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公开(公告)号：US20240297094A1
公开(公告)日：2024-09-05
申请号：US18411320
申请日：2024-01-12
IPC分类号： H01L23/373 , G06F1/20 , H01L23/42 , H05K7/20
CPC分类号： H01L23/3737 , G06F1/206 , H01L23/42 , H05K7/20463
摘要： A heat dissipation structure, of a semiconductor chip that includes a substrate and a die provided on a top surface of the substrate, includes: a heat dissipator provided along a surface of the die; a liquid metal interposed between the die and the heat dissipator; and a thermal putty interposed between the substrate and the heat dissipator in a state of sealing therebetween and surrounding the die.
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公开(公告)号：US11968806B2
公开(公告)日：2024-04-23
申请号：US17805043
申请日：2022-06-02
CPC分类号： H05K7/2039 , G06F1/203 , H05K7/20136 , H05K7/20336
摘要： An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.
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公开(公告)号：US11547017B2
公开(公告)日：2023-01-03
申请号：US17358772
申请日：2021-06-25
摘要： A cooling module reduces the number of parts and achieves weight reduction. An electronic apparatus includes: the cooling module; a chassis; first and second heating elements provided inside the chassis; and a cooling module configured to absorb heat generated by the first and second heating elements. The cooling module includes: a vapor chamber in which a sealed space is formed in a portion sandwiched between first and second metal plates and working fluid is sealed in the sealed space, the second metal plate having an outer shape larger than that of the first metal plate; a metal frame formed in a portion of the second metal plate, the portion of the second metal plate protruding from the outer shape of the first metal plate; and a heat conduction plate supported by the metal frame, the heat conduction plate containing graphene.
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公开(公告)号：US11269388B2
公开(公告)日：2022-03-08
申请号：US17074917
申请日：2020-10-20
摘要： An electronic apparatus includes: an apparatus chassis including therein an electronic board; a keyboard provided on a top of the apparatus chassis; and a fan device that includes a fan chassis and a blade part. The fan chassis includes a first air intake formed on a bottom surface thereof, a second air intake formed on a top surface thereof, and an air outlet formed on a side surface thereof. The blade part rotates inside the fan chassis. The fan device is arranged between a basal plate and a bottom surface of the keyboard inside the apparatus chassis. The basal plate includes a first inlet at a position overlapping the first air intake. The keyboard includes a second inlet that makes air pass through the keyboard in an up-down direction thereof. The electronic apparatus further includes a first water stop member that separates the first air intake from the electronic board.
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公开(公告)号：US11266040B2
公开(公告)日：2022-03-01
申请号：US16863525
申请日：2020-04-30
摘要： A heat transport device is disclosed. The heat transport device includes a heat pipe and a heat spreader. The heat pipe, which is thermally connecting to a heating element, includes a heat receiving surface for receiving heat from the heating element, and a side surface intersecting with the heat receiving surface. The heat spreader, which is thermally connecting to the heat pipe, includes a first plate member having a first side surface thermally connecting to the side surface of the heat pipe, and a second plate member having a side surface thermally connecting to a second side surface of the first plate member opposite to the first side surface in contact with the heat pipe.
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公开(公告)号：US09904335B2
公开(公告)日：2018-02-27
申请号：US15372151
申请日：2016-12-07
发明人： Takuroh Kamimura , Hiroaki Agata , Akinori Uchino , Tomoaki Kosugi , Yoshiyuki Shibayama , Eiji Shinohara
CPC分类号： G06F1/203 , G06F1/1616 , G06F1/1622 , G06F1/1632 , G06F1/1679 , H05K7/20254 , H05K7/20263 , H05K7/20272 , H05K7/20418
摘要： An electronic apparatus capable of achieving sufficient heat transfer efficiency between a portable information device and a cooling device while preventing a heating member from being exposed at an outer surface of the portable information device is disclosed. The portable information device includes a heating body and a cooling device. The cooling device is detachably connected to the portable information device, and is configured to absorb heat from the heating body. The portable information device includes a heat-dissipation heat sink thermally connected to the heating body, and multiple apparatus shutter members covering the heat-dissipation heat sink so that the heat-dissipation heat sink can be freely covered and uncovered. The cooling device includes a shutter driving mechanism that opens the apparatus shutter members when the portable information device is connected to the cooling device, and a heat-receiving heat sink thermally connected to the heat-dissipation heat sink.
