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公开(公告)号：US12080819B2
公开(公告)日：2024-09-03
申请号：US18059408
申请日：2022-11-28
Applicant: ZHEJIANG JINKO SOLAR CO., LTD.
Inventor： Zhiqiu Guo , Shiliang Huang , Yingli Guan
IPC: H01L31/05 , H01L31/048 , H01L31/0224 , H01L31/0465 , H01L31/18
CPC classification number: H01L31/05 , H01L31/048 , H01L31/022425 , H01L31/022433 , H01L31/0465 , H01L31/0504 , H01L31/1868 , Y02E10/50
Abstract: A solar cell and a photovoltaic module are provided. The solar cell includes a substrate having first edges and second edges; two first main electrodes, where each first main electrode is close to a corresponding first edge and includes a plurality of first sub-connection pads and a first connection wire; and at least two second main electrodes, where the at least two second main electrodes are disposed between the two first main electrodes, where each of the at least two second main electrodes includes a plurality of second sub-connection pads and a second connection wire, where a first pitch between a respective first main electrode and a second main electrode adjacent to the respective first main electrode is not equal to a second pitch between adjacent second main electrodes.
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公开(公告)号：US12080815B2
公开(公告)日：2024-09-03
申请号：US18137935
申请日：2023-04-21
Applicant: Maxeon Solar Pte. Ltd.
Inventor： Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Marc Robinson , Paul W. Loscutoff , Ryan Reagan , David Okawa , Tamir Lance , Thierry Nguyen
IPC: H01L31/0465 , H01L31/0224 , H01L31/0475 , H01L31/049 , H01L31/05
CPC classification number: H01L31/0465 , H01L31/022433 , H01L31/0475 , H01L31/049 , H01L31/0508
Abstract: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.
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公开(公告)号：US20240272686A1
公开(公告)日：2024-08-15
申请号：US18528862
申请日：2023-12-05
Applicant: Garmin Switzerland GmbH
Inventor： John M. Kenkel , Mohamed Bouchoucha , Jing-Yi Wang
IPC: G06F1/18 , G01P15/00 , G01S19/13 , G02F1/133 , G02F1/1333 , G06F1/16 , G06F3/044 , H01L31/0465 , H01L31/0468 , H01L31/048
CPC classification number: G06F1/189 , G06F3/044 , H01L31/0465 , H01L31/0468 , H01L31/048 , G01P15/00 , G01S19/13 , G02F1/13324 , G02F1/13338 , G06F1/1613
Abstract: Systems and methods of generating electrical current from at least one photovoltaic cell are described herein. In some embodiments, a dual-cell arrangement of photovoltaic cells may be disposed on a face. Equal parts of a first photovoltaic cell and a second photovoltaic cell may be disposed on the face such that when a portion of the face is shaded, the first photovoltaic cell and the second photovoltaic cell receive substantially equal amounts of electromagnetic radiation. In some embodiments, the first photovoltaic cell and the second photovoltaic cell comprises a plurality of sub-cell connected in series and parallel to optimize the power output form the partially exposed cells.
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公开(公告)号：US20230262997A1
公开(公告)日：2023-08-17
申请号：US18164834
申请日：2023-02-06
IPC: H10K30/80 , H01L31/0465 , H10K39/10 , H10K71/00
CPC classification number: H10K30/80 , H01L31/0465 , H10K39/10 , H10K71/00
Abstract: Visually undistorted thin film electronic devices are provided. In one embodiment, a method for producing a thin-film electronic device comprises: opening a scribe in a stack of thin film material layers deposited on a substrate to define an active region and an inactive region of the thin-film electronic device, the stack comprising at least one active semiconductor layer. The active region comprises a non-scribed area of the stack and the inactive region comprises a region of the stack where thin film material was removed by the scribe. The method further comprises depositing at least one scribe fill material into a gap opened by the scribe. The scribe fill material has embedded therein one or more coloring elements that alter an optical characteristics spectrum of the inactive region to obtain an optical characteristics spectrum of the active region within a minimum perceptible difference for an industry defined standard observer.
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公开(公告)号：US20180323325A1
公开(公告)日：2018-11-08
申请号：US16040190
申请日：2018-07-19
Inventor： Jeffrey S. Nelson , Michael Hibbs , Gregory N. Nielson , Murat Okandan , Jose Luis Cruz-Campa , Paul J. Resnick , Carlos Anthony Sanchez , Vipin P. Gupta , Peggy J. Clews
IPC: H01L31/05 , H01L31/0465 , H01L31/0224 , H01L31/048 , H02S30/20
CPC classification number: H01L31/0516 , H01L31/022441 , H01L31/0465 , H01L31/048 , H01L31/0512 , H02S10/40 , H02S30/20 , Y02E10/50 , Y02E10/547
Abstract: A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.
