公开(公告)号：US20130104389A1

公开(公告)日：2013-05-02

申请号：US13718415

申请日：2012-12-18

Applicant: Masaki YONEDA

Inventor： Masaki YONEDA

IPC: H01C17/00 ,  H01C17/28

CPC classification number: H01C17/006 ,  H01C1/148 ,  H01C7/003 ,  H01C17/28 ,  H01C17/281 ,  H01C17/288 ,  Y10T29/49082 ,  Y10T29/49101

Abstract: A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.

Abstract translation: 制造片式电阻器的方法包括以下步骤。 在材料基板的正面上形成电阻层。 通过在材料基板的正面中形成多个在第一方向上被拉长的多个第一凹槽，在材料基板中形成多个基板部分。 导体层形成在每个第一凹槽中。 沿着沿与第一方向不同的第二方向延伸的线切割衬底部分。

公开(公告)号：US20110285498A1

公开(公告)日：2011-11-24

申请号：US13109276

申请日：2011-05-17

Applicant: Masaki YONEDA ,  Makoto TOYONAGA

Inventor： Masaki YONEDA ,  Makoto TOYONAGA

IPC: H01C1/012

CPC classification number: H01C1/014 ,  H01C1/144 ,  H01C7/003

Abstract: A surface-mounted resistor includes a flat-type base member having a first surface, a second surface, and a lateral surface. Each of the first and second surfaces has a rectangular shape. The surface-mounted resistor also includes a resistance element faulted on the first surface; a pair of internal electrodes formed on both ends of the resistance element by being partially superposed with the resistance element; and a pair of external electrodes. Each of the external electrodes has a first bended portion having an L-shape formed by an internal electrode connection portion and a lateral portion, and a second bended portion having an L-shape formed by the lateral portion and a substrate connection portion. The internal electrode and the internal electrode connection portion are fixed to each other through a conductive fixation material, and a position of the base member is biased in a thickness direction toward the first bended portion.

Abstract translation: 表面安装的电阻器包括具有第一表面，第二表面和侧表面的平坦型基底构件。 第一和第二表面中的每一个具有矩形形状。 表面安装电阻器还包括在第一表面上故障的电阻元件; 一对内电极，与所述电阻元件部分重叠地形成在所述电阻元件的两端; 和一对外部电极。 每个外部电极具有由内部电极连接部分和侧部形成的具有L形的第一弯曲部分和由侧部形成的L形的第二弯曲部分和基板连接部分。 内部电极和内部电极连接部分通过导电固定材料彼此固定，并且基底部件的位置朝向第一弯曲部分的厚度方向偏置。

公开(公告)号：US20110018677A1

公开(公告)日：2011-01-27

申请号：US12839888

申请日：2010-07-20

Applicant: Masaki YONEDA

Inventor： Masaki YONEDA

IPC: H01C1/012 ,  H01L21/02

CPC classification number: H01C17/006 ,  H01C1/148 ,  H01C7/003 ,  H01C17/28 ,  H01C17/281 ,  H01C17/288 ,  Y10T29/49082 ,  Y10T29/49101

Abstract: A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.

Abstract translation: 制造片式电阻器的方法包括以下步骤。 在材料基板的正面上形成电阻层。 通过在材料基板的正面中形成多个在第一方向上被拉长的多个第一凹槽，在材料基板中形成多个基板部分。 导体层形成在每个第一凹槽中。 沿着沿与第一方向不同的第二方向延伸的线切割衬底部分。

公开(公告)号：US20100171584A1

公开(公告)日：2010-07-08

申请号：US12639617

申请日：2009-12-16

Applicant: Masaki YONEDA

Inventor： Masaki YONEDA

IPC: H01C7/00

CPC classification number: H01C1/148 ,  H01C1/028 ,  H01C1/032 ,  H01C7/003

Abstract: A chip resistor of the present invention includes a substrate, a pair of electrode elements, a resistive layer, and a protective layer. The substrate is made of an insulating material and includes a first surface, a second surface opposite the first surface and a thickness defined between the first surface and the second surface. The electrode elements are formed on the first surface of the substrate and spaced apart from each other. The resistive layer is formed on the first surface of the substrate and electrically connected to the electrode elements. The protective layer is provided to cover the resistive layer. The first surface of the substrate is a mount side surface to face toward a mounting target, on which the chip resistor is mounted. Each of the electrode elements comprises an electrode layer and a conductive layer. The electrode layer is electrically connected directly to the resistive layer. The conductive layer is formed on the electrode layer. The boundary between the electrode layer and the conductive layer in each of the electrode elements is positioned closer to the substrate than the end surface of the protective layer in the thickness direction of the substrate.

Abstract translation: 本发明的片式电阻器包括衬底，一对电极元件，电阻层和保护层。 衬底由绝缘材料制成，并且包括第一表面，与第一表面相对的第二表面和限定在第一表面和第二表面之间的厚度。 电极元件形成在基板的第一表面上并彼此间隔开。 电阻层形成在基板的第一表面上并与电极元件电连接。 提供保护层以覆盖电阻层。 衬底的第一表面是安装侧面，面向安装对象，安装有芯片电阻器。 每个电极元件包括电极层和导电层。 电极层直接电连接到电阻层。 导电层形成在电极层上。 每个电极元件中的电极层和导电层之间的边界在基板的厚度方向上比保护层的端面更靠近基板。