公开(公告)号：US20180223094A1

公开(公告)日：2018-08-09

申请号：US15807163

申请日：2017-11-08

申请人： ITEQ CORPORATION

发明人： Kai-Yang CHEN ,  Chun-Hao CHANG ,  Yu-Chieh HSU

IPC分类号： C08L63/00 ,  C08G59/40 ,  H01B3/40 ,  H01B3/30

CPC分类号： C08L63/00 ,  C08G59/4071 ,  C08G59/4223 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2205/02 ,  C08L2205/03 ,  H01B3/303 ,  H01B3/40 ,  C08K3/36 ,  C08K5/0066 ,  C08L79/08

摘要： The present invention discloses a halogen-free epoxy resin composition having low dielectric loss, comprises: (A) 100 parts by weight of an epoxy resin; (B) 10-30 parts by weight of a DOPO modified curing agent; (C) 1-10 parts by weight of benzoxazine resin; (D) 60-90 parts by weight of an active ester compound; (E) 20-50 parts by weight of a flame retardant; and (F) 0.5-10 parts by weight of a curing accelerator. The halogen-free epoxy resin composition uses active ester as a curing agent of the epoxy resin to ensure that the hardening product has characteristics such as low dielectric constant (Dk), low dielectric loss (Df), high heat resistance, low water absorption, flame retardant and halogen-free. The halogen-free epoxy resin composition of the present invention is used for manufacturing semi-cured prepregs or resin-coated films, and is applied toward manufacturing metal clad laminates and printed circuit boards.

公开(公告)号：US09497857B2

公开(公告)日：2016-11-15

申请号：US13498784

申请日：2010-09-13

申请人： Kenji Miyata ,  Toshitaka Yamagata

发明人： Kenji Miyata ,  Toshitaka Yamagata

IPC分类号： B32B15/08 ,  H05K1/03 ,  C08G59/42 ,  C08G59/62 ,  C08L63/00

CPC分类号： H05K1/0373 ,  C08G59/4223 ,  C08G59/621 ,  C08L63/00 ,  H05K1/0326 ,  H05K2201/0209 ,  Y10T156/1043 ,  Y10T156/1052

摘要： An object of the present invention is to provide an insulating sheet superior in heat dissipation efficiency, heat resistance, insulation efficiency and moldability. Provided is a sheet-shaped insulating sheet of a resin composition containing an epoxy resin, a curing agent and an inorganic filler, wherein one or both of the epoxy resin and the curing agent have a naphthalene structure, the inorganic filler contains hexagonal boron nitride, and the inorganic filler is contained in an amount of 70 to 85 vol % in the entire resin composition. It is possible to increase the filling efficiency of an inorganic filler in the insulating sheet by using an epoxy resin and/or a curing agent having a naphthalene structure, which are favorably compatible with the hexagonal boron nitride contained in the inorganic filler.

摘要翻译： 本发明的目的是提供一种绝热片，其散热效率，耐热性，绝缘效率和成型性优异。 提供一种含有环氧树脂，固化剂和无机填料的树脂组合物的片状绝缘片，其中一种或两种环氧树脂和固化剂具有萘结构，无机填料含有六方氮化硼， 并且在整个树脂组合物中，无机填料的含量为70〜85体积％。 可以通过使用具有萘结构的环氧树脂和/或固化剂，与无机填料中所含的六方氮化硼有利地相容，来提高绝缘片中无机填料的填充效率。

公开(公告)号：US09346911B2

公开(公告)日：2016-05-24

申请号：US14356043

申请日：2012-11-20

申请人： Blue Cube IP LLC

发明人： Markus Schrötz ,  Stefano C. Grassini ,  Marcus Pfarherr ,  Jeurgen Gaebel

IPC分类号： C08G59/42 ,  C08G59/44 ,  C08G59/50 ,  C08G59/68 ,  C08G59/62 ,  C08L63/00 ,  C08G59/18 ,  C09D163/00

CPC分类号： C08G59/5026 ,  C08G59/184 ,  C08G59/4215 ,  C08G59/4223 ,  C08G59/44 ,  C08G59/50 ,  C08G59/5006 ,  C08G59/502 ,  C08G59/5033 ,  C08G59/621 ,  C08G59/683 ,  C08G59/686 ,  C08L63/00 ,  C09D163/00 ,  C08L67/00 ,  C08L77/00

