公开(公告)号：US09932678B2

公开(公告)日：2018-04-03

申请号：US15224825

申请日：2016-08-01

Applicant: MEC COMPANY LTD.

Inventor： Masayo Kurii ,  Kiyoto Tai ,  Mami Nakamura

IPC: C09G1/04 ,  C09K13/00 ,  C23F1/18 ,  H05K3/38 ,  H05K3/02 ,  C23F1/34 ,  H05K3/00

CPC classification number: C23F1/18 ,  C23F1/34 ,  H05K3/0085 ,  H05K3/022 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

公开(公告)号：US20140326696A1

公开(公告)日：2014-11-06

申请号：US14360783

申请日：2013-06-25

Applicant: MEC COMPANY LTD.

Inventor： Masayo Kurii ,  Kiyoto Tai ,  Mami Nakamura ,  Yuki Ogino

IPC: C23F1/18 ,  H05K3/06

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of AB is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract translation: 公开了一种微蚀刻溶液，添加到所述微蚀刻溶液中的补充溶液和使用所述微蚀刻溶液生产布线板的方法。 用于铜的微蚀刻溶液由含有铜离子，有机酸，卤离子，聚合物和非离子表面活性剂的水溶液组成。 聚合物是包含多胺链和/或阳离子基团并且重均分子量为1000以上的水溶性聚合物。 在本发明的微蚀刻溶液中，AB的值为2000〜9000，A / D的值为500〜9000，卤化物离子的浓度为A％（重量），聚合物的浓度为B％ ，非离子表面活性剂的浓度为D重量％。 使用该微蚀刻溶液，即使在低蚀刻量下也能均匀地保持对树脂等的粘附。

公开(公告)号：US09011712B2

公开(公告)日：2015-04-21

申请号：US14360783

申请日：2013-06-25

Applicant: Mec Company Ltd.

Inventor： Masayo Kurii ,  Kiyoto Tai ,  Mami Nakamura ,  Yuki Ogino

IPC: C09K13/00 ,  C23F1/18 ,  H05K3/38 ,  H05K3/06

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract translation: 公开了一种微蚀刻溶液，添加到所述微蚀刻溶液中的补充溶液和使用所述微蚀刻溶液生产布线板的方法。 用于铜的微蚀刻溶液由含有铜离子，有机酸，卤离子，聚合物和非离子表面活性剂的水溶液组成。 聚合物是包含多胺链和/或阳离子基团并且重均分子量为1000以上的水溶性聚合物。 在本发明的微蚀刻溶液中，A / B的值为2000〜9000，A / D的值为500〜9000，卤化物离子的浓度为A％（重量），聚合物的浓度为 B重量％，非离子表面活性剂的浓度为D重量％。 使用该微蚀刻溶液，即使在低蚀刻量下也能均匀地保持对树脂等的粘附。

公开(公告)号：US09441303B2

公开(公告)日：2016-09-13

申请号：US14110535

申请日：2013-03-04

Applicant: MEC COMPANY LTD.

Inventor： Masayo Kurii ,  Kiyoto Tai ,  Mami Nakamura

IPC: C09G1/04 ,  C09K13/00 ,  C23F1/18 ,  H05K3/38 ,  H05K3/02 ,  C23F1/34

CPC classification number: C23F1/18 ,  C23F1/34 ,  H05K3/0085 ,  H05K3/022 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract translation: 公开了一种用于铜的微蚀刻解决方案及其补充解决方案以及一种生产布线板的方法。 本发明的微蚀刻溶液由含有铜离子，有机酸，卤化物离子，分子量为17〜400的含氨基化合物和聚合物的水溶液组成。 聚合物是包含多胺链和/或阳离子基团并且重均分子量为1000以上的水溶性聚合物。 当含氨基化合物的浓度为A％（重量）且聚合物的浓度为B％（重量）时，本发明的微蚀刻溶液的A / B值为50〜6000。 即使在低蚀刻量的情况下也可以保持铜与树脂等之间的粘合。

公开(公告)号：US20150115196A1

公开(公告)日：2015-04-30

申请号：US14110535

申请日：2013-03-04

Applicant: MEC COMPANY LTD.

Inventor： Masayo Kurii ,  Kiyoto Tai ,  Mami Nakamura

IPC: C23F1/18 ,  H05K3/02

CPC classification number: C23F1/18 ,  C23F1/34 ,  H05K3/0085 ,  H05K3/022 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract translation: 公开了一种用于铜的微蚀刻解决方案及其补充解决方案以及一种生产布线板的方法。 本发明的微蚀刻溶液由含有铜离子，有机酸，卤化物离子，分子量为17〜400的含氨基化合物和聚合物的水溶液组成。 聚合物是包含多胺链和/或阳离子基团并且重均分子量为1000以上的水溶性聚合物。 当含氨基化合物的浓度为A％（重量）且聚合物的浓度为B％（重量）时，本发明的微蚀刻溶液的A / B值为50〜6000。 即使在低蚀刻量的情况下也可以保持铜与树脂等之间的粘合。