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公开(公告)号:US20170111721A1
公开(公告)日:2017-04-20
申请号:US14887647
申请日:2015-10-20
Applicant: MOTOROLA SOLUTIONS, INC.
Inventor: Andrew P. Miehl , Deborah A. Gruenhagen , Gary A. Lee , David J. Meyer , Karl F. Mueller , John Kevin Arledge
CPC classification number: H04R1/086 , H04M1/035 , H04R1/04 , H04R1/083 , H04R1/2876 , H04R1/2884 , H04R2420/07 , H04R2499/11 , H05K1/181 , H05K5/0213
Abstract: A method and apparatus are described for providing an acoustically-resistive air-permeable venting structure within a sealed microphone acoustic cavity. A microphone is mounted on a printed circuit board and positioned within a housing. A water-resistant membrane seals the microphone from an exterior of the housing, and a active acoustic cavity establishes an acoustical connection between the water-resistant membrane and the microphone. An acoustically-resistive air-permeable venting structure is formed in the body of the printed circuit board and connects to the active acoustic cavity either directly or via a separate vent path. The venting structure provides a viscous dampening effect by venting an active acoustic cavity of the electronic device to the rest of the enclosure sealed by the water-resistant membrane.
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公开(公告)号:US09930435B2
公开(公告)日:2018-03-27
申请号:US14887647
申请日:2015-10-20
Applicant: MOTOROLA SOLUTIONS, INC.
Inventor: Andrew P. Miehl , Deborah A. Gruenhagen , Gary A. Lee , David J. Meyer , Karl F. Mueller , John Kevin Arledge
CPC classification number: H04R1/086 , H04M1/035 , H04R1/04 , H04R1/083 , H04R1/2876 , H04R1/2884 , H04R2420/07 , H04R2499/11 , H05K1/181 , H05K5/0213
Abstract: A method and apparatus are described for providing an acoustically-resistive air-permeable venting structure within a sealed microphone acoustic cavity. A microphone is mounted on a printed circuit board and positioned within a housing. A water-resistant membrane seals the microphone from an exterior of the housing, and a active acoustic cavity establishes an acoustical connection between the water-resistant membrane and the microphone. An acoustically-resistive air-permeable venting structure is formed in the body of the printed circuit board and connects to the active acoustic cavity either directly or via a separate vent path. The venting structure provides a viscous dampening effect by venting an active acoustic cavity of the electronic device to the rest of the enclosure sealed by the water-resistant membrane.
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