公开(公告)号：US12113142B2

公开(公告)日：2024-10-08

申请号：US17356417

申请日：2021-06-23

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Pei Hsuan Lu ,  Tyler D. Newman ,  Paul W. Loscutoff ,  George G. Correos ,  Yafu Lin ,  Andrea R. Bowring ,  David C. Okawa ,  Matthew T. Matsumoto ,  Benjamin I. Hsia ,  Arbaz Ahmed Shakir ,  John H. Lippiatt ,  Simone I. Nazareth ,  Ryan Reagan ,  Todd R. Johnson ,  Ned Western ,  Tamir Lance ,  Marc Robinson

IPC: H01L31/05 ,  H01L31/02 ,  H01L31/18 ,  H02S40/34

CPC classification number: H01L31/0508 ,  H01L31/0201 ,  H01L31/0516 ,  H01L31/1876 ,  H02S40/34

Abstract: Strings of solar cells having laser assisted metallization conductive contact structures, and their methods of manufacture, are described. For example, a solar cell string includes a first solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a first metal foil to the back side of the first solar cell. The solar cell string also includes a second solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a second metal foil to the back side of the second solar cell. The solar cell string also includes a conductive interconnect coupling the first and second solar cells, the conductive interconnect including a strain relief feature.

公开(公告)号：US20230253517A1

公开(公告)日：2023-08-10

申请号：US18137935

申请日：2023-04-21

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Pei Hsuan Lu ,  Benjamin I. Hsia ,  David Aaron Randolph Barkhouse ,  Lewis C. Abra ,  George G. Correos ,  Marc Robinson ,  Paul W. Loscutoff ,  Ryan Reagan ,  David Okawa ,  Tamir Lance ,  Thierry Nguyen

IPC: H01L31/0465 ,  H01L31/0475 ,  H01L31/049 ,  H01L31/05 ,  H01L31/0224

CPC classification number: H01L31/0465 ,  H01L31/0475 ,  H01L31/049 ,  H01L31/0508 ,  H01L31/022433

Abstract: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

公开(公告)号：US12080815B2

公开(公告)日：2024-09-03

申请号：US18137935

申请日：2023-04-21

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Pei Hsuan Lu ,  Benjamin I. Hsia ,  David Aaron Randolph Barkhouse ,  Lewis C. Abra ,  George G. Correos ,  Marc Robinson ,  Paul W. Loscutoff ,  Ryan Reagan ,  David Okawa ,  Tamir Lance ,  Thierry Nguyen

IPC: H01L31/0465 ,  H01L31/0224 ,  H01L31/0475 ,  H01L31/049 ,  H01L31/05

CPC classification number: H01L31/0465 ,  H01L31/022433 ,  H01L31/0475 ,  H01L31/049 ,  H01L31/0508

Abstract: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.