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    Apparatus for polishing edge surface of glass substrate for magnetic recording media, and process for producing glass substrate
    5.
    发明授权
    Apparatus for polishing edge surface of glass substrate for magnetic recording media, and process for producing glass substrate 失效
    用于研磨用于磁记录介质的玻璃基板的边缘表面的设备，以及用于生产玻璃基板的工艺

    公开(公告)号：US08021212B2

    公开(公告)日：2011-09-20

    申请号：US12396191

    申请日：2009-03-02

    申请人： Shohei Chida ,  Masami Kaneko ,  Mitsuhiko Komakine

    发明人： Shohei Chida ,  Masami Kaneko ,  Mitsuhiko Komakine

    IPC分类号： B24B1/00

    CPC分类号： B24B9/065

    摘要： An apparatus for polishing an edge surface of a glass substrate for magnetic recording media. The apparatus includes a grindstone including abrasive grains mixed with a resin. The grindstone is configured to polish at least the edge surface of the glass substrate. The grindstone has a reentrant groove with a bottom surface and sidewall surfaces such that the bottom surface of the reentrant groove contacts the edge surface of the glass substrate and the sidewall surfaces of the reentrant groove contacts chamfered sidewalls of the glass substrate. The reentrant groove and sidewall surfaces are formed in the resin of the grindstone by pressing the glass substrate into the resin of the grindstone with a force higher than a pressing force during polishing.

    摘要翻译： 一种用于抛光用于磁记录介质的玻璃基板的边缘表面的设备。 该装置包括包括与树脂混合的磨料颗粒的磨石。 磨石构造成至少抛光玻璃基板的边缘表面。 磨石具有具有底表面和侧壁表面的凹槽，使得凹陷槽的底表面接触玻璃基底的边缘表面，并且凹槽的侧壁表面接触玻璃基底的倒角侧壁。 通过以高于抛光时的按压力的力将玻璃基板压入砂轮的树脂中，在砂轮的树脂中形成凹槽和侧壁表面。

    CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR
    7.
    发明申请
    CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR 有权
    粘合剂，固化剂，固化剂，环氧树脂组合物和环氧树脂组合物，用于封装半导体

    公开(公告)号：US20120004377A1

    公开(公告)日：2012-01-05

    申请号：US13138654

    申请日：2010-03-15

    申请人： Masami Kaneko ,  Kazuo Ono

    发明人： Masami Kaneko ,  Kazuo Ono

    IPC分类号： C08G59/42 ,  C07D233/64 ,  C07D487/04 ,  C07D233/58

    CPC分类号： H01L23/293 ,  C07D221/02 ,  C07D233/54 ,  C07D233/56 ,  C07D233/58 ,  C07D233/60 ,  C07D233/61 ,  C07D233/64 ,  C08G59/4007 ,  C08G59/4014 ,  C08G59/4223 ,  C08G59/70 ,  H01L2924/0002 ,  H01L2924/00

    摘要： It is an object of the present invention to provide a clathrate that suppresses a curing reaction at low temperature to promote an improvement in storage stability (one-component stability), and can effectively cure a resin by heating treatment. A clathrate suitable for the clathrate is a clathrate containing (b1) at least one selected from the group consisting of an aliphatic polyvalent carboxylic acid, 5-nitroisophthalic acid, 5-tert-butylisophthalic acid, 5-hydroxyisophthalic acid, isophthalic acid, and benzophenone-4,4′-dicarboxylic acid; and (b2) at least one selected from the group consisting of an imidazole compound represented by the following formula (I), and 1,8-diazabicyclo[5.4.0]undecene-7, at a molar ratio of 1:1.

    摘要翻译： 本发明的目的是提供一种抑制低温固化反应以提高储存稳定性（单组分稳定性）的包合物，并且可以通过加热处理有效固化树脂。 适用于包合物的包合物是含有（b1）选自脂肪族多元羧酸，5-硝基间苯二甲酸，5-叔丁基间苯二甲酸，5-羟基间苯二甲酸，间苯二甲酸和二苯甲酮中的至少一种的包合物 -4,4'-二羧酸; 和（b2）选自由下式（I）表示的咪唑化合物和1,8-二氮杂双环[5.4.0]十一碳烯-7中的至少一种，摩尔比为1:1。

    Method for etching doughnut-type glass substrates
    8.
    发明申请
    Method for etching doughnut-type glass substrates 失效

