METHOD, SYSTEM AND PAINT FOR EMI SUPPRESSION

    公开(公告)号:US20200068752A1

    公开(公告)日:2020-02-27

    申请号:US16521607

    申请日:2019-07-25

    Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

    Silicon photonics connector
    2.
    发明授权

    公开(公告)号:US10146009B2

    公开(公告)日:2018-12-04

    申请号:US15250999

    申请日:2016-08-30

    Abstract: Optical apparatus connecting a Silicon Photonics (SiP) device, which comprises multiple optical waveguides to an array of collimating lenses, configured to collimate light of the multiple optical waveguides into collimated beams. The optical apparatus includes a deflection element, distinct from the SiP device, including a light deflection surface which deflects light from the waveguides by an angle greater than 30 degrees, to the array of collimating lenses.

    Integrated optical cooling core for optoelectronic interconnect modules
    3.
    发明授权
    Integrated optical cooling core for optoelectronic interconnect modules 有权
    用于光电互连模块的集成光学冷却芯

    公开(公告)号:US09016957B2

    公开(公告)日:2015-04-28

    申请号:US14294167

    申请日:2014-06-03

    Abstract: An apparatus includes one or more optoelectronic transducers, driving circuitry, one or more cooling elements, and a light coupling module. The optoelectronic transducers are configured to convert between optical signals conveyed over optical fibers and respective electrical signals. The driving circuitry is configured to process the electrical signals. The cooling elements are configured to remove heat that is produced at least by the driving circuitry. The light coupling module is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for the cooling elements.

    Abstract translation: 一种装置包括一个或多个光电换能器,驱动电路,一个或多个冷却元件和光耦合模块。 光电子传感器被配置为在通过光纤传送的光信号和相应的电信号之间进行转换。 驱动电路被配置为处理电信号。 冷却元件构造成去除至少由驱动电路产生的热量。 光耦合模块被配置为耦合光纤和光电换能器之间的光信号,并且另外用作冷却元件的基板。

    UNIVERSAL REPLACEABLE FAN UNIT FOR DATACENTERS

    公开(公告)号:US20210007240A1

    公开(公告)日:2021-01-07

    申请号:US16502686

    申请日:2019-07-03

    Abstract: A universal replaceable fan unit and method of reversing an airflow direction of a universal replaceable fan unit is provided. The universal replaceable fan unit includes a fan assembly designed to create an airflow from an intake end to an output end. The universal replaceable fan unit also includes a fan mounting that receives and secures the fan assembly in an operable position. The fan mounting includes a frame member and a securing member. The fan mounting is designed to allow the fan assembly to be moved between a first position defining a first airflow direction and a second position defining a second airflow direction. The first airflow direction is opposite the second airflow direction. The universal replaceable fan unit further includes an electrical connector removably attached to the fan assembly. The electrical connector allows electricity to be provided to the fan assembly for operation.

    INTERCONNECTION BETWEEN SILICON PHOTONICS DEVICES AND OPTICAL FIBERS
    6.
    发明申请
    INTERCONNECTION BETWEEN SILICON PHOTONICS DEVICES AND OPTICAL FIBERS 审中-公开
    硅光电器件和光纤之间的互连

    公开(公告)号:US20150010267A1

    公开(公告)日:2015-01-08

    申请号:US13935511

    申请日:2013-07-04

    CPC classification number: G02B6/32 G02B6/30

    Abstract: An apparatus includes a Silicon Photonics (SiP) device and a ferrule. The SiP includes multiple optical waveguides. The ferrule includes multiple optical fibers for exchanging optical signals with the respective optical waveguides of the SiP device. In some embodiments, an array of micro-lenses is configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule. In some embodiments, a polymer layer is placed between the SiP device and the ferrule, and includes multiple polymer-based Spot-Size Converters (SSCs) that are configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule.

    Abstract translation: 一种装置包括硅光子学(SiP)器件和套圈。 SiP包括多个光波导。 套圈包括用于与SiP器件的各个光波导交换光信号的多个光纤。 在一些实施例中,微透镜阵列被配置为耦合SiP器件的光波导与套管的相应光纤之间的光信号。 在一些实施例中,聚合物层被放置在SiP器件和套圈之间,并且包括多个基于聚合物的点尺寸转换器(SSC),其被配置为将SiP器件的光波导与相应的光学器件 套管的纤维。

    INTEGRATED OPTICAL COOLING CORE FOR OPTOELECTRONIC INTERCONNECT MODULES
    7.
    发明申请
    INTEGRATED OPTICAL COOLING CORE FOR OPTOELECTRONIC INTERCONNECT MODULES 有权
    用于光电互连模块的集成光学冷却芯

    公开(公告)号:US20140369651A1

    公开(公告)日:2014-12-18

    申请号:US14294167

    申请日:2014-06-03

    Abstract: An apparatus includes one or more optoelectronic transducers, driving circuitry, one or more cooling elements, and a light coupling module. The optoelectronic transducers are configured to convert between optical signals conveyed over optical fibers and respective electrical signals. The driving circuitry is configured to process the electrical signals. The cooling elements are configured to remove heat that is produced at least by the driving circuitry. The light coupling module is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for the cooling elements.

    Abstract translation: 一种装置包括一个或多个光电换能器,驱动电路,一个或多个冷却元件和光耦合模块。 光电子传感器被配置为在通过光纤传送的光信号和相应的电信号之间进行转换。 驱动电路被配置为处理电信号。 冷却元件构造成去除至少由驱动电路产生的热量。 光耦合模块被配置为耦合光纤和光电换能器之间的光信号,并且另外用作冷却元件的基板。

    Method, system and paint for EMI suppression

    公开(公告)号:US11503751B2

    公开(公告)日:2022-11-15

    申请号:US17092480

    申请日:2020-11-09

    Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

    SYSTEMS, METHODS, AND DEVICES FOR ASSEMBLING LENSES AND WAVEGUIDES

    公开(公告)号:US20220283398A1

    公开(公告)日:2022-09-08

    申请号:US17194582

    申请日:2021-03-08

    Inventor: Avner Badihi

    Abstract: A system comprises a first mechanism configured to hold a first block including a plurality of lenses located on or near a first surface of the first block. The plurality of lenses are configured to receive light to generate a plurality of light spots at or near a second surface of the first block opposite the first surface. The system includes a second mechanism configured to hold a second block including a plurality of waveguides, and to move the second block to bring the plurality of waveguides in alignment with the plurality of lenses using the plurality of light spots as alignment marks.

    SILICON PHOTONICS COLLIMATOR FOR WAFER LEVEL ASSEMBLY

    公开(公告)号:US20220283352A1

    公开(公告)日:2022-09-08

    申请号:US17195180

    申请日:2021-03-08

    Abstract: Embodiments are disclosed for providing a silicon photonics collimator for wafer level assembly. An example apparatus includes a silicon photonics (SiP) device and a micro-optical passive element. The SiP device comprises a set of optical waveguides. The micro-optical passive element is mounted on an edge of a cavity etched into a silicon surface of the SiP device. Furthermore, the micro-optical passive element is configured to direct optical signals between the set of optical waveguides and an external optical element.

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