公开(公告)号：US5659458A

公开(公告)日：1997-08-19

申请号：US301148

申请日：1994-09-06

Applicant: Lyle E. Patchen

Inventor： Lyle E. Patchen

IPC: H01L23/367 ,  H01L23/473 ,  H05K1/02 ,  H05K3/30 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L23/3677 ,  H05K1/0204 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/064 ,  H05K2201/0979 ,  H05K2201/10333 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K3/303

Abstract: An integrated circuit chip package has a substrate having first and second mutually parallel sides and a preselected thickness and a space on the first side for the mounting thereon of an electronic component having a body with a flat surface. The substrate further includes a plurality of elongated thermal conductive members, each having a head portion adapted to be in contact with the flat surface of the electronic component. The members further have elongated body portions of a preselected length greater than the thickness of the substrate. The thermal conductive members extend through preselected holes in the substrate whereby heat may be conducted from the flat surface of the component through the thermal conductive member to the other side of the substrate.

Abstract translation: 集成电路芯片封装具有基板，该基板具有第一和第二相互平行的侧面，并且在第一侧上具有预定厚度和空间，用于安装具有平坦表面的主体的电子部件。 衬底还包括多个细长导热构件，每个具有适于与电子部件的平坦表面接触的头部。 这些构件还具有比衬底厚度大的预选长度的细长主体部分。 导热构件延伸穿过衬底中的预选孔，从而可以将热量从构件的平坦表面通过导热构件传导到衬底的另一侧。