SUBSTRATE LOADING SYSTEM
    1.
    发明申请

    公开(公告)号:US20200098596A1

    公开(公告)日:2020-03-26

    申请号:US16677919

    申请日:2019-11-08

    Abstract: Methods, systems, and apparatus for a substrate transfer method, including positioning a tray handler device in a first position with i) cutouts of an aperture of the first tray in superimposition with respective pedestals of a pedestal platform and ii) a distal end of the pedestals extending away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the aperture of the first tray, while concurrently engaging the second tray handler with the second tray; and increasing a distance between the top surface of the second tray and the bottom surface of a chuck to transfer a second substrate from the chuck to the tabs defined by the second tray.

    Optical Polymer Films and Methods for Casting the Same

    公开(公告)号:US20180264691A1

    公开(公告)日:2018-09-20

    申请号:US15922499

    申请日:2018-03-15

    Abstract: An example system is configured to photocure a photocurable material to form a polymer film. The system includes a first chuck configured to support a first substantially planar mold, a second chuck configured to support a second substantially planar mold, and an actuable stage coupled to the first chuck and/or the second chuck. The actuable stage is configured to position the first chuck and/or the second chuck so that the first and second molds are separated by a gap. The system also includes a sensor arrangement for obtaining measurement information indicative of a distance between the first and second molds and/or a pressure between the first and second chucks at each of at least three locations. The system also includes a control module configured control the gap between the first and second molds based on the measurement information.

    Substrate loading system
    4.
    发明授权

    公开(公告)号:US11195739B2

    公开(公告)日:2021-12-07

    申请号:US16677919

    申请日:2019-11-08

    Abstract: Methods, systems, and apparatus for a substrate transfer method, including positioning a tray handler device in a first position with i) cutouts of an aperture of the first tray in superimposition with respective pedestals of a pedestal platform and ii) a distal end of the pedestals extending away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the aperture of the first tray, while concurrently engaging the second tray handler with the second tray; and increasing a distance between the top surface of the second tray and the bottom surface of a chuck to transfer a second substrate from the chuck to the tabs defined by the second tray.

    POSITIONING SUBSTRATES IN IMPRINT LITHOGRAPHY PROCESSES

    公开(公告)号:US20210173317A1

    公开(公告)日:2021-06-10

    申请号:US17181242

    申请日:2021-02-22

    Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.

    POSITIONING SUBSTRATES IN IMPRINT LITHOGRAPHY PROCESSES

    公开(公告)号:US20180113390A1

    公开(公告)日:2018-04-26

    申请号:US15699831

    申请日:2017-09-08

    CPC classification number: G03F9/7042 G03F7/0002 G03F7/707 G03F7/70775

    Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.

    Positioning substrates in imprint lithography processes

    公开(公告)号:US11846890B2

    公开(公告)日:2023-12-19

    申请号:US18159912

    申请日:2023-01-26

    CPC classification number: G03F9/7042 G03F7/0002 G03F7/707 G03F7/70775

    Abstract: An imprint lithography system includes: a first chuck configured to support a first substrate; a first bushing surrounding the first chuck and configured to pneumatically suspend the first chuck laterally within the first bushing; one or more supportive mechanisms disposed beneath the first chuck and configured to support the first chuck vertically within the first bushing, wherein the first chuck is configured to be forced in a downward direction against first vertical resistive forces provided by the one or more supportive mechanisms, while the first chuck is suspended laterally within the first bushing and while the first chuck is maintained in the first fixed rotational orientation.

    POSITIONING SUBSTRATES IN IMPRINT LITHOGRAPHY PROCESSES

    公开(公告)号:US20230176493A1

    公开(公告)日:2023-06-08

    申请号:US18159912

    申请日:2023-01-26

    CPC classification number: G03F9/7042 G03F7/0002 G03F7/707 G03F7/70775

    Abstract: An imprint lithography system includes: a first chuck configured to support a first substrate; a first bushing surrounding the first chuck and configured to pneumatically suspend the first chuck laterally within the first bushing; one or more supportive mechanisms disposed beneath the first chuck and configured to support the first chuck vertically within the first bushing, wherein the first chuck is configured to be forced in a downward direction against first vertical resistive forces provided by the one or more supportive mechanisms, while the first chuck is suspended laterally within the first bushing and while the first chuck is maintained in the first fixed rotational orientation.

    Positioning substrates in imprint lithography processes

    公开(公告)号:US11567418B2

    公开(公告)日:2023-01-31

    申请号:US17181242

    申请日:2021-02-22

    Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.

    Positioning substrates in imprint lithography processes

    公开(公告)号:US10928744B2

    公开(公告)日:2021-02-23

    申请号:US15699831

    申请日:2017-09-08

    Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.

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