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公开(公告)号:US20200093495A1
公开(公告)日:2020-03-26
申请号:US16698561
申请日:2019-11-27
Applicant: MicroVention, Inc.
Inventor: Heath Bowman , Jake Le , Matthew Fitz
Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
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公开(公告)号:US10722242B2
公开(公告)日:2020-07-28
申请号:US16380917
申请日:2019-04-10
Applicant: MicroVention, Inc.
Inventor: Jake Le , Heath Bowman
Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
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公开(公告)号:US20250143715A1
公开(公告)日:2025-05-08
申请号:US18895322
申请日:2024-09-24
Applicant: MicroVention, Inc.
Inventor: Heath Bowman , Jake Le , Matthew Fitz
Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
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公开(公告)号:US20240423632A1
公开(公告)日:2024-12-26
申请号:US18755520
申请日:2024-06-26
Applicant: MicroVention, Inc.
Inventor: Jake Le , Heath Bowman
Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
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公开(公告)号:US12114864B2
公开(公告)日:2024-10-15
申请号:US17663368
申请日:2022-05-13
Applicant: MicroVention, Inc.
Inventor: Heath Bowman , Jake Le , Matthew Fitz
CPC classification number: A61B17/1214 , A61B17/12027 , A61B17/12099 , A61B17/12113 , A61B17/12122 , A61B17/12154 , A61F2/95 , A61M25/0021 , A61B2017/00119 , A61B2017/00477 , A61B2017/00734 , A61B2017/00867 , A61B2017/12054 , A61B2017/12068 , A61B2017/12072 , A61B2017/12077 , A61B2017/1209 , A61B2017/4233 , A61B2090/3966 , A61F2002/9505 , A61M2025/0042
Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
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公开(公告)号:US20220273314A1
公开(公告)日:2022-09-01
申请号:US17663781
申请日:2022-05-17
Applicant: MicroVention, Inc.
Inventor: Jake Le , Heath Bowman
IPC: A61B17/12
Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
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公开(公告)号:US11337708B2
公开(公告)日:2022-05-24
申请号:US16905457
申请日:2020-06-18
Applicant: MicroVention, Inc.
Inventor: Jake Le , Heath Bowman
Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
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公开(公告)号:US20200315630A1
公开(公告)日:2020-10-08
申请号:US16905457
申请日:2020-06-18
Applicant: MicroVention, Inc.
Inventor: Jake Le , Heath Bowman
IPC: A61B17/12
Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
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公开(公告)号:US10517604B2
公开(公告)日:2019-12-31
申请号:US15386492
申请日:2016-12-21
Applicant: MicroVention, Inc.
Inventor: Heath Bowman , Jake Le , Matthew Fitz
Abstract: A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.
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公开(公告)号:US12048438B2
公开(公告)日:2024-07-30
申请号:US17663781
申请日:2022-05-17
Applicant: MicroVention, Inc.
Inventor: Jake Le , Heath Bowman
CPC classification number: A61B17/12145 , A61B17/12109 , A61B17/12113 , A61B17/12122 , A61B17/12172 , A61B2017/00526 , A61B2017/00592 , A61B2017/00867 , A61B2017/4233
Abstract: An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
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