公开(公告)号：US20240145457A1

公开(公告)日：2024-05-02

申请号：US18050099

申请日：2022-10-27

Applicant: Micron Technology, Inc.

Inventor： Faxing CHE ,  Yeow Chon ONG ,  Wei YU ,  Ling PAN

IPC: H01L25/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L25/18 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/50 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/73204

Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a controller, a first mold compound surrounding the controller, a plurality of semiconductor dies, a second mold compound surrounding the plurality of semiconductor dies, and one or more through-mold interconnects electrically coupling the controller to the plurality of semiconductor dies.