摘要： A salicylic acid salt-containing liquid composition useful as an accelerator for a hardener includes a reaction product of (a) salicylic acid; and (b) at least one amine compound compatible with said salicylic acid such that the composition is in liquid form, the composition has a concentration of salicylic acid at from about 35 weight percent to about 55 weight percent, and the composition has a viscosity in the range of from about 500 mPas to about 20,000 mPa-s at 25° C.; a curable epoxy resin composition containing the salicylic acid salt-containing liquid composition accelerator; and a cured product made from the curable composition.

摘要翻译： 可用作固化剂促进剂的含水杨酸盐的液体组合物包括（a）水杨酸的反应产物; 和（b）至少一种与所述水杨酸相容的胺化合物，使得组合物为液体形式，该组合物的水杨酸浓度为约35重量％至约55重量％，组合物的粘度为 在25℃下的范围为约500mPas至约20,000mPa·s; 含有含水杨酸盐的液体组合物促进剂的可固化环氧树脂组合物; 和由可固化组合物制成的固化产物。

公开(公告)号：US08962234B2

公开(公告)日：2015-02-24

申请号：US14003480

申请日：2012-03-08

申请人： Ryuji Ohnishi ,  Takafumi Endo ,  Rikimaru Sakamoto

发明人： Ryuji Ohnishi ,  Takafumi Endo ,  Rikimaru Sakamoto

IPC分类号： G03F7/004 ,  G03F7/11 ,  C08G63/60

CPC分类号： G03F7/09 ,  C08G59/1455 ,  C08G59/4223 ,  G03F7/11 ,  G03F7/38

摘要： A resist underlayer film forming composition for lithography, includes: a polymer including a structure of formula (1) below at a terminal of a polymer chain; a cross-linking agent; a compound that promotes a cross-linking reaction; and an organic solvent: (where R1, R2, and R3 are each independently a hydrogen atom, a linear or branched hydrocarbon group having a carbon atom number of 1 to 13, or a hydroxy group; at least one of R1, R2, and R3 is the hydrocarbon group; m and n are each independently 0 or 1; and a main chain of the polymer is bonded to a methylene group when n is 1 and bonded to a group represented by —O— when n is 0).

摘要翻译： 用于光刻的抗蚀剂下层膜形成组合物包括：在聚合物链的末端包含下式（1）结构的聚合物; 交联剂; 促进交联反应的化合物; 和有机溶剂：（其中，R 1，R 2和R 3各自独立地为氢原子，碳原子数为1〜13的直链或支链烃基或羟基; R1，R2和 R3是烃基; m和n各自独立地为0或1;当n为1时，聚合物的主链与亚甲基结合，当n为0时，与-O - 表示的基团键合。

公开(公告)号：US20140336301A1

公开(公告)日：2014-11-13

申请号：US13577043

申请日：2011-02-04

申请人： Dean C. Webster ,  Partha Pratim Sengupta ,  Zhigang Chen ,  Xiao Pan ,  Adlina Paramarta

发明人： Dean C. Webster ,  Partha Pratim Sengupta ,  Zhigang Chen ,  Xiao Pan ,  Adlina Paramarta

IPC分类号： C09D163/00 ,  C08G59/17 ,  C08G59/14 ,  C08G59/02 ,  C08G59/16

CPC分类号： C08G59/027 ,  C07D303/16 ,  C08G59/02 ,  C08G59/1438 ,  C08G59/1455 ,  C08G59/1466 ,  C08G59/34 ,  C08G59/4207 ,  C08G59/4215 ,  C08G59/4223 ,  C08L63/00 ,  C08L63/10 ,  C09D163/00 ,  C09D163/08 ,  C09D175/08

摘要： The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.