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Patent Agency Ranking
公开(公告)号：US20180226527A1
公开(公告)日：2018-08-09
申请号：US15887595
申请日：2018-02-02
Applicant: FLISOM AG
Inventor： Reto PFEIFFER , Roger ZILTENER , Thomas NETTER
IPC: H01L31/05 , H01L31/02 , H01L31/0352 , H01L31/0224 , H01L31/046 , G06F17/50 , H01L31/0465 , H01L31/0463
CPC classification number: H01L31/0516 , G06F17/5077 , H01L31/0201 , H01L31/022433 , H01L31/035272 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/0508 , Y02E10/50
Abstract: A thin-film optoelectronic module device (100) and design method comprising at least three monolithically-interconnected cells (104, 106, 108) where at least one monolithically-interconnecting line (250) depicts a spatial periodic or quasi-periodic wave and wherein the optoelectronic surface of said thin-film optoelectronic module device (100) presents at least one set of at least three zones (210, 220, 230) having curves of substantially parallel monolithic interconnect lines. Border zones (210, 230) have a lower front-contact sheet resistance than that of internal zone (220). Said curves of substantially parallel interconnecting lines may comprise peaks of triangular or rounded shape, additional spatial periods that are smaller than a baseline period, and mappings from one curve to the adjacent curve such as in the case of non-rectangular module devices (100). The device (100) and design method are advantageous to reduce costs and materials to manufacture thin-film optoelectronic module devices (100) while increasing production yield, reliability, aesthetic appearance, and range of applications.
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公开(公告)号：US10038113B1
公开(公告)日：2018-07-31
申请号：US14950763
申请日：2015-11-24
Inventor： Jeffrey S. Nelson , Michael Hibbs , Gregory N. Nielson , Murat Okandan , Jose Luis Cruz-Campa , Paul J. Resnick , Carlos Anthony Sanchez , Vipin P. Gupta , Peggy J. Clews
IPC: H01L31/05 , H01L31/0465 , H01L31/048 , H01L31/0224 , H02S30/20
CPC classification number: H01L31/0516 , H01L31/022441 , H01L31/0465 , H01L31/048 , H01L31/0512 , H01L31/0547 , H02S10/40 , H02S30/20 , Y02E10/50 , Y02E10/547
Abstract: A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.
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公开(公告)号：US20180175228A1
公开(公告)日：2018-06-21
申请号：US15843257
申请日：2017-12-15
Applicant: ARMOR
Inventor： Mélanie Bertrand , François Allais , Jeremiah K. Mwaura
CPC classification number: H01L31/0508 , H01L31/0465 , H01L31/05 , H01L31/18 , Y02E10/549
Abstract: The present invention relates to a method for manufacturing a photovoltaic module (10), comprising the following steps: forming, on an electrically conducting material, a furrow (20A) defining a first (18A) and second (18B) lower electrode; then forming, on each lower electrode, a stack (34) comprising at least one upper electrode (36) and an intermediate photo-active layer (38), to form a first (16A) and second (16B) photovoltaic cell, respectively; then forming an electrical connection (17A) between said cells (16A, 16B).Before the stacks, the following are formed: a first insulating strip (22A) in the furrow (20A); and a second electrically insulating strip (24B) on the second lower electrode, delimiting an inactive area (28B) on said second electrode. The stack (34) next formed on the second cell is positioned outside the inactive area.
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公开(公告)号：US20180090634A1
公开(公告)日：2018-03-29
申请号：US15696212
申请日：2017-09-06
Applicant: KABUSHIKI KAISHA TOSHIBA
Inventor： Soichiro Shibasaki , Miyuki Shiokawa , Naoyuki Nakagawa , Sara Yoshio , Mutsuki Yamazaki , Hiroki Hiraga , Kazushige Yamamoto , Yuya Honishi , Takeshi Niimoto
IPC: H01L31/05 , H01L31/043 , H01L31/0725 , H01L31/054 , H02S40/34 , H01L31/0687
CPC classification number: H01L31/0504 , H01L31/043 , H01L31/0465 , H01L31/054 , H01L31/0687 , H01L31/0725 , H02S40/34 , Y02E10/52 , Y02E10/544
Abstract: A solar module of an embodiment includes: a first solar panel having a plurality of first submodules each including a plurality of first solar cells; and a second solar panel layered with the first solar panel, the second solar panel having a plurality of second submodules each including a plurality of second solar cells. The first solar panel is provided on a side where light is incident. The first solar panel and the second solar panel are electrically connected in parallel. The plurality of first solar cells included in each of the plurality of first submodules is electrically connected in series. The plurality of first submodules is electrically connected in parallel. The plurality of second solar cells included in each of the plurality of second submodules is electrically connected in series. The plurality of second submodules is electrically connected in parallel.
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公开(公告)号：USRE46739E1
公开(公告)日：2018-02-27
申请号：US15073045
申请日：2016-03-17
Applicant: KYOCERA CORPORATION
Inventor： Daisuke Nishimura , Toshifumi Sugawara , Ken Nishiura , Norihiko Matsushima , Yosuke Inomata , Hisao Arimune , Tsuyoshi Uesugi
IPC: H01L31/042 , H01L31/0224 , H01L31/046 , H01L31/0749 , H01L31/0465
CPC classification number: H01L31/022425 , H01L31/046 , H01L31/0465 , H01L31/0749 , Y02E10/541 , Y02P70/521
Abstract: To provide a photoelectric conversion device having a high photoelectric conversion efficiency, a photoelectric conversion device 21 includes a substrate 1, a plurality of lower electrodes 2 on the substrate 1 comprising a metal element, a plurality of photoelectric conversion layers 33 comprising a chalcogen compound semiconductor formed on the plurality of lower electrodes 2 and separated from one another on the lower electrodes 2, a metal-chalcogen compound layer 8 comprising the metal element and a chalcogen element included in the chalcogen compound semiconductor formed between the lower electrode 2 and the photoelectric conversion layer 33, an upper electrode 5 formed on the photoelectric conversion layer 33, and a connection conductor 7 electrically connecting, in a plurality of the photoelectric conversion layers 33, the upper electrode 5 to the lower electrode 2 without interposition of the metal-chalcogen compound layer 8.
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