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公开(公告)号:US10497566B1
公开(公告)日:2019-12-03
申请号:US16012608
申请日:2018-06-19
Applicant: MACRONIX INTERNATIONAL CO., LTD.
Inventor: Chin-Cheng Yang , Chi-Hao Huang , Wei-Hung Wang
IPC: H01L21/033 , H01L23/522 , H01L23/528 , H01L21/768 , H01L27/105
Abstract: A circuit structure comprises a plurality of first conducting lines extending in a first direction, the first conducting lines having a first pitch in a second direction orthogonal to the first direction; a plurality of linking lines extending in the second direction, the linking lines having a second pitch in the first direction, the second pitch being greater than the first pitch; and a plurality of connection structures connecting respective first conducting lines for current flow to respective linking lines, the connection structures each including a plurality of segments extending in the first direction, segments in the plurality of segments having a transition pitch in the second direction relative to adjacent segments in the plurality of segments greater than or equal to the first pitch, and less than the second pitch.
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公开(公告)号:US11043417B2
公开(公告)日:2021-06-22
申请号:US16439499
申请日:2019-06-12
Applicant: MACRONIX International Co., Ltd.
Inventor: Wei-Hung Wang , Chih-Hao Huang
IPC: H01L21/768 , H01L21/027 , H01L23/482 , H01L23/528
Abstract: A line structure for fan-out circuit having a dense-line area and a fan-out area is provided. The line structure includes a plurality of dense lines arranged in the dense-line area parallel to a first direction, a plurality of pads disposed in the fan-out area, and a plurality of connecting lines arranged in the fan-out area parallel to a second direction. The connecting lines respectively connect one of the dense lines with one of the pads, wherein at least one of the connecting lines is a wavy line.
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