摘要翻译： 本发明提供高功能的环氧树脂，其可以自己用于涂料配方和应用中，但可以通过环氧基团的开环反应进一步官能化，从而产生衍生树脂与其它有用的官能团。 高功能环氧树脂由具有4个或更多个羟基/分子的多元醇的植物油或种子油酯的环氧化合成。 在一个实施方案中，多元醇是蔗糖，植物油或种子油选自玉米油，蓖麻油，大豆油，红花油，向日葵油，亚麻籽油，妥尔油脂肪酸，桐油，葵花籽油及其混合物。 公开了环氧树脂及其衍生树脂的制备方法，即涂料组合物和使用每种树脂的涂覆物体。

公开(公告)号：US08791214B2

公开(公告)日：2014-07-29

申请号：US13824821

申请日：2012-05-25

申请人： Kan Takeuchi ,  Etsuko Suzuki ,  Kunihiro Morinaga ,  Kazuo Arita

发明人： Kan Takeuchi ,  Etsuko Suzuki ,  Kunihiro Morinaga ,  Kazuo Arita

IPC分类号： B32B15/092 ,  B32B27/04 ,  C08G8/32 ,  C08L61/14 ,  C08L63/00

CPC分类号： H05K3/00 ,  C08G8/32 ,  C08G59/4223 ,  C08G63/133 ,  C08G63/605 ,  C08J5/24 ,  C09D161/14 ,  C09D167/00 ,  H01L23/29 ,  H01L2924/0002 ,  H05K1/0353 ,  Y10T428/2915 ,  Y10T428/31529 ,  Y10T442/2475 ,  C08L63/00 ,  H01L2924/00

摘要： A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).

摘要翻译： 实现了低介电常数，低介电损耗角正切和耐热性。 具有通过使多官能性酚化合物（a1）与单官能芳族羧酸或其氯化物（a2）和芳香族二羧酸或其氯化物（a3）反应而制造的树脂结构的活性酯树脂。 多官能酚类化合物（a1）由下述结构式（1）表示：（其中Ar表示苯环，萘环，被碳原子数1〜4的烷基核取代的苯环或萘环 被具有1至4个碳原子的烷基核取代，X表示亚甲基，二价环状脂族烃基，亚苯基二亚甲基或亚联苯基 - 二亚甲基，n表示重复单元的数量和平均 在0.5〜10的范围内。

公开(公告)号：US20140058014A1

公开(公告)日：2014-02-27

申请号：US14071742

申请日：2013-11-05

申请人： Edward Norman Peters

发明人： Edward Norman Peters

IPC分类号： C08L63/00

CPC分类号： C08L63/00 ,  B32B27/04 ,  B32B27/38 ,  B32B37/18 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2457/08 ,  C08G59/4215 ,  C08G59/4223 ,  C08G59/4276 ,  C08G59/54 ,  C08G59/686 ,  C08G65/485 ,  C08J5/24 ,  C08J2371/12 ,  C08K3/013 ,  C08K3/28 ,  C08K3/38 ,  C08K5/01 ,  C08K5/02 ,  C08K5/06 ,  C08K5/07 ,  C08K5/101 ,  C08K5/315 ,  C08K7/14 ,  C08K2003/2217 ,  C08K2003/2227 ,  C08K2003/382 ,  C08L63/04 ,  C08L63/06 ,  C08L71/126 ,  H05K1/0366 ,  H05K1/0373 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/24994 ,  Y10T428/31511

摘要： An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.

摘要翻译： 环氧苄基封端的聚（亚芳基醚）具有结构R-W-R，其中W是用酚氧原子封端的二价聚（亚芳基醚）残基，R是环氧苄基，其中R出现相同或不同。 环氧苄基封端的聚（亚芳基醚）通过使含过氧化物的试剂与乙烯基封端的聚（亚芳基醚）反应形成。 还公开了包含环氧苄基封端的聚（亚芳基醚），固化促进剂和任选的辅助环氧树脂的可固化组合物。 可固化组合物可用于制备复合材料，特别是用于制造印刷电路板的复合材料。

公开(公告)号：US20130199830A1

公开(公告)日：2013-08-08

申请号：US13816206

申请日：2011-08-05

申请人： Masaki Morita ,  Konatsu Nakamura ,  Shin Takanezawa

发明人： Masaki Morita ,  Konatsu Nakamura ,  Shin Takanezawa

IPC分类号： C09D163/00 ,  H05K1/03

CPC分类号： C09D163/00 ,  C08G59/22 ,  C08G59/24 ,  C08G59/38 ,  C08G59/4223 ,  C08G59/4276 ,  C08G59/68 ,  C08L63/00 ,  H05K1/0306 ,  H05K1/0353 ,  H05K3/46

摘要： By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.

