Abstract:
A hold down interconnection stick is provided which is fastened to the ou walls of a container of an electronic system and to the electronic printed circuit boards which form a part of the electronic system. The stick is also provided with heat dissipating means to carry away the heat generated during the operation of the electronic system so as to enable the electronic components function within their tolerances of temperature. The fastening means provide a vibration-free system and thus reduces any vibration-induced noise.
Abstract:
A connector protected against current pulses resulting from secondary emission from connector pins by a conductive layer surrounding each pin set. The conductive layer is intimately bonded to the connector insulation and is connected to the connector pin set. The connector is formed in a housing block of a liquid crystal thermoplastic that retains the crystal structure at elevated temperatures preventing deformation during high temperature soldering. The connector back and sides are patterned with plated conductors that provide interconnection between selected pins directly on the connector outer surfaces. The back surface of the connector is sealed by a heat setting acrylic that prevents contaminants from the environment at the back of the connector getting into the pin recesses.
Abstract:
A removable pin stabilizer for stabilizing carrier pins of an integrated circuit chip carrier before and during placement of the pins into sockets of a circuit board. The removable pin stabilizer includes a non-dissolvable plate, the non-dissolvable plate having parallel dissolvable sections traversing the plate, the parallel dissolvable sections being through the plate and having holes through the plate for receiving the carrier pins, the holes encompassing the parallel dissolvable sections, wherein the parallel dissolvable sections can be dissolved by a solvent after the chip carrier is mounted and positioned correctly to the circuit board. The resultant additional space created by such removal will allow an increased flow of air between the integrated circuit chip carrier and the circuit board.