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    Implantable medical devices having modular lead bores
    1.
    发明授权
    Implantable medical devices having modular lead bores 有权

    公开(公告)号：US11559695B2

    公开(公告)日：2023-01-24

    申请号：US16717912

    申请日：2019-12-17

    Applicant: MEDTRONIC, INC.

    Inventor： Darren A. Janzig ,  Andrew Thom ,  Brad Tischendorf ,  Randy S. Roles ,  Steven T. Deininger ,  Nicholas R. Whitehead

    IPC: A61N1/375

    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.

    INSULATOR FOR A FEEDTHROUGH
    2.
    发明申请
    INSULATOR FOR A FEEDTHROUGH 有权
    绝缘子供应

    公开(公告)号：US20140151114A1

    公开(公告)日：2014-06-05

    申请号：US14175812

    申请日：2014-02-07

    Applicant: Medtronic, Inc. ,  Kyocera Corporation

    Inventor： Kengo Morioka ,  Keiichi Fujii ,  Arne Knudsen ,  Shingo Satou ,  Hidekazu Otomaru ,  Hiroshi Makino ,  Andrew Thom ,  Markus Reiterer ,  Gordon Munns ,  Thomas Miltich ,  Joyce Yamamoto

    IPC: H02G3/22

    CPC classification number: H02G3/22 ,  A61N1/3754

    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.

    Abstract translation: 用于可植入医疗装置的密封馈通件包括绝缘体和套圈。 绝缘体包括陶瓷材料和延伸穿过绝缘体的一个或多个导电导管。 绝缘体设置在套圈的开口中。 绝缘体包括多个基本平坦的表面，每个表面包括多个边缘。 圆角在任何两个相邻的基本上平坦的表面的相邻边缘之间延伸。 面向套圈的任何两个相邻的基本上平坦的表面之间的每个角部的平均半径小于相应边缘的长度的大约25％。

    Implantable medical devices having modular lead bores
    3.
    发明授权
    Implantable medical devices having modular lead bores 有权

    公开(公告)号：US11890484B2

    公开(公告)日：2024-02-06

    申请号：US18086224

    申请日：2022-12-21

    Applicant: MEDTRONIC, INC.

    Inventor： Darren A. Janzig ,  Andrew Thom ,  Brad Tischendorf ,  Randy S. Roles ,  Steven T. Deininger ,  Nicholas R. Whitehead

    IPC: A61N1/375

    CPC classification number: A61N1/3754 ,  A61N1/37514

    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.

    IMPLANTABLE MEDICAL DEVICES HAVING MODULAR LEAD BORES
    4.
    发明申请
    IMPLANTABLE MEDICAL DEVICES HAVING MODULAR LEAD BORES 有权

    公开(公告)号：US20230127724A1

    公开(公告)日：2023-04-27

    申请号：US18086224

    申请日：2022-12-21

    Applicant: MEDTRONIC, INC.

    Inventor： Darren A. Janzig ,  Andrew Thom ,  Brad Tischendorf ,  Randy S. Roles ,  Steven T. Deininger ,  Nicholas R. Whitehead

    IPC: A61N1/375

    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.

    IMPLANTABLE MEDICAL DEVICES HAVING MODULAR LEAD BORES
    6.
    发明申请
    IMPLANTABLE MEDICAL DEVICES HAVING MODULAR LEAD BORES 有权

    公开(公告)号：US20210178168A1

    公开(公告)日：2021-06-17

    申请号：US16717912

    申请日：2019-12-17

    Applicant: MEDTRONIC, INC.

    Inventor： Darren A. Janzig ,  Andrew Thom ,  Brad Tischendorf ,  Randy S. Roles ,  Steven T. Deininger ,  Nicholas R. Whitehead

    IPC: A61N1/375

    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.

    METHOD OF MANUFACTURING A MEDICAL DEVICE HAVING A FEEDTHROUGH
    7.
    发明申请
    METHOD OF MANUFACTURING A MEDICAL DEVICE HAVING A FEEDTHROUGH 审中-公开
    制造具有良好功能的医疗器械的方法

    公开(公告)号：US20160317821A1

    公开(公告)日：2016-11-03

    申请号：US15207649

    申请日：2016-07-12

    Applicant: Medtronic, Inc. ,  Kyocera Corporation

    Inventor： Kengo Morioka ,  Keiichi Fujii ,  Arne Knudsen ,  Shingo Satou ,  Hidekazu Otomaru ,  Hiroshi Makino ,  Andrew Thom ,  Markus Reiterer ,  Gordon Munns ,  Thomas Miltich ,  Joyce Yamamoto

    IPC: A61N1/375 ,  H05K1/09 ,  H05K1/03 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00

    CPC classification number: A61N1/3754 ,  H01B17/30 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/112 ,  H05K3/0044 ,  H05K3/4046 ,  Y10T29/49117

    Abstract: A method of manufacturing an implantable medical device includes manufacturing a hermetic feedthrough by providing a first sheet of unfired ceramic material, forming one or more holes through the sheet, inserting a first conductive material into one of the holes, and forming a pad in electrical contact with the first conductive material in one of the holes, wherein the pad comprises a plurality of layers and has a thickness of at least 50 micrometers, at least one layer comprising a second conductive material having a different composition than the first conductive material. The method further includes co-firing the unfired ceramic material, the first conductive material, and the second conductive material. The method further includes coupling the feedthrough to an encasement structure of the implantable medical device.

    Abstract translation: 一种制造可植入医疗装置的方法包括：通过提供第一片未烧制的陶瓷材料制造密封馈通，通过片材形成一个或多个孔，将第一导电材料插入到一个孔中，并形成电接触的垫 其中所述第一导电材料在所述孔之一中，其中所述焊盘包括多个层并且具有至少50微米的厚度，至少一层包含具有与所述第一导电材料不同的组成的第二导电材料。 该方法还包括共烧焙烧陶瓷材料，第一导电材料和第二导电材料。 该方法还包括将馈通耦合到可植入医疗装置的包装结构。

    Insulator for a feedthrough
    9.
    发明授权
    Insulator for a feedthrough 有权
    绝缘子用于馈通

    公开(公告)号：US09008779B2

    公开(公告)日：2015-04-14

    申请号：US14175812

    申请日：2014-02-07

    Applicant: Kyocera Corporation ,  Medtronic, Inc.

    Inventor： Kengo Morioka ,  Keiichi Fujii ,  Arne Knudsen ,  Shingo Satou ,  Hidekazu Otomaru ,  Hiroshi Makino ,  Andrew Thom ,  Markus Reiterer ,  Gordon Munns ,  Thomas Miltich ,  Joyce Yamamoto

    IPC: A61N1/37 ,  H02G3/22 ,  A61N1/375

    CPC classification number: H02G3/22 ,  A61N1/3754

    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.

    Abstract translation: 用于可植入医疗装置的密封馈通包括绝缘体和套圈。 绝缘体包括陶瓷材料和延伸穿过绝缘体的一个或多个导电导管。 绝缘体设置在套圈的开口中。 绝缘体包括多个基本平坦的表面，每个表面包括多个边缘。 圆角在任何两个相邻的基本上平坦的表面的相邻边缘之间延伸。 面向套圈的任何两个相邻的基本上平坦的表面之间的每个角部的平均半径小于相应边缘的长度的大约25％。

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