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公开(公告)号：US12132126B2
公开(公告)日：2024-10-29
申请号：US17836822
申请日：2022-06-09
IPC分类号： H01L31/044 , H01L31/0224 , H01L31/068
CPC分类号： H01L31/022441 , H01L31/0682 , Y02E10/547
摘要： Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.
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公开(公告)号：US20240355946A1
公开(公告)日：2024-10-24
申请号：US18761032
申请日：2024-07-01
IPC分类号： H01L31/049 , H01L31/0216 , H01L31/0224 , H01L31/0463 , H01L31/18
CPC分类号： H01L31/049 , H01L31/02167 , H01L31/022466 , H01L31/0463 , H01L31/18
摘要： A solar module includes solar cells that are encapsulated. A back layer is disposed towards back sides of the solar cells and a transparent layer is disposed towards front sides of the solar cells. A protection coating is formed on a surface of the solar cells. The protection coating can be continuous or have a pattern with cutouts that expose the surface of the solar cells.
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公开(公告)号：US20240313142A1
公开(公告)日：2024-09-19
申请号：US18222292
申请日：2023-07-14
CPC分类号： H01L31/0516 , H01L31/02013 , H01L31/0508 , H01L31/188
摘要： Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.
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公开(公告)号：US12074232B2
公开(公告)日：2024-08-27
申请号：US15362045
申请日：2016-11-28
发明人： Staffan Westerberg , Seung Bum Rim
IPC分类号： H01L31/00 , H01L31/0216 , H01L31/0224 , H01L31/0236 , H01L31/028 , H01L31/0288 , H01L31/0368 , H01L31/0376 , H01L31/068 , H01L31/18 , H01L31/20
CPC分类号： H01L31/02167 , H01L31/02168 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0288 , H01L31/03682 , H01L31/03762 , H01L31/0682 , H01L31/182 , H01L31/1868 , H01L31/202 , Y02E10/546 , Y02E10/547 , Y02E10/548 , Y02P70/50
摘要： Methods of fabricating solar cell emitter regions with differentiated P-type and N-type architectures and incorporating a multi-purpose passivation and contact layer, and resulting solar cells, are described. In an example, a solar cell includes a substrate having a light-receiving surface and a back surface. A P-type emitter region is disposed on the back surface of the substrate. An N-type emitter region is disposed in a trench formed in the back surface of the substrate. An N-type passivation layer is disposed on the N-type emitter region. A first conductive contact structure is electrically connected to the P-type emitter region. A second conductive contact structure is electrically connected to the N-type emitter region and is in direct contact with the N-type passivation layer.
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公开(公告)号：US12057806B2
公开(公告)日：2024-08-06
申请号：US16535751
申请日：2019-08-08
发明人： David DeGraaff , Adam Detrick
CPC分类号： H02S40/36 , H01L31/044 , H01L31/0504 , H01R13/6641 , H02S40/34 , H01R13/52 , Y02E10/50
摘要： One embodiment relates to a connector that includes a diode. The diode has an anode and a cathode. The connector further includes a first electrical connection which connects to the anode, a second electrical connection which also connects to the anode, and a third electrical connection which connects to the cathode. Another embodiment relates to a photovoltaic laminate which includes a string of photovoltaic cells and three electrical conductors extending out of two discrete penetrations of the laminate. A first electrical conductor is connected to a first end of the string, a second electrical conductor is connected to a second end of the string, and a third electrical conductor is also connected to the second end of the string. The first and third electrical conductors extend out of the first discrete penetration, while the second electrical conductor extends out of the second discrete penetration. Other features and embodiments are also disclosed.
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公开(公告)号：US20240186443A1
公开(公告)日：2024-06-06
申请号：US18525415
申请日：2023-11-30
发明人： Paul ADRIANI
IPC分类号： H01L31/18
CPC分类号： H01L31/186
摘要： A solar cell module with darkened metallic components is disclosed. A method of darkening the visible metallic components of the solar cells of a solar cell module is disclosed. The method creates a dark patina on the metallic components of a solar cell.
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公开(公告)号：US20240186436A1
公开(公告)日：2024-06-06
申请号：US18441049
申请日：2024-02-14
发明人： Jianfang SI , Yafu LIN
CPC分类号： H01L31/0508 , H01L31/188 , H02S20/25
摘要： A high efficiency configuration for a solar cell module comprises solar cells arranged in an overlapping shingled manner and methods for assembling solar cells in a shingled manner. Solar cells in the module are electrically connected in series by front side ribbons and separate rear side ribbons. The front-side ribbons have a smaller cross-sectional width while the rear-side ribbons are thinner and wider.
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公开(公告)号：US11967657B2
公开(公告)日：2024-04-23
申请号：US16841541
申请日：2020-04-06
发明人： Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
IPC分类号： H01L31/0224 , H01L31/0236 , H01L31/028 , H01L31/0475 , H01L31/05 , H01L31/068 , H01L31/0745
CPC分类号： H01L31/02245 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0475 , H01L31/0512 , H01L31/0516 , H01L31/0682 , H01L31/0745 , Y02E10/50 , Y02E10/547 , Y02P70/50
摘要： Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
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公开(公告)号：US11935972B2
公开(公告)日：2024-03-19
申请号：US17738984
申请日：2022-05-06
IPC分类号： H01L31/0224 , H01L31/0236 , H01L31/0352 , H01L31/05 , H01L31/068 , H01L31/0745 , H01L31/0747 , H01L31/18 , H01L31/20
CPC分类号： H01L31/022441 , H01L31/022425 , H01L31/022458 , H01L31/02363 , H01L31/035281 , H01L31/0516 , H01L31/0682 , H01L31/0745 , H01L31/0747 , H01L31/18 , H01L31/1804 , H01L31/202 , Y02E10/50 , Y02E10/546 , Y02E10/547 , Y02E10/548
摘要： Tri-layer semiconductor stacks for patterning features on solar cells, and the resulting solar cells, are described herein. In an example, a solar cell includes a substrate. A semiconductor structure is disposed above the substrate. The semiconductor structure includes a P-type semiconductor layer disposed directly on a first semiconductor layer. A third semiconductor layer is disposed directly on the P-type semiconductor layer. An outermost edge of the third semiconductor layer is laterally recessed from an outermost edge of the first semiconductor layer by a width. An outermost edge of the P-type semiconductor layer is sloped from the outermost edge of the third semiconductor layer to the outermost edge of the third semiconductor layer. A conductive contact structure is electrically connected to the semiconductor structure.
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公开(公告)号：US20240021739A1
公开(公告)日：2024-01-18
申请号：US18088635
申请日：2022-12-26
发明人： Jianxun Wu , Yafu Lin , Feldemar Batitis , Yonggang Guo
CPC分类号： H01L31/02 , B65D67/02 , B65D81/057 , B65D57/006 , B65D85/48 , B65D71/00
摘要： A module clip piece for a module is disclosed. The module clip piece includes at least one protrusion configured to engage at least one groove of a first neighboring module clip piece. The at least one protrusion protrudes in a first direction. At least one groove is coupled to the at least one protrusion and is configured to engage at least one protrusion of a second neighboring module clip piece. The at least one groove extends in a second direction that is orthogonal to the first direction.
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