公开(公告)号：US20230049072A1

公开(公告)日：2023-02-16

申请号：US17974322

申请日：2022-10-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi INOUE ,  Shozo OTERA ,  Yutaka ISHIURA ,  Jun ENDO ,  Yoshihiko NISHIZAWA

IPC: H01L41/08 ,  H01L41/047

Abstract: A substrate that includes a film-shaped member that has a first main surface and a second main surface; a first electrode that has a third main surface and a fourth main surface, the third main surface facing the second main surface of the film-shaped member, the first electrode having a first patterning region with a first part where the film-shaped member is exposed from the first electrode and a second part where the film-shaped member is not exposed from the first electrode; and an adhesive tape facing the fourth main surface of the first electrode and the second main surface of the film-shaped member such that the adhesive tape is disposed across the first part and the second part in the first patterning region.

公开(公告)号：US20180247766A1

公开(公告)日：2018-08-30

申请号：US15904804

申请日：2018-02-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaki FUKUDA ,  Yuji FUKADA ,  Jinya FURUI ,  Takashi INOUE ,  Takashi YAMAMOTO

IPC: H01G2/06 ,  H01G4/12 ,  H01G4/01 ,  H01G4/228

CPC classification number: H01G2/065 ,  H01C1/142 ,  H01C1/144 ,  H01C7/003 ,  H01C7/008 ,  H01C17/283 ,  H01G4/008 ,  H01G4/01 ,  H01G4/1218 ,  H01G4/1227 ,  H01G4/1272 ,  H01G4/224 ,  H01G4/228 ,  H01G4/236 ,  H01G4/248

Abstract: A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode, a second metal terminal connected to the second external electrode, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. Upper and lower surfaces of the exterior material are flat or substantially flat.

公开(公告)号：US20180247765A1

公开(公告)日：2018-08-30

申请号：US15904802

申请日：2018-02-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi YAMAMOTO ,  Jinya FURUI ,  Takashi INOUE ,  Yuji FUKADA ,  Masaki FUKUDA

IPC: H01G2/06 ,  H01G4/12 ,  H01G4/01

CPC classification number: H01G2/065 ,  H01C1/142 ,  H01C1/144 ,  H01C7/003 ,  H01C7/008 ,  H01C17/283 ,  H01G4/008 ,  H01G4/01 ,  H01G4/1218 ,  H01G4/1227 ,  H01G4/1272 ,  H01G4/224 ,  H01G4/236 ,  H01G4/248

Abstract: A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode by solder, a second metal terminal connected to the second external electrode by the solder, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. The solder satisfies a relational expression: element diameter D (mm)×about 0.003 mm≤solder cross-sectional area S (mm2)≤element diameter D (mm)×about 0.02 mm.