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公开(公告)号：US09930435B2
公开(公告)日：2018-03-27
申请号：US14887647
申请日：2015-10-20
Applicant: MOTOROLA SOLUTIONS, INC.
Inventor： Andrew P. Miehl , Deborah A. Gruenhagen , Gary A. Lee , David J. Meyer , Karl F. Mueller , John Kevin Arledge
CPC classification number: H04R1/086 , H04M1/035 , H04R1/04 , H04R1/083 , H04R1/2876 , H04R1/2884 , H04R2420/07 , H04R2499/11 , H05K1/181 , H05K5/0213
Abstract: A method and apparatus are described for providing an acoustically-resistive air-permeable venting structure within a sealed microphone acoustic cavity. A microphone is mounted on a printed circuit board and positioned within a housing. A water-resistant membrane seals the microphone from an exterior of the housing, and a active acoustic cavity establishes an acoustical connection between the water-resistant membrane and the microphone. An acoustically-resistive air-permeable venting structure is formed in the body of the printed circuit board and connects to the active acoustic cavity either directly or via a separate vent path. The venting structure provides a viscous dampening effect by venting an active acoustic cavity of the electronic device to the rest of the enclosure sealed by the water-resistant membrane.
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公开(公告)号：US20230225060A1
公开(公告)日：2023-07-13
申请号：US17571092
申请日：2022-01-07
Applicant: MOTOROLA SOLUTIONS, INC.
Inventor： Edwin L. Bradley , Anthony J. Suppelsa , David J. Meyer
IPC: H05K3/34 , H01L23/498 , H01L23/00 , H05K1/11
CPC classification number: H05K3/3436 , H01L23/49816 , H01L24/16 , H05K1/111 , H01L2924/15311 , H05K2201/10734
Abstract: A conductive solder pad for a ball grid array (BGA) includes a concave edge to accommodate a via that exits a substrate at a position at the surface of the substrate that is offset from the solder pad. The offset arrangement of the via and solder pad allow for differential thermal expansion of the substrate material and the via material with reduced risk of cracking or fracturing the solder joint. The concave edge of the solder pad provides a gap from the via to avoid unintended electrical connections while maintaining the solder-joint pitch of the BGA.
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公开(公告)号：US20170111721A1
公开(公告)日：2017-04-20
申请号：US14887647
申请日：2015-10-20
Applicant: MOTOROLA SOLUTIONS, INC.
Inventor： Andrew P. Miehl , Deborah A. Gruenhagen , Gary A. Lee , David J. Meyer , Karl F. Mueller , John Kevin Arledge
CPC classification number: H04R1/086 , H04M1/035 , H04R1/04 , H04R1/083 , H04R1/2876 , H04R1/2884 , H04R2420/07 , H04R2499/11 , H05K1/181 , H05K5/0213
Abstract: A method and apparatus are described for providing an acoustically-resistive air-permeable venting structure within a sealed microphone acoustic cavity. A microphone is mounted on a printed circuit board and positioned within a housing. A water-resistant membrane seals the microphone from an exterior of the housing, and a active acoustic cavity establishes an acoustical connection between the water-resistant membrane and the microphone. An acoustically-resistive air-permeable venting structure is formed in the body of the printed circuit board and connects to the active acoustic cavity either directly or via a separate vent path. The venting structure provides a viscous dampening effect by venting an active acoustic cavity of the electronic device to the rest of the enclosure sealed by the water-resistant membrane.
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