公开(公告)号：US11622442B2

公开(公告)日：2023-04-04

申请号：US17109182

申请日：2020-12-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Daisuke Tonaru

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H01L23/00 ,  H05K3/28 ,  H05K3/34 ,  H05K1/18 ,  H05K1/03

Abstract: A circuit member joint structure includes a first circuit member including a first main surface on which a first mounting electrode is provided, a second circuit member including a second main surface on which a second mounting electrode is provided, a conductive joining material with which the first mounting electrode and the second mounting electrode are joined to each other, and an insulating joining material with which an end portion of the first circuit member and an end portion of the second circuit member are joined to each other. The first circuit member includes a first recess on the first main surface and spaced away from the first mounting electrode, and at least a portion of the insulating joining material is disposed in the first recess.

公开(公告)号：US10993329B2

公开(公告)日：2021-04-27

申请号：US16910226

申请日：2020-06-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui ,  Daisuke Tonaru ,  Hideyuki Taguchi ,  Genro Kato

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K1/18

Abstract: A first board includes a first insulating substrate including a first main surface, a first electrode pad, and a first resist film. The first electrode pad is a conductor pattern provided on the first main surface. The first resist film is provided on the first main surface and is located closer to the first electrode pad than any conductor provided on the first main surface. The first resist film is spaced away from the first electrode pad with a gap provided between the first resist film and the first electrode pad. The first resist film is thicker than the first electrode pad.