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公开(公告)号：US20090159453A1
公开(公告)日：2009-06-25
申请号：US12172104
申请日：2008-07-11
IPC分类号： C25D3/46
摘要： The aim of the present invention is to provide a method for silver plating that does not comprise the step of forming the nickel-underlayer and that can form a silver-plated layer having sufficient adherence directly on the difficult-to-plate substrates with the use of a halide-free plating bath under a good working environment. The present invention provides a silver plating method onto a substrate on which an oxide layer inhibiting adherence of a plated layer is prone to form, comprising at least the following steps of; (A) degreasing the substrate, (B) removing the oxide layer with a strongly acidic solution from the substrate, and (C) silver plating onto the substrate, without a step of nickel or nickel alloy strike plating in advance, utilizing a phosphines-containing acidic silver plating bath which essentially does not contain halide ion or cyanide ion.
摘要翻译： 本发明的目的是提供一种镀银方法，其不包括形成镍底层的步骤，并且可以在使用中直接形成具有足够粘附性的镀银层 的无卤电镀槽在良好的工作环境下。 本发明提供一种镀银方法，其至少包括以下步骤：在其上易于形成抑制镀层粘附的氧化物层的基板上。 （A）对基材脱脂，（B）从基材除去氧化层，用强酸性溶液除去氧化物层，（C）镀银到基板上，不用预先进行镍或镍合金电镀步骤， 含有基本上不含卤离子或氰离子的酸性银镀液。
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公开(公告)号：US20070284258A1
公开(公告)日：2007-12-13
申请号：US11759417
申请日：2007-06-07
IPC分类号： C25D3/46
摘要： The invention provides a method for silver plating using a non-cyanide acid silver plating bath to form a silver plating film exhibiting good adhesiveness while suppressing dissolution of resist in pattern plating. The method includes conducting strike plating using a non-cyanide acid strike plating bath prior to the silver plating.
摘要翻译： 本发明提供一种使用非氰化物银镀浴进行镀银的方法，以形成具有良好粘附性的银镀膜，同时抑制图案电镀中抗蚀剂的溶解。 该方法包括在镀银之前使用非氰化物酸冲击镀浴进行触击镀。
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