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    Device control transfer
    2.
    发明公开
    Device control transfer 审中-公开

    公开(公告)号：US20240205021A1

    公开(公告)日：2024-06-20

    申请号：US18497000

    申请日：2023-10-30

    Applicant: MELLANOX TECHNOLOGIES, LTD.

    Inventor： Nir Eilam ,  Yuval Itkin ,  Haim Kupershmidt ,  Yigal Edery ,  Uriya Stern ,  Boaz Shahar ,  Mor Sfadia

    IPC: H04L9/32 ,  H04L9/08

    CPC classification number: H04L9/3247 ,  H04L9/0825 ,  H04L9/3263

    Abstract: In one embodiment, a device includes a memory to store a first public key indicating security ownership of the device by a first owner, an interface to receive a signature of an intermediate public key signed by a first owner signing service with a first private key, and processing circuitry to load the intermediate public key in the memory, responsively to authenticating the signature, and remove the first public key from the memory, and wherein the interface is to receive a second public key and a signature of the second public key signed by a second owner signing service with an intermediate private key, the processing circuitry is to load a second public key in the memory indicating ownership has been transferred to the second owner responsively to authenticating the signature of the second public key with the intermediate public key, and remove the intermediate public key from the memory.

    Estimating ambient airflow based on temperature sensing
    3.
    发明申请
    Estimating ambient airflow based on temperature sensing 有权

    公开(公告)号：US20250126742A1

    公开(公告)日：2025-04-17

    申请号：US18485368

    申请日：2023-10-12

    Applicant: MELLANOX TECHNOLOGIES, LTD.

    Inventor： Adi Yekutiel ,  Haim Kupershmidt

    IPC: H05K7/20

    Abstract: An apparatus includes an interface and a processor. The interface is configured to receive measurements of a first temperature of an integrated circuit (IC), and a second temperature of air in a case that surrounds the IC. The processor is configured to: (a) estimate a thermal resistance between the IC and the air, and (b) estimate, based on (i) the thermal resistance between the IC and the air, and (ii) the first and second temperatures, a flow rate of the air flowing through the case for dissipating heat generated by the IC.

    Multi-destination challenge-response security tokens
    4.
    发明授权
    Multi-destination challenge-response security tokens 有权

    公开(公告)号：US12231585B2

    公开(公告)日：2025-02-18

    申请号：US17745906

    申请日：2022-05-17

    Applicant: MELLANOX TECHNOLOGIES, LTD.

    Inventor： Yuval Itkin ,  Michael Tahar ,  Haim Kupershmidt ,  Ameer Mahagneh

    IPC: H04L9/32

    Abstract: In one embodiment, a secure challenge-response method includes requesting respective token challenges from devices, receiving the respective token challenges from the devices, providing the respective token challenges to a signing server, receiving from the signing server a signature of the respective token challenges signed with a private key of the signing server, and providing to a given device of the devices a request to perform an operation, the request including the signature and the respective token challenges.

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