    公开(公告)号：US20060118521A1

    公开(公告)日：2006-06-08

    申请号：US11274303

    申请日：2005-11-16

    申请人： Osamu Miyahara ,  Masami Kaneko

    发明人： Osamu Miyahara ,  Masami Kaneko

    IPC分类号： B44C1/22

    CPC分类号： H01L21/67063

    摘要： A method for etching doughnut-type glass substrates, which comprises laminating a plurality of doughnut-type glass substrates each having a circular hole at its center so that the circular holes form a cylindrical hole, and applying an etching treatment to inner peripheral edge surfaces of the plurality of the laminated doughnut-type glass substrates all at once by means of an etching liquid or an etching gas, wherein the etching liquid or the etching gas is supplied from one end of the cylindrical hole, made to flow in the cylindrical hole, and discharged from the other end of the cylindrical hole so that it is not in contact with exposed main surfaces of the doughnut-type glass substrates at both ends of the laminate consisting of the doughnut-type glass substrates.

    Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin
    9.
    发明授权
    Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin 有权
    包封化合物，固化催化剂，用于形成固化树脂的组合物和固化树脂

    公开(公告)号：US08735529B2

    公开(公告)日：2014-05-27

    申请号：US13331772

    申请日：2011-12-20

    申请人： Masami Kaneko ,  Natsuki Amanokura

    发明人： Masami Kaneko ,  Natsuki Amanokura

    IPC分类号： C07C63/24 ,  C08G59/68 ,  C08L63/00

    CPC分类号： C07C63/24 ,  C07C205/57 ,  C07D233/58 ,  C07D233/64 ,  C08G59/68 ,  C08G59/686

    摘要： A curing catalyst (clathrate compound) for which the curing reaction is suppressed at low temperatures, allowing an improvement in the one-pot stability, but which can effectively cure a resin upon heat treatment. The clathrate compound includes at least an isophthalic acid compound represented by Formula (I), where R1 represents a C1 to C6 alkyl group, a C1 to C6 alkoxy group, a nitro group, or a hydroxyl group, and an imidazole compound represented by a Formula (II) where R2 represents a hydrogen atom, a C1 to C10 alkyl group, a phenyl group, a benzyl group, or a cyanoethyl group, and R3 to R5 each independently represents a hydrogen atom, a nitro group, or a halogen atom, or a C1 to C20 alkyl group, phenyl group, benzyl group, or C1 to C20 acyl group that may have a substituent.

    摘要翻译： 固化反应在低温下被抑制的固化催化剂（包合化合物），可提高一锅稳定性，但能够在热处理时有效地固化树脂。 包合化合物至少包含式（I）表示的间苯二甲酸化合物，其中R1表示C1至C6烷基，C1至C6烷氧基，硝基或羟基，以及由 式（II）其中R2表示氢原子，C1至C10烷基，苯基，苄基或氰基乙基，R3至R5各自独立地表示氢原子，硝基或卤素原子 ，或可以具有取代基的C1〜C20烷基，苯基，苄基或C1〜C20酰基。

    INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
    10.
    发明申请
    INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION 失效
    包含环氧树脂组合物的复合物用于半导体封装

    公开(公告)号：US20100179250A1

    公开(公告)日：2010-07-15

    申请号：US12733462

    申请日：2008-09-19

    申请人： Kazuo Ono ,  Masami Kaneko ,  Natsuki Amanokura

    发明人： Kazuo Ono ,  Masami Kaneko ,  Natsuki Amanokura

    IPC分类号： C08K5/3445

    CPC分类号： H01L23/293 ,  C08G59/4014 ,  C08G59/621 ,  C08G59/686 ,  C09J163/00 ,  H01L2924/0002 ,  H01L2924/00

    摘要： It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors.It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R2 represents a hydrogen atom, etc.; R3 to R5 represent a hydrogen atom, etc.).

    摘要翻译： 提高密封剂的储存稳定性，在密封时保持密封剂的流动性，并通过加热来实现密封剂的有效固化速度，以适用于精密半导体的密封剂。 它是用于密封半导体的环氧树脂组合物，其包含以下组分（A）和组分（B）。 （A）环氧树脂，（B）包含（b1）芳族羧酸化合物的包合络合物和（b2）至少一种由式（II）表示的咪唑化合物（其中R2表示氢原子等; R3 R5代表氢原子等）。