摘要翻译： 通过在一分子中制备含有（A）具有两个以上环氧基的环氧树脂并含有己二醇结构的树脂组合物的树脂组合物，（B）含有紫外线活性酯基的化合物和（C）环氧树脂固化促进剂 即使在绝缘树脂层的表面的不规则形状小的状态下，也能够容易地显露对布线导体的高粘合力。

公开(公告)号：US20080044660A1

公开(公告)日：2008-02-21

申请号：US11892366

申请日：2007-08-22

申请人： Minoru Takaya ,  Toshikazu Endo ,  Kenichi Kawabata

发明人： Minoru Takaya ,  Toshikazu Endo ,  Kenichi Kawabata

IPC分类号： B32B27/38

CPC分类号： B32B15/08 ,  B32B9/005 ,  B32B27/08 ,  B32B2305/076 ,  B32B2305/08 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/206 ,  C08G59/4223 ,  C08J5/10 ,  C08J5/18 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  C08L67/03 ,  H01F17/0006 ,  H01F27/323 ,  H01F27/327 ,  H01F2017/048 ,  H01L23/49894 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/4626 ,  H05K3/4676 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09672 ,  Y10T428/2971 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/18 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides electronic parts which comprise a composite dielectric layer composed of an organic insulating material and a dielectric ceramic powder having a larger relative dielectric constant than the organic insulating material, and which also comprise conductive element sections forming inductor elements, etc., wherein the organic insulating material comprises a cured resin obtained by curing reaction of an epoxy resin with an active ester compound obtained by reaction between a compound with two or more carboxyl groups and a compound with a phenolic hydroxyl group. The dielectric ceramic powders of the described electronic parts have larger relative dielectric constants than the organic insulating materials, and the organic insulating materials have low dielectric loss tangents. It is possible to adequately reduce time-dependent dielectric constant changes in the high-frequency range of 100 MHz and above even with prolonged use at high temperatures of 100° C. and higher, while it is also possible to satisfactorily prevent deformation and other damage to the electronic parts during their handling.

摘要翻译： 本发明提供的电子部件包括由有机绝缘材料构成的复合电介质层和具有比有机绝缘材料更大的相对介电常数的介电陶瓷粉末，并且还包括形成电感元件的导电元件等，其中， 有机绝缘材料包括通过使环氧树脂与通过具有两个或更多个羧基的化合物和具有酚羟基的化合物之间的反应获得的活性酯化合物的反应固化而获得的固化树脂。 所述电子部件的介电陶瓷粉末具有比有机绝缘材料更大的相对介电常数，有机绝缘材料具有低的介电损耗角正切。 即使长时间在100℃以上的高温下使用也可以充分降低100MHz以上的高频范围的时间依赖介电常数的变化，同时也可以令人满意地防止变形等损伤 在处理电子零件时。

公开(公告)号：US20070231581A1

公开(公告)日：2007-10-04

申请号：US11732319

申请日：2007-04-03

申请人： Pui-Yan Lin ,  Govindasamy Rajendran ,  George Zahr

发明人： Pui-Yan Lin ,  Govindasamy Rajendran ,  George Zahr

IPC分类号： B32B27/38 ,  B32B15/092 ,  C08L63/00 ,  B32B27/18

CPC分类号： C08G59/4223 ,  C08G59/3218 ,  H05K3/4661 ,  H05K3/4676 ,  Y10T428/31511 ,  Y10T428/31529

摘要： Epoxy compositions that exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. The compositions are well-suited for use as dielectrics in electronics applications such as in multi-layer printed circuit boards, integrated circuit (IC) chip substrates, also known as IC chip carriers, and IC chip package interposers.

摘要翻译： 提供在固化状态下显示低粘度和固化状态下的低热膨胀系数的环氧组合物。 该组合物非常适合用作电子应用中的电介质，例如多层印刷电路板，也称为IC芯片载体的集成电路（IC）芯片基板和IC芯片封装内插器。