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公开(公告)号：US11547017B2
公开(公告)日：2023-01-03
申请号：US17358772
申请日：2021-06-25
摘要： A cooling module reduces the number of parts and achieves weight reduction. An electronic apparatus includes: the cooling module; a chassis; first and second heating elements provided inside the chassis; and a cooling module configured to absorb heat generated by the first and second heating elements. The cooling module includes: a vapor chamber in which a sealed space is formed in a portion sandwiched between first and second metal plates and working fluid is sealed in the sealed space, the second metal plate having an outer shape larger than that of the first metal plate; a metal frame formed in a portion of the second metal plate, the portion of the second metal plate protruding from the outer shape of the first metal plate; and a heat conduction plate supported by the metal frame, the heat conduction plate containing graphene.
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公开(公告)号：US20210076537A1
公开(公告)日：2021-03-11
申请号：US17006218
申请日：2020-08-28
发明人： Tsutomu Chonan , Shogo Akiyama , Hiroshi Yamazaki
IPC分类号： H05K7/20
摘要： A heat dissipation mechanism is provided. The heat dissipation mechanism includes a heat receiving plate and a heat transport member. The heat receiving plate includes a heat receiving surface surrounded by a recessed portion. The heat receiving surface is to be in contact with a heat transfer region of an electronic component in order to receive heat generated by the electronic component while the recessed portion receives at least one corner of the heat transfer region when viewed from a direction perpendicular to the heat receiving surface. The heat transport member transfers heat away from the heat receiving plate.
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公开(公告)号：US20220015260A1
公开(公告)日：2022-01-13
申请号：US17358772
申请日：2021-06-25
摘要： A cooling module reduces the number of parts and achieves weight reduction. An electronic apparatus includes: the cooling module; a chassis; first and second heating elements provided inside the chassis; and a cooling module configured to absorb heat generated by the first and second heating elements. The cooling module includes: a vapor chamber in which a sealed space is formed in a portion sandwiched between first and second metal plates and working fluid is sealed in the sealed space, the second metal plate having an outer shape larger than that of the first metal plate; a metal frame formed in a portion of the second metal plate, the portion of the second metal plate protruding from the outer shape of the first metal plate; and a heat conduction plate supported by the metal frame, the heat conduction plate containing graphene.
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公开(公告)号：US20210337699A1
公开(公告)日：2021-10-28
申请号：US17171107
申请日：2021-02-09
发明人： Ryota Watanabe , Akinori Uchino , Hiroshi Yamazaki
摘要： A heat transport device includes: a sub heat sink which extends along a surface of a main board on which a chip is mounted, and which has a sheet mounting hole formed in a portion including the chip as observed in plan view; a main heat sink which extends along a back surface opposite from the mounting surface and which is in thermal contact at a position on the back surface that corresponds to the chip; a sheet member which is installed to the sub heat sink in such a manner as to close the sheet mounting hole and which has thermal conductivity; and a bracket which is fixed to the main board and which covers the sheet mounting hole. The sheet member is in thermal contact with a surface of the chip and has lower rigidity than the sub heat sink.
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公开(公告)号：US10546799B2
公开(公告)日：2020-01-28
申请号：US16040317
申请日：2018-07-19
发明人： Akinori Uchino , Kazuo Fujii , Takuroh Kamimura , Kenji Watamura , Hiroshi Yamazaki , Takanori Hoshino
IPC分类号： G06F1/16 , H01L23/427 , G06F1/20 , G06F1/18
摘要： An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.
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