公开(公告)号：US20230260938A1

公开(公告)日：2023-08-17

申请号：US18141621

申请日：2023-05-01

Applicant: Microchip Technology Incorporated

Inventor： Justin Sato ,  Bony Chen ,  Yaojian Leng ,  Gerald Marsico ,  Julius Kovats

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/08 ,  H01L24/89 ,  H01L2224/0361 ,  H01L2224/05557 ,  H01L2224/05578 ,  H01L2224/05639 ,  H01L2224/05724 ,  H01L2224/05839 ,  H01L2224/08225 ,  H01L2224/80895

Abstract: An integrated circuit device may include a multi-material toothed bond pad including (a) an array of vertically-extending teeth formed from a first material, e.g., aluminum, and (b) a fill material, e.g., silver, at least partially filling voids between the array of teeth. The teeth may be formed by depositing and etching aluminum or other suitable material, and the fill material may be deposited over the array of teeth and extending down into the voids between the teeth, and etched to expose top surfaces of the teeth. The array of teeth may collectively define an abrasive structure. The multi-material toothed bond pad may be bonded to another bond pad, e.g., using an ultrasonic or thermosonic bonding process, during which the abrasive teeth may abrade, break, or remove unwanted native oxide layers formed on the respective bond pad surfaces, to thereby create a direct and/or eutectic bonding between the bond pads.

公开(公告)号：US12205910B2

公开(公告)日：2025-01-21

申请号：US18141621

申请日：2023-05-01

Applicant: Microchip Technology Incorporated

Inventor： Justin Sato ,  Bomy Chen ,  Yaojian Leng ,  Gerald Marsico ,  Julius Kovats

IPC: H01L21/60 ,  H01L23/00

Abstract: An integrated circuit device may include a multi-material toothed bond pad including (a) an array of vertically-extending teeth formed from a first material, e.g., aluminum, and (b) a fill material, e.g., silver, at least partially filling voids between the array of teeth. The teeth may be formed by depositing and etching aluminum or other suitable material, and the fill material may be deposited over the array of teeth and extending down into the voids between the teeth, and etched to expose top surfaces of the teeth. The array of teeth may collectively define an abrasive structure. The multi-material toothed bond pad may be bonded to another bond pad, e.g., using an ultrasonic or thermosonic bonding process, during which the abrasive teeth may abrade, break, or remove unwanted native oxide layers formed on the respective bond pad surfaces, to thereby create a direct and/or eutectic bonding between the bond pads.

公开(公告)号：US11682641B2

公开(公告)日：2023-06-20

申请号：US17163645

申请日：2021-02-01

Applicant: Microchip Technology Incorporated

Inventor： Justin Sato ,  Bomy Chen ,  Yaojian Leng ,  Gerald Marsico ,  Julius Kovats

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/08 ,  H01L24/89 ,  H01L2224/0361 ,  H01L2224/05557 ,  H01L2224/05578 ,  H01L2224/05639 ,  H01L2224/05724 ,  H01L2224/05839 ,  H01L2224/08225 ,  H01L2224/80895

Abstract: An integrated circuit device may include a multi-material toothed bond pad including (a) an array of vertically-extending teeth formed from a first material, e.g., aluminum, and (b) a fill material, e.g., silver, at least partially filling voids between the array of teeth. The teeth may be formed by depositing and etching aluminum or other suitable material, and the fill material may be deposited over the array of teeth and extending down into the voids between the teeth, and etched to expose top surfaces of the teeth. The array of teeth may collectively define an abrasive structure. The multi-material toothed bond pad may be bonded to another bond pad, e.g., using an ultrasonic or thermosonic bonding process, during which the abrasive teeth may abrade, break, or remove unwanted native oxide layers formed on the respective bond pad surfaces, to thereby create a direct and/or eutectic bonding between the bond pads.