公开(公告)号：US20180025985A1

公开(公告)日：2018-01-25

申请号：US15498542

申请日：2017-04-27

Applicant: MEDIATEK INC.

Inventor： Min-Chen LIN ,  Che-Ya CHOU ,  Nan-Cheng CHEN

IPC: H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/5386 ,  H01L23/3185 ,  H01L23/5383 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/16 ,  H01L24/20 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16195 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1421 ,  H01L2924/1435 ,  H01L2924/1438 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2924/37001

Abstract: A semiconductor package structure including a redistribution layer (RDL) structure having a first surface and a second surface opposite thereto is provided. The RDL structure includes an inter-metal dielectric (IMD) layer and a first conductive layer disposed at a first layer-level of the IMD layer. A molding compound covers the first surface of the RDL structure. A first semiconductor die is disposed over the second surface of the RDL structure and electrically coupled to the RDL structure. A plurality of bump structures is disposed over the second surface of the RDL structure and electrically coupled to the RDL structure.