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公开(公告)号：US11964617B2
公开(公告)日：2024-04-23
申请号：US18347756
申请日：2023-07-06
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N7/181 , H04N23/57 , H05K7/2039
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
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公开(公告)号：US20180170279A1
公开(公告)日：2018-06-21
申请号：US15899131
申请日：2018-02-19
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N5/2257 , H04N7/181 , H05K7/2039
Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.
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公开(公告)号：US20220355745A1
公开(公告)日：2022-11-10
申请号：US17813050
申请日：2022-07-18
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
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公开(公告)号：US10946813B2
公开(公告)日：2021-03-16
申请号：US16806100
申请日：2020-03-02
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager, an imager PCB and a lens barrel. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. A flexible cable electrically connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion to enhance heat transfer from the electronic component to the lower housing portion.
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公开(公告)号：US10576908B2
公开(公告)日：2020-03-03
申请号：US16283920
申请日：2019-02-25
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager and an imager PCB. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. The imager assembly includes a flexible cable that connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion. The thermal element includes a thermally conductive resilient material.
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Patent Agency Ranking
6.发明公开公开(公告)号：US20230219500A1
公开(公告)日：2023-07-13
申请号：US18153440
申请日：2023-01-12
Applicant: Magna Electronics Inc.
Inventor： Garret F. Achenbach , Martin J. Reckker , Steven G. Gebauer , Jianguo Wang
Abstract: A vehicular camera module includes a housing for mounting at a vehicular windshield, a processor printed circuit board (processor PCB) disposed in the housing, and an imager assembly. The imager assembly includes (i) a lens barrel accommodating a lens, (ii) an imager printed circuit board (imager PCB), and (iii) a flexible electrical ribbon cable that electrically connects the imager PCB to the processor PCB. An imager is disposed at a first side of the imager PCB. The imager PCB includes an imager portion at which the imager is disposed and attaching portions at respective outboard ends. At least one stress relieving portion is established at the imager PCB between the imager portion and each of the attaching portions. With the lens barrel received through an aperture of the housing, the attaching portions of the imager PCB are attached at the housing via respective fasteners.
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公开(公告)号：US11697382B2
公开(公告)日：2023-07-11
申请号：US17813050
申请日：2022-07-18
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N7/181 , H04N23/57 , H05K7/2039
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
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公开(公告)号：US09896039B2
公开(公告)日：2018-02-20
申请号：US14705076
申请日：2015-05-06
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N5/2257 , H04N7/181 , H05K7/2039
Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.
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9.发明授权公开(公告)号：US12208739B2
公开(公告)日：2025-01-28
申请号：US18153440
申请日：2023-01-12
Applicant: Magna Electronics Inc.
Inventor： Garret F. Achenbach , Martin J. Reckker , Steven G. Gebauer , Jianguo Wang
Abstract: A vehicular camera module includes a housing for mounting at a vehicular windshield, a processor printed circuit board (processor PCB) disposed in the housing, and an imager assembly. The imager assembly includes (i) a lens barrel accommodating a lens, (ii) an imager printed circuit board (imager PCB), and (iii) a flexible electrical ribbon cable that electrically connects the imager PCB to the processor PCB. An imager is disposed at a first side of the imager PCB. The imager PCB includes an imager portion at which the imager is disposed and attaching portions at respective outboard ends. At least one stress relieving portion is established at the imager PCB between the imager portion and each of the attaching portions. With the lens barrel received through an aperture of the housing, the attaching portions of the imager PCB are attached at the housing via respective fasteners.
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公开(公告)号：US20190184911A1
公开(公告)日：2019-06-20
申请号：US16283920
申请日：2019-02-25
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N5/2257 , H04N7/181 , H05K7/2039
Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager and an imager PCB. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. The imager assembly includes a flexible cable that connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion. The thermal element includes a thermally conductive resilient material.
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