公开(公告)号：US06984880B2

公开(公告)日：2006-01-10

申请号：US10702603

申请日：2003-11-07

申请人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

IPC分类号： H01L23/495 ,  H01L23/28

CPC分类号： H01L21/568 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68318 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01083 ,  H01L2924/00

摘要： A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).

公开(公告)号：US06720207B2

公开(公告)日：2004-04-13

申请号：US09971731

申请日：2001-10-09

申请人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

IPC分类号： H01L2150

CPC分类号： H01L21/568 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68318 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01083 ,  H01L2924/00

摘要： A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).