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公开(公告)号：US09095046B2
公开(公告)日：2015-07-28
申请号：US13786679
申请日：2013-03-06
CPC分类号： H05K5/0008 , G06F1/181 , Y10T29/49826
摘要： Devices and methods are provided for connecting device cover components. In general, the devices and methods can allow first and second covers of an electronic device to be connected together at a plurality of attachment points without any gap space between the first and second covers at the attachment points. In an exemplary embodiment, an electronic device can include a housing that has first and second covers attached to one another at a plurality of attachment points. The first cover can be formed from a first material, and the second cover can be formed from a second, different material. The first material can be a softer material than the second material, which can allow the second cover to penetrate into and deform the first cover during manufacturing of the housing such that no gap space is present between the first and second covers at each of the attachment points.
摘要翻译： 提供了用于连接设备盖组件的设备和方法。 通常，装置和方法可允许电子装置的第一和第二盖在多个连接点处连接在一起，而在连接点处第一和第二盖之间没有间隙。 在示例性实施例中，电子设备可以包括具有在多个附接点处彼此附接的第一和第二盖的壳体。 第一盖可以由第一材料形成，并且第二盖可以由第二不同的材料形成。 第一材料可以是比第二材料更软的材料，这可以允许第二盖在制造壳体期间穿透第一盖并使其变形，使得在每个附件处的第一和第二盖之间不存在间隙空间 积分
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公开(公告)号：US20230354553A1
公开(公告)日：2023-11-02
申请号：US18305827
申请日：2023-04-24
CPC分类号： H05K7/20336 , G06F1/203 , G06F1/206
摘要： An electronic apparatus includes a first chassis which loads a processing device, a second chassis which is coupled with the first chassis to be rotatably movable relative to each other and a vapor chamber which has a first flexile resin sheet, a second flexible resin sheet and a closed space which is formed between the first resin sheet and the second resin sheet and in which a working fluid is encapsulated, extends from the inside of the first chassis to the inside of the second chassis and transports heat that the processing device generates to the second chassis side.
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公开(公告)号：US20220369512A1
公开(公告)日：2022-11-17
申请号：US17656908
申请日：2022-03-29
摘要： An electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling device that has a cooling fin, a heat pipe connecting the cooling fin and the heat generating element, and a pressing assembly pressing the heat pipe against the heat generating element, and is provided in the chassis. The heat pipe has: a heat absorbing section that absorbs heat generated by the heat generating element; and a thin plate section having a thickness which is smaller than that of the heat absorbing section. The pressing assembly has: a base assembly relatively fixed to the chassis; and a bridge section that is provided integrally with the base assembly and placed on a surface of the thin plate section in such a manner as to extend over the heat pipe in a width direction.
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公开(公告)号：US11379030B2
公开(公告)日：2022-07-05
申请号：US16815795
申请日：2020-03-11
IPC分类号： G06F1/3203 , G06F1/3212 , G06F1/3296 , H02J7/00
摘要： An apparatus for controlling power efficiency of an information processing device is disclosed. The apparatus includes a voltage converter that converts an input voltage into a predetermined output voltage, an information processing device that consumes power supplied by the voltage converter, a battery pack that is charged using power supplied at a predetermined charging voltage by the voltage converter, and a controller that determines the input voltage where the power supplied by the voltage converter exceeds power consumed by the information processing device and a difference between the input voltage and the predetermined charging voltage is minimized. A method and a system also perform various functions of the apparatus.
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