公开(公告)号：US20210120711A1

公开(公告)日：2021-04-22

申请号：US16693399

申请日：2019-11-25

Applicant: Lextar Electronics Corporation

Inventor： Chi-Wei LIU ,  Fu-Hsin CHEN ,  Yu-Chun LEE

IPC: H05K13/04 ,  B25J15/00 ,  B25J15/04

Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.