公开(公告)号：US20190377147A1

公开(公告)日：2019-12-12

申请号：US16423206

申请日：2019-05-28

Applicant: Mellanox Technologies, Ltd.

Inventor： Pavel Vilner ,  Avner Badihi ,  Liza Nouzman ,  Lena Minz

IPC: G02B6/44 ,  G02B6/38 ,  H05K9/00 ,  H04B10/2575 ,  G02B6/42

Abstract: One embodiment includes an optical connection apparatus, including an optical cable, and a fiber-attach-latch connector terminating the optical cable, and comprising a connector housing including a latch element, the connector housing being configured to be reversibly inserted into a connector receptable of an optical module having an optical transceiver, and a connector boot connected to the connector housing and disposed around a part of the optical cable, wherein at least part of the connector housing is formed from radio-frequency (RF) electromagnetic (EM) radiation absorbing material configured to absorb RF EM interference generated by the optical module.

公开(公告)号：US20200068752A1

公开(公告)日：2020-02-27

申请号：US16521607

申请日：2019-07-25

Applicant: MELLANOX TECHNOLOGIES. LTD.

Inventor： Avner Badihi ,  Pavel Vilner ,  Inbar Gozlan ,  Amir Pinhasovich

IPC: H05K9/00 ,  C09D5/32 ,  C09D175/04 ,  C09D7/61

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

公开(公告)号：US11640933B2

公开(公告)日：2023-05-02

申请号：US17199025

申请日：2021-03-11

Applicant: Mellanox Technologies, Ltd.

Inventor： Pavel Vilner ,  Dmitry Fliter ,  Jacov Brener

IPC: H01L23/498 ,  H01L23/31 ,  H05K3/34

Abstract: Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.

公开(公告)号：US11503751B2

公开(公告)日：2022-11-15

申请号：US17092480

申请日：2020-11-09

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Avner Badihi ,  Pavel Vilner ,  Inbar Gozlan ,  Amir Pinhasovich

IPC: H05K9/00 ,  C09D5/32 ,  C09D7/61 ,  C09D175/04

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

公开(公告)号：US20220293500A1

公开(公告)日：2022-09-15

申请号：US17199025

申请日：2021-03-11

Applicant: Mellanox Technologies, Ltd.

Inventor： Pavel Vilner ,  Dmitry Fliter ,  Jacov Brener

IPC: H01L23/498 ,  H01L23/31 ,  H05K3/34

Abstract: Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.

公开(公告)号：US11191197B2

公开(公告)日：2021-11-30

申请号：US16521607

申请日：2019-07-25

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Avner Badihi ,  Pavel Vilner ,  Inbar Gozlan ,  Amir Pinhasovich

IPC: C09D5/32 ,  H05K9/00 ,  C09D7/61 ,  C09D175/04

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

公开(公告)号：US10705309B2

公开(公告)日：2020-07-07

申请号：US16423206

申请日：2019-05-28

Applicant: Mellanox Technologies, Ltd.

Inventor： Pavel Vilner ,  Avner Badihi ,  Liza Nouzman ,  Lena Minz

IPC: G02B6/44 ,  G02B6/38 ,  H05K9/00 ,  G02B6/42 ,  H04B10/2575

Abstract: One embodiment includes an optical connection apparatus, including an optical cable, and a fiber-attach-latch connector terminating the optical cable, and comprising a connector housing including a latch element, the connector housing being configured to be reversibly inserted into a connector receptable of an optical module having an optical transceiver, and a connector boot connected to the connector housing and disposed around a part of the optical cable, wherein at least part of the connector housing is formed from radio-frequency (RF) electromagnetic (EM) radiation absorbing material configured to absorb RF EM interference generated by the optical module.