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公开(公告)号:US20230253517A1
公开(公告)日:2023-08-10
申请号:US18137935
申请日:2023-04-21
Applicant: Maxeon Solar Pte. Ltd.
Inventor: Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Marc Robinson , Paul W. Loscutoff , Ryan Reagan , David Okawa , Tamir Lance , Thierry Nguyen
IPC: H01L31/0465 , H01L31/0475 , H01L31/049 , H01L31/05 , H01L31/0224
CPC classification number: H01L31/0465 , H01L31/0475 , H01L31/049 , H01L31/0508 , H01L31/022433
Abstract: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.
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公开(公告)号:US12080815B2
公开(公告)日:2024-09-03
申请号:US18137935
申请日:2023-04-21
Applicant: Maxeon Solar Pte. Ltd.
Inventor: Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Marc Robinson , Paul W. Loscutoff , Ryan Reagan , David Okawa , Tamir Lance , Thierry Nguyen
IPC: H01L31/0465 , H01L31/0224 , H01L31/0475 , H01L31/049 , H01L31/05
CPC classification number: H01L31/0465 , H01L31/022433 , H01L31/0475 , H01L31/049 , H01L31/0508
Abstract: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.
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公开(公告)号:US12113142B2
公开(公告)日:2024-10-08
申请号:US17356417
申请日:2021-06-23
Applicant: Maxeon Solar Pte. Ltd.
Inventor: Pei Hsuan Lu , Tyler D. Newman , Paul W. Loscutoff , George G. Correos , Yafu Lin , Andrea R. Bowring , David C. Okawa , Matthew T. Matsumoto , Benjamin I. Hsia , Arbaz Ahmed Shakir , John H. Lippiatt , Simone I. Nazareth , Ryan Reagan , Todd R. Johnson , Ned Western , Tamir Lance , Marc Robinson
CPC classification number: H01L31/0508 , H01L31/0201 , H01L31/0516 , H01L31/1876 , H02S40/34
Abstract: Strings of solar cells having laser assisted metallization conductive contact structures, and their methods of manufacture, are described. For example, a solar cell string includes a first solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a first metal foil to the back side of the first solar cell. The solar cell string also includes a second solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a second metal foil to the back side of the second solar cell. The solar cell string also includes a conductive interconnect coupling the first and second solar cells, the conductive interconnect including a strain relief feature.
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公开(公告)号:USD1016736S1
公开(公告)日:2024-03-05
申请号:US29864060
申请日:2022-05-06
Applicant: MAXEON SOLAR PTE. LTD.
Designer: Tamir Lance , David Okawa , Ryan Reagan , Brian Wares , Laurence Mackler , Hikaru Iwasaka , Alexander Keller
Abstract: FIG. 1 is a front elevational view of a textured solar panel;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a front, bottom, and left side perspective view thereof;
FIG. 8 is an enlarged view of the section indicated by callout circle 8 in FIG. 7; and,
FIG. 9 is a further enlarged view of the section indicated by callout circle 9 in FIG. 8.
The evenly spaced broken lines shown in the figures are for the purpose of illustrating portions of the textured solar panel that form no part of the claimed design. The dot-dash lines in the figures form a circle and lead line ending in a number that corresponds to the area shown in the figure having that number. The dot-dash lines form no part of the claimed design.-
公开(公告)号:US11901470B2
公开(公告)日:2024-02-13
申请号:US17032975
申请日:2020-09-25
Applicant: Maxeon Solar Pte. Ltd.
Inventor: Richard Hamilton Sewell , Matthieu Minault Reich , Andrea R. Bowring , Arbaz Shakir , Ryan Reagan , Matthew Matsumoto
CPC classification number: H01L31/0504 , H01L31/0516 , H01L31/188
Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a string of solar cells includes a plurality of back-contact solar cells, wherein each of the plurality of back-contact solar cells includes P-type and N-type doped diffusion regions. A plurality of conductive wires is disposed over a back surface of each of the plurality of solar cells, wherein each of the plurality of conductive wires is substantially parallel to the P-type and N-type doped diffusion regions of each of the plurality of solar cells. One or more of the plurality of conductive wires adjoins a pair of adjacent solar cells of the plurality of solar cells and has a relief feature between the pair of adjacent solar